Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Abstract: A connection structure for connecting a power cable and a conductor lead-out rod to minimize electrical resistance of a contact surface, and conductor connection device of a power cable may be provided with at least one conducting bolt configured to be fastened into a fastening hole to apply pressure to conductive particles injected into an accommodation space so as to electrically connect a conductor part and a conductor lead-out rod; and a fixing bolt configured to be fastened into the fastening hole to fix the conductor part inserted into an accommodation groove of the conductor lead-out rod.

Abstract: The present disclosure relates to a connection structure for connecting a power cable and a conductor lead-out rod to minimize electrical resistance of a contact surface, and conductor connection device of a power cable.