Abstract: Disclosed herein is an apparatus for measuring physical properties of hairpin coils, which includes a current sensor configured to apply a current for each frequency to a material of a hairpin coil to measure an induced current applied to the material, and a measurement processor configured to measure physical properties of the material by measuring an impedance of the material with the induced current measured by the current sensor and applying the impedance to a model established in the material.

Abstract: A method for analysis of residual lithium compounds in a positive electrode active material for a lithium secondary battery comprises the steps of: analyzing a sample of a positive electrode active material using an oxygen/nitrogen/hydrogen analyzer (ONH analyzer) and a Karl Fischer analyzer to determine the amount of the H component; analyzing the sample using a carbon/sulfur analyzer (CS analyzer) to determine the amount of the C component and the S component; analyzing the sample using an inductively coupled plasma optical emission spectrometer (ICP-OES) to determine the amount of the Li component; and calculating the amount of each of LiOH, Li2CO3, and Li2SO4 in the sample using the quantification results of the H, C, and S components, and calculating the amount of Li2O in the sample using the quantification result of the Li component.

Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.

Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.

Abstract: A video decoding method and a video decoding apparatus are configured to decode video. To efficiently code residual blocks obtained from block-based motion compensation, a video encoding apparatus and the video decoding apparatus divide a relevant residual block of a current block into two subblocks in a horizontal or vertical direction and encode one residual subblock alone out of the two residual subblocks.

Abstract: Disclosed is a 5G NR antenna device. An antenna module includes an antenna material formed of a metal material and having a semi-planar inverted-F antenna (PIFA) structure, and a support formed in the shape of a hexahedron with side and bottom faces that are bent from the antenna material by stamping, wherein the support and the antenna material are formed as an integral body.

Abstract: A method of transmitting a Physical Layer Convergence Procedure (PLCP) frame in a Very High Throughput (VHT) Wireless Local Area Network (WLAN) system includes generating a MAC Protocol Data Unit (MPDU) to be transmitted to a destination station (STA), generating a PLCP Protocol Data Unit (PPDU) by adding a PLCP header, including an L-SIG field containing control information for a legacy STA and a VHT-SIG field containing control information for a VHT STA, to the MPDU, and transmitting the PPDU to the destination STA. A constellation applied to some of Orthogonal Frequency Division Multiplex (OFDM) symbols of the VHT-SIG field is obtained by rotating a constellation applied to an OFDM symbol of the L-SIGfield.

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

Abstract: Disclosed herein are an apparatus and method for automatic parking based on recognition of a parking area environment. The method may include searching for an available parking space, determining whether reverse parking is possible by recognizing the environment of the available parking space, recognizing at least one additional vehicle located in the vicinity of the available parking space, and setting a parking destination based on the determination of whether reverse parking is possible and the result of recognition of the at least one additional vehicle.

Abstract: A method for changing a route when an error occurs in an autonomous driving AI includes collecting error information of the AI when an error of the AI has occurred, extracting, from a storage, past error information about a same kind of AI as that of the AI based on the error information of the AI, generating an error analysis result based on the past error information, generating an error analysis result message based on the error analysis result, and determining whether the driving of the autonomous driving vehicle needs to be stopped based on the error analysis result message.

Abstract: A display device is disclosed that includes a pixel. The pixel includes a first transistor connected between a second node and a third node and including a gate electrode connected to a first node. A first capacitor is formed between the first node and a fourth node. A second capacitor is formed between the fourth node and a first power line. A second transistor is connected between a data line and the fourth node. An eighth transistor is connected between the first power line and the second node. A ninth transistor is connected between the second node and a bias power line. A sixth transistor is connected between the third node and a fifth node. A light emitting element is electrically connected between the fifth node and a second power line. A gate electrode of the eighth transistor and a gate electrode of the sixth transistor are connected to different gate lines.

Abstract: An inverse quantization method is implemented by an inverse quantization device, the method configured for acquiring quantized coefficients, estimating a quantization parameter in quantization groups or quantization parameter prediction group units, generating an inverse quantization matrix for adaptive quantization, and generating transform coefficients from the quantized coefficients using the quantization parameter and the inverse quantization matrix.

Abstract: An inverse quantization method is implemented by an inverse quantization device, the method configured for acquiring quantized coefficients, estimating a quantization parameter in quantization groups or quantization parameter prediction group units, generating an inverse quantization matrix for adaptive quantization, and generating transform coefficients from the quantized coefficients using the quantization parameter and the inverse quantization matrix.

Abstract: An inverse quantization method is implemented by an inverse quantization device, the method configured for acquiring quantized coefficients, estimating a quantization parameter in quantization groups or quantization parameter prediction group units, generating an inverse quantization matrix for adaptive quantization, and generating transform coefficients from the quantized coefficients using the quantization parameter and the inverse quantization matrix.

Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.

Abstract: A collision safety control system includes a memory storing a collision safety model having a deep learning-based collision safety control logic. The collision safety control system also includes a processor electrically connected to the memory. The processor is configured to, in accordance with the collision safety control logic, train, based on at least one signal including pre-collision data and post-collision data, the collision safety model such that the collision safety model outputs a collision type and a required time-to-fire (RTTF) of passenger protection equipment corresponding to the at least one signal.

Abstract: A semiconductor memory device and a method of operating the semiconductor memory device are provided. The semiconductor memory device includes a memory block including a plurality of sub-blocks, a peripheral circuit configured to perform a program operation on the memory block, and control logic configured to control the peripheral circuit to perform the program operation on the memory block, wherein the program operation comprises programming to program normal data to a first sub-block, allocated to be a normal sub-block, among the plurality of sub-blocks, and programming parity data of the normal data to a second sub-block, allocated to be a backup block, among the plurality of sub-blocks.

Abstract: Disclosed is a ship cleaning robot, in which a first caterpillar module and a second caterpillar module are symmetrically rotated almost equally in a vertical direction in a rear horizontal body through a stabilizer, and thus the rear horizontal body also resists external force and inhibit separation from the outer wall as the symmetry is broken when one of the first caterpillar module and the second caterpillar module is separated from the outer wall by the external force, thereby having advantages of maintaining close contact with the outer surface of a ship.

Abstract: An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.

Abstract: A method includes generating a first control signal and a second control signal; blending the first control signal and the second control signal based, at least in part, on a velocity; and positioning a read/write head based on the blending of the first control signal and the second control signal.