Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A connection structure for connecting a power cable and a conductor lead-out rod to minimize electrical resistance of a contact surface, and conductor connection device of a power cable may be provided with at least one conducting bolt configured to be fastened into a fastening hole to apply pressure to conductive particles injected into an accommodation space so as to electrically connect a conductor part and a conductor lead-out rod; and a fixing bolt configured to be fastened into the fastening hole to fix the conductor part inserted into an accommodation groove of the conductor lead-out rod.

Abstract: The present disclosure relates to a connection structure for connecting a power cable and a conductor lead-out rod to minimize electrical resistance of a contact surface, and conductor connection device of a power cable.