Patents by Inventor Dong-Woo Ryu

Dong-Woo Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969397
    Abstract: The present invention relates to a composition for preventing or treating transplantation rejection or a transplantation rejection disease, comprising a novel compound and a calcineurin inhibitor. A co-administration of the present invention 1) reduces the activity of pathogenic Th1 cells or Th17 cells, 2) increases the activity of Treg cells, 3) has an inhibitory effect against side effects, such as tissue damage, occurring in the sole administration thereof, 4) inhibits various pathogenic pathways, 5) inhibits the cell death of inflammatory cells, and 6) increases the activity of mitochondria, in an in vivo or in vitro allogenic model, a transplantation rejection disease model, a skin transplantation model, and a liver-transplanted patient, and thus inhibits transplantation rejection along with mitigating side effects possibly occurring in the administration of a conventional immunosuppressant alone.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: April 30, 2024
    Assignee: THE CATHOLIC UNIVERSITY OF KOREA INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Mi-La Cho, Dong-Yun Shin, Jong-Young Choi, Chul-Woo Yang, Sung-Hwan Park, Seon-Yeong Lee, Min-Jung Park, Joo-Yeon Jhun, Se-Young Kim, Hyeon-Beom Seo, Jae-Yoon Ryu, Keun-Hyung Cho
  • Patent number: 11961797
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Patent number: 11959202
    Abstract: Provided are an apparatus for manufacturing a textile grid with increased adhesion and a method thereof capable of integrating the textile grid with a concrete structure by increasing the adhesion of the textile grid when the concrete structure is built, repaired, or reinforced, increasing structural safety and durability of the concrete structure, increasing a working speed by coating a surface of the textile grid with an abrasive material powder that is a surface coating material in an automatic series of processes immediately after the textile grid is manufactured, and increasing coating performance by automatically inspecting and adjusting the amount of the coating material applied to the surface of the textile grid using a camera.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 16, 2024
    Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Hyeong Yeol Kim, Kyung Taek Koh, Gum Sung Ryu, Gi Hong An, Dong Woo Seo, Seung Seop Jin
  • Patent number: 11645799
    Abstract: Provided is a seismic vulnerability analysis system of a user's living space. The system includes: an image receiving unit configured to receive image information obtained by photographing a living space, where various things are disposed, through a camera; an image signal processing unit configured to recognize the thing photographed in the image information as an object, extract a position and size of the object in a three-dimensional space, and convert the extracted position and size into spatial information; and an earthquake simulation unit configured to simulate motion phenomena of the objects in the space when an earthquake occurs according to simulated seismic conditions based on the spatial information.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: May 9, 2023
    Assignee: KOREA INSTITUTE OF GEOSCIENCE AND MINERAL RESOURCES
    Inventors: Jihoe Kwon, Weon-Seo Kee, Dong-Woo Ryu, Joong-Ho Synn, Sangho Lee
  • Publication number: 20210199828
    Abstract: Provided is a seismic vulnerability analysis system of a user's living space. The system includes: an image receiving unit configured to receive image information obtained by photographing a living space, where various things are disposed, through a camera; an image signal processing unit configured to recognize the thing photographed in the image information as an object, extract a position and size of the object in a three-dimensional space, and convert the extracted position and size into spatial information; and an earthquake simulation unit configured to simulate motion phenomena of the objects in the space when an earthquake occurs according to simulated seismic conditions based on the spatial information.
    Type: Application
    Filed: March 12, 2021
    Publication date: July 1, 2021
    Inventors: Jihoe KWON, Weon-Seo KEE, Dong-Woo RYU, Joong-Ho SYNN, Sangho LEE
  • Publication number: 20180209787
    Abstract: Provided is an underground environment change detection method including: repeatedly sensing an AC signal propagated through an underground in a magnetic induction manner; and monitoring an underground environment change from a change in the AC signal.
    Type: Application
    Filed: October 19, 2015
    Publication date: July 26, 2018
    Inventors: Dong-Woo RYU, Eunhee KIM, Kisong LEE, Byoung-Woo YUM, Inhwan Lee, Jaehum LEE, Sueng Won JEONG, Hong-Jin LEE, Byeongju JUNG, Eun Seok BANG, Wonkyu CHOI
  • Patent number: 8082105
    Abstract: Disclosed is a method and apparatus for measuring in-situ stress in rock using a thermal crack. The method involves forming a borehole, cooling a wall of the borehole, applying tensile thermal stress, forming a crack in the borehole wall, and measuring temperature and cracking point. Afterwards, the borehole wall is heated to close the formed crack, the borehole wall is cooled again to re-open the crack, and temperature is measured when the crack is re-opened. The in-situ stress of the rock is calculated using a first cracking temperature at which the crack is formed and a second cracking temperature at which the crack is re-opened. Further, the apparatus cools, heats and re-cools the borehole wall, thereby measuring the first cracking temperature, the second cracking temperature, and the cracking point.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: December 20, 2011
    Assignee: Korea Institute of Geoscience and Mineral Resources (KIGAM)
    Inventors: Chang-Ha Ryu, Dong-Woo Ryu, Byung-Hee Choi, Loui Porathur John, Jung-Ho Synn
  • Publication number: 20090070043
    Abstract: Disclosed is a method and apparatus for measuring in-situ stress in rock using a thermal crack. The method involves forming a borehole, cooling a wall of the borehole, applying tensile thermal stress, forming a crack in the borehole wall, and measuring temperature and cracking point. Afterwards, the borehole wall is heated to close the formed crack, the borehole wall is cooled again to re-open the crack, and temperature is measured when the crack is re-opened. The in-situ stress of the rock is calculated using a first cracking temperature at which the crack is formed and a second cracking temperature at which the crack is re-opened. Further, the apparatus cools, heats and re-cools the borehole wall, thereby measuring the first cracking temperature, the second cracking temperature, and the cracking point.
    Type: Application
    Filed: October 30, 2007
    Publication date: March 12, 2009
    Inventors: Chang-Ha Ryu, Dong-Woo Ryu, Byung-Hee Choi, Loui Porathur John, Joong-Ho Synn