Abstract: The present disclosure provides a liquid cooling system for dissipating heat from a heat source, including a liquid cooling module and a liquid leakage detecting module. The liquid cooling module includes a liquid cooling component. The liquid cooling component includes a liquid cooling plate, a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline and the liquid return pipeline are in communication with the liquid cooling plate receptively. The liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches. The liquid leakage detection branches are electrically connected to the hub in parallel, and are provided in the liquid supply pipeline and the liquid return pipeline respectively. The main wire electrically connects the hub to the monitoring device.

Abstract: A contact structure includes a cavity comprising a device contact formed on a surface of a substrate, a bottom surface, and sidewalls. A metal silicide layer disposed over the surface of the device contact, the bottom surface, and the sidewalls of the cavity, and a treated surface formed over a portion of the metal silicide layer disposed over the sidewalls of the cavity.

Abstract: In an antenna design, a metal frame of an electronic device and a printed circuit board (PCB) form a slot antenna radiator, where two common mode (CM) slot antenna modes of the slot antenna radiator are excited through anti-symmetrical feeding, so that when dual resonances and wideband coverage are implemented, specific absorption ratio (SAR) values in the two CM slot antenna modes are close.

Abstract: The present disclosure provides a cooling device, including a cooling plate and a mounting cover. A lower flow channel is provided in the cooling plate, a top of the cooling plate is provided with a water outlet and two openings. The water outlet is located between the two openings. The mounting cover is sealed on the top of the cooling plate. The mounting cover comprises a first mounting cover and a second mounting cover. The first mounting cover and the cooling plate form an intermediate flow channel, the second mounting cover and the cooling plate form a branch flow channel. The intermediate flow channel is in communication with the two branch flow channels, The first mounting cover is provided with a water inlet, and the two branch flow channels are in communication with the lower flow channel through the two openings.

Abstract: In one embodiment, a method includes receiving identities of features of a first composition, and receiving a value of a property of the first composition. A learning model is trained using values of predefined characteristics of the features of the first composition, and the value of the property of the first composition. The learning model is then provided identities of second features of a second composition. Using the learning model, a value of a property of the second composition is determined and displayed.

Abstract: The present application relates to a positive electrode active material comprising a first positive electrode active material, which comprises a substrate of formula (I), wherein the substrate is doped with an element M1: LiA1[NiX1CoY1MnZ1]O2 (I); and a second positive electrode active material, which comprises a substrate of formula (II), wherein the substrate is doped with an element M2: LiA2[NiX2CoY2MnZ2]O2 (II); the average particle size Dv50 of the first positive electrode active material is greater than that of the second positive electrode active material, wherein 0<X2?X1?0.4, and optionally 0<X2?X1?0.1. The present application further relates to a method for preparing the positive electrode active material, a secondary battery, and a power consuming device.

Abstract: A display substrate, including a plurality of gate lines and a plurality of data lines defining a plurality of pixel regions, where the plurality of pixel regions include a plurality of normal pixel regions and a plurality of redundant pixel regions at a periphery of the normal pixel regions; where each normal pixel region is provided with a first pixel electrode and a first transistor, each redundant pixel region is provided with a second pixel electrode and a second transistor, a gate of the first transistor is connected to a corresponding gate line, a source of the first transistor is connected to a corresponding data line, and a drain of the first transistor is connected to the first pixel electrode; and the second pixel electrode and the second transistor are insulated and spaced apart from each other.

Abstract: In one example, a peripheral circuit in a die is configured to: first, receive control commands, and generate indication information according to the control commands, the control commands being used for indicating the die to determine the address of the die, the indication information being used for indicating M dies to share the same enable pin, M being a positive integer greater than or equal to 1; and then, determine the address of the die according to the indication information, and send the address of the die, the address being used for addressing an enable signal provided by the enable pin.

