Patents by Inventor Dongbu HiTek Co., Ltd.

Dongbu HiTek Co., Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    Publication number: 20130221469
    Abstract: A semiconductor package including a semiconductor chip configured to include a connection terminal electrically connected to wirings for transferring signals. The semiconductor package may include a semiconductor supporting substrate configured to be bonded to the semiconductor chip and include a through-silicon via which allows the connection terminal to be opened. The connection terminal may be formed on a scribe line of a semiconductor wafer and a conductive material contacting the connection terminal may filled in the through-silicon via.
    Type: Application
    Filed: January 4, 2013
    Publication date: August 29, 2013
    Applicant: Dongbu HiTek Co., Ltd.
    Inventor: Dongbu HiTek Co., Ltd.