Patents by Inventor Dongyeop Shin

Dongyeop Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077892
    Abstract: Provided is an invention capable of securing versatility and precision in admittance control and enabling target force control on a surface of an object having a different property, in which a mutual contact force-based compensation method is used in the existing admittance control method to output a target force. To this end, the present disclosure provides a compensation algorithm that changes according to a mutual contact force with an object having a different physical property and mass-spring-damper parameters using data acquired while controlling a force input from a robot is provided. In addition, the present disclosure automatically performs tuning on coefficients related to a factor of a robot force control based on data obtained by executing a mutual contact force-based compensation in the conventional admittance control.
    Type: Application
    Filed: March 16, 2023
    Publication date: March 7, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Wookyong KWON, Dongyeop KANG, Chan Eun PARK, Jaemin BAEK, Seungcheon SHIN
  • Publication number: 20230130234
    Abstract: A seal including a jacket including an annular body defining a central axis and a recess extending into the annular body concentric to the central axis, where the jacket includes at least 30 wt% of a PTFE and at least 10 wt% of a filler material, and where the filler material includes a boron-containing material, a nitrogen-containing material, a titanium-containing material, a silicon-containing material, a carbon fiber, a glass fiber, or a combination thereof, where the jacket further includes a coating; and an energizing element disposed in the recess.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 27, 2023
    Inventors: Ryan Morrow, Dongyeop Shin, Jean-Marie Lebrun, Bedros J. Taslakian
  • Publication number: 20210163798
    Abstract: Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the second polymer includes ethylene tetrafluoroethylene, and the third polymer includes a modified ethylene tetrafluoroethylene, ethylene tetrafluoroethylene hexafluoropropylene, or a combination thereof. In a particular embodiment, the first polymer can include an aromatic polymer. In another embodiment, the adhesive layer can have a tensile stress in an extrusion direction of at least 30 MPa.
    Type: Application
    Filed: February 10, 2021
    Publication date: June 3, 2021
    Inventors: Jing DONG, Nafih Mekhilef, Dongyeop Shin
  • Patent number: 10947427
    Abstract: Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the second polymer includes ethylene tetrafluoroethylene, and the third polymer includes a modified ethylene tetrafluoroethylene, ethylene tetrafluoroethylene hexafluoropropylene, or a combination thereof. In a particular embodiment, the first polymer can include an aromatic polymer. In another embodiment, the adhesive layer can have a tensile stress in an extrusion direction of at least 30 MPa.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 16, 2021
    Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    Inventors: Jing Dong, Nafih Mekhilef, Dongyeop Shin
  • Publication number: 20200362914
    Abstract: An adhesive layer can include a polymer blend of a first polymer and a second polymer. In an embodiment, the first polymer can be a modified fluoropolymer. In another embodiment, the second can be a non-fluorinated polymer. In a particular embodiment, the adhesive layer can include greater than 60 wt. % of the first polymer for the total weight of the polymer blend. A bearing can include the adhesive layer disposed over a substrate.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Inventors: Dongyeop Shin, Jing Dong, Nafih Mekhilef
  • Publication number: 20190300762
    Abstract: Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the second polymer includes ethylene tetrafluoroethylene, and the third polymer includes a modified ethylene tetrafluoroethylene, ethylene tetrafluoroethylene hexafluoropropylene, or a combination thereof. In a particular embodiment, the first polymer can include an aromatic polymer. In another embodiment, the adhesive layer can have a tensile stress in an extrusion direction of at least 30 MPa.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 3, 2019
    Inventors: Jing Dong, Nafih Mekhilef, Dongyeop Shin