Abstract: The present invention discloses a highly reliable positive-to-negative voltage conversion circuit, including a first inverter, a first buffer, a second buffer, a first to seventh NMOS transistors, a first to third PMOS transistors, a first resistor, a second resistor, a third resistor, and a fourth resistor, wherein the third PMOS transistor, the third NMOS transistor, the fourth NMOS transistor, the fifth NMOS transistor, the sixth NMOS transistor and the seventh NMOS transistor form an on/off control circuit, with that a power supply path between a positive-voltage power supply terminal and a negative-voltage power supply terminal is physically isolated by the on/off control circuit to eliminate voltage reversing occurring when the positive-voltage power supply terminal and the negative-voltage power supply terminal cannot be synchronized during power-on.

Abstract: The present disclosure provides data processing methods and apparatuses, an electronic device and a storage medium. The method includes: obtaining a product sample set; obtaining combination features in specified dimensions of the product sample set by processing a second parameter based on a preset dimension reduction algorithm; obtaining influence scores respectively for the combination features in specified dimensions based on a first parameter and the combination features in specified dimensions; obtaining at least one combination feature ranked top by sorting the combination features based on the influence scores, and taking a raw parameter corresponding to the at least one combination feature as a cause of the product defect.

Abstract: A method and system is provided in a simulation platform for optimizing the extrinsic parameters of fisheye-lens cameras installed on a vehicle. A simulated vehicle is established according to vehicular characteristics of associated actual vehicle over the simulated platform, thereby a lot of simulated checkerboard calibration plates are placed surrounding the simulated vehicle. A lot of simulated fisheye-lens cameras are generated and mounted on the simulated vehicle based on intrinsic parameters associated with actual fisheye lenses, and fisheye images are derived by using the simulated fisheye-lens cameras, respectively. The initially extrinsic parameters of each of the simulated fisheye-lens cameras are calculated over the simulated platform by using the first characteristic points of its own first fisheye image.

Abstract: A liquid cooling device includes a base plate, a cooling body, and a cover plate. The cooling body includes a frame. A cooling layer is provided in the frame and a reflux layer is provided above the cooling layer. The cooling layer is provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame. The reflux layer is provided with a plurality of reflux channels in communication with the plurality of cooling channels. A periphery of the reflux layer is provided with a drainage flow channel in communication with the plurality of the reflux channels. A center portion of the cover plate being provided with a liquid inlet in communication with the plurality of cooling channels, and the cover plate is further provided with a liquid outlet in communication with the drainage flow channel.

Abstract: A gene sequencing reaction device, a gene sequencing system and a gene sequencing reaction method. The gene sequencing reaction device includes: a supporting platform; a dipping container disposed on the supporting platform, wherein the dipping container has a dipping reaction area, and the dipping reaction area is configured to hold a chemical reagent for gene sequencing reaction, so as to dip a sequencing chip having a DNA sample loading structure on the surface and having a DNA sample loaded thereon in the chemical reagent to perform a gene sequencing reaction; a temperature control apparatus, configured to control the temperature of the chemical reagent in the dipping reaction area; and a transfer apparatus, configured to insert the sequencing chip into the dipping reaction area or pull out the sequencing chip from the dipping reaction area.

Abstract: Embodiments of the disclosure include a method of forming a gate-all-around (GAA) contact structure on a semiconductor substrate. The method will include removing material from surfaces of a feature formed in a surface of a substrate that includes a plurality of features that each include a plurality of source/drain contact surfaces, selectively forming a reaction product material over a surface of each of the plurality of source/drain contact surfaces, heating the substrate to a first temperature to remove the reaction product material from the surface of each of the plurality of contacts, selectively forming a first metal layer on the surface of each of the plurality of contacts, selectively forming a second metal layer on the first metal layer, and filling the feature with a conductor material, wherein the conductor material comprises tungsten (W) or molybdenum (Mo).

