Patents by Inventor Dong-Whan KO

Dong-Whan KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating semiconductor device that includes forming passivation film along side wall of via hole
    Patent number: 8993436
    Abstract: A method for fabricating a semiconductor device includes sequentially forming an etch stop film and an insulating film on a substrate including a lower pattern forming a conductive mask pattern including a first opening on the insulating film, forming a via-hole in the insulating film using the conductive mask pattern as an etch mask, the via-hole exposing the etch stop film, removing the conductive mask pattern, and forming a passivation film along a side wall of the via-hole after removing the conductive mask pattern.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: March 31, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Whan Ko, Jong-Sam Kim, Hong-Jae Shin, Seung-Il Bok, Sae-Il Son, Woo-Jin Jang
  • METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    Publication number: 20140308810
    Abstract: A method for fabricating a semiconductor device includes sequentially forming an etch stop film and an insulating film on a substrate including a lower pattern forming a conductive mask pattern including a first opening on the insulating film, forming a via-hole in the insulating film using the conductive mask pattern as an etch mask, the via-hole exposing the etch stop film, removing the conductive mask pattern, and forming a passivation film along a side wall of the via-hole after removing the conductive mask pattern.
    Type: Application
    Filed: March 6, 2014
    Publication date: October 16, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Whan KO, Jong-Sam KIM, Hong-Jae SHIN, Seung-Il BOK, Sae-Il SON, Woo-Jin JANG