Patents by Inventor Dong-Wook CHU

Dong-Wook CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal compound composition containing Cu—CuO composite filler
    Patent number: 9920231
    Abstract: Provided is a thermal compound composition having heat dissipation and electrical insulation properties, where the thermal compound composition includes a Cu—CuO composite filler having a Cu core and a shell composed of CuO having a whisker crystal structure. The CuO having the whisker crystal structure is prepared by reacting Cu particles in a basic solution so that an outer shell thereof is grown into whisker-shaped CuO.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: March 20, 2018
    Assignee: YOUNGYIEL PRECISION CO., LTD.
    Inventors: Dong-Wook Chu, Jae-Uk Chu, Dong-Woo Lee, Chang-Hyun Um
  • THERMAL COMPOUND COMPOSITION CONTAINING Cu-CuO COMPOSITE FILLER
    Publication number: 20170292052
    Abstract: Provided is a thermal compound composition having heat dissipation and electrical insulation properties, where the thermal compound composition includes a Cu—CuO composite filler having a Cu core and a shell composed of CuO having a whisker crystal structure. The CuO having the whisker crystal structure is prepared by reacting Cu particles in a basic solution so that an outer shell thereof is grown into whisker-shaped CuO.
    Type: Application
    Filed: March 14, 2017
    Publication date: October 12, 2017
    Inventors: Dong-Wook CHU, Jae-Uk CHU, Dong-Woo LEE, Chang-Hyun UM