Abstract: A display substrate, a manufacturing method therefor and a display device are provided. The display substrate includes pixel light emitting regions and pixel spacer regions between adjacent pixel light emitting regions; in a plane perpendicular to the display substrate, the display substrate includes a base substrate and a light emitting structure layer on the base substrate, the light emitting structure layer at least includes an anode, a pixel definition layer and at least one photo spacer, a pixel opening is provided in the pixel definition layer in each pixel light emitting region, the pixel opening exposes the anode, a spacer opening is provided in the pixel definition layer in the pixel spacer region, the photo spacer is provided in the spacer opening, and an orthographic projection of the photo spacer on the base substrate is within a range of an orthographic projection of the spacer opening on the base substrate.

Abstract: Disclosed is a bilayer bionic drug-loaded hydrogel, and preparation and application thereof. The hydrogel includes: an outer-layer hydrogel and an inner-layer hydrogel. The outer-layer hydrogel is prepared by: forming a polyvinyl alcohol hydrogel by directionally freezing a polyvinyl alcohol aqueous solution, soaking the polyvinyl alcohol aqueous solution in a sodium sulfate solution, and removing salt ions after soaking; and the inner-layer hydrogel is prepared by components of: a loaded drug, polyvinyl alcohol, chitosan, genipin, water, and a pH adjuster. The hydrogel of the present disclosure can be applied to deeply infected areas of wounds in open war wounds, and has protective, anti-inflammatory, haemostatic, reparative, anti-drug resistant bacterial effects, and other properties.

Abstract: Embodiments include a method of forming a contact structure on a semiconductor substrate. The method including selectively depositing a metal silicide layer over a contact formed within a cavity of a substrate and a bottom surface of the cavity using a selective deposition process, including forming a residual layer on a surface of a dielectric layer forming sidewalls of the cavity, wherein a thickness of the metal silicide layer deposited over the contact is greater than a thickness of the residual layer, removing at least a portion of the residual layer formed on the dielectric layer using an etching process that comprises exposing the metal selectively deposited layer to a metal halide containing precursor, and selectively depositing a metal fill over the metal silicide layer remaining over the contact after removing the at least the portion of the residual layer using a selective metal fill process.

Abstract: A battery pack cooling system includes at least a cooling fluid including a plurality of cooling fluid circulation pipelines and at least an electronic water pump, a refrigeration element, a heat exchange element, a thermal runaway sensing element, and a fluid diversion assembly. The electronic water pump is configured to be communicatively connected to a controller of a vehicle and is arranged on the pipelines. the refrigeration element communicates with the cooling fluid circulation pipelines. the heat exchange element communicates with the pipelines. The thermal runaway sensing element is configured to be communicatively connected to the controller. The fluid diversion assembly includes a fluid guide channel and a fluid diversion valve. The fluid diversion valve is set as a multi-way solenoid valve, and has at least two interfaces configured to communicate with the pipelines, and at least one interface communicating with one end of the fluid guide channel.

Abstract: Embodiments include a method of forming a contact structure on a semiconductor substrate. The method including selectively depositing a metal silicide layer over a contact formed within a cavity of a substrate and a bottom surface of the cavity using a selective deposition process, including forming a residual layer on a surface of a dielectric layer forming sidewalls of the cavity, wherein a thickness of the metal silicide layer deposited over the contact is greater than a thickness of the residual layer, removing at least a portion of the residual layer formed on the dielectric layer using an etching process that comprises exposing the metal selectively deposited layer to a metal halide containing precursor, and selectively depositing a metal fill over the metal silicide layer remaining over the contact after removing the at least the portion of the residual layer using a selective metal fill process.

Abstract: The electronic device includes a composite antenna including a slot antenna and a wire antenna. A first strip-shaped conductor of the slot antenna includes a first ground part, a second ground part, and a feeding part. The first ground part and the second ground part are respectively two ends of the first strip-shaped conductor. The feeding part is located between the first ground part and the second ground part. A second strip-shaped conductor of the wire antenna includes a first end and a second end. The first end of the second strip-shaped conductor is electrically connected to the first ground part. The second end of the second strip-shaped conductor is an open end.