Abstract: A composition includes: (I) a polyorganosiloxane fluid having an average of at least two unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst; and (IV) a fluoroorganosilicone.

Abstract: This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst, (IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both, (V) an unsaturated ester-functional compound, and (VI) an adhesion promoter. The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.

Abstract: A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Abstract: A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Abstract: This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst, (IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both, (V) an unsaturated ester-functional compound, and (VI) an adhesion promoter. The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.

Abstract: A composition includes: (I) a polyorganosiloxane fluid having an average of at least two unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst; and (IV) a fluoroorganosilicone.

Abstract: A silicone composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) an effective amount of a titanium or zirconium compound having at least one aliphatic carbon-carbon multiple bond, and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone product formed from the composition.

Abstract: A silicone composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) an effective amount of a titanium or zirconium compound having at least one aliphatic carbon-carbon multiple bond, and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone product formed from the composition.

Abstract: A silicone composition prepared by mixing (A) 100 parts by weight of an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) 0.5 to 50 parts by weight of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group and at least one aliphatic carbon-carbon multiple bond per molecule, (D) 1 to 10 parts by weight of a titanium chelate, and (E) a catalytic amount of a hydrosilylation catalyst; and a cured product formed from the composition.