Patents by Inventor Dong Whan Cho

Dong Whan Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with heat spreader and semiconductor package therewith
    Patent number: 6239487
    Abstract: A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim portion adapted to be attached to ends of the inner portions of the leads and a projecting portion that projects between the ends of the inner portions of the leads such that an upper surface of the projecting portion is in approximately the same plane as an upper surface of the inner portions of the leads. An insulative adhesive may be used to attach the ends of the inner portions of the leads to the rim portion of the heat spreader. Also, insulation members may be attached to upper surfaces of the ends of the inner portions of the leads for receiving a large size chip.
    Type: Grant
    Filed: December 30, 1998
    Date of Patent: May 29, 2001
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Hee Jin Park, Dong Whan Cho, Soo Heon Kim, Jung Gun Park