Patents by Inventor Dong-Chan Kim
Dong-Chan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250226303Abstract: A COF module according to an embodiment comprises a substrate including a chip mounting region; a circuit pattern disposed on the substrate; and a chip disposed on the chip mounting region and connected to the circuit pattern, wherein the circuit pattern includes a first circuit pattern, a second circuit pattern, and a third circuit pattern, wherein the third circuit pattern is disposed inside the chip mounting region, wherein a first terminal part of the chip is connected to the third circuit pattern, and wherein an end of the first terminal part and an end of the third circuit pattern are spaced apart from each other.Type: ApplicationFiled: April 3, 2023Publication date: July 10, 2025Inventors: Ki Tae PARK, Chae Won KANG, Dong Chan KIM
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Publication number: 20250212600Abstract: A light emitting element according to an embodiment includes a first electrode, two or more light emitting units on the first electrode, and a second electrode on the two or more light emitting units, wherein the second electrode includes silver-lithium (Ag—Li), and the light emitting unit at the top of the two or more light emitting units includes ytterbium, and it includes any one selected from an electron injection layer including ytterbium, and an electron injection layer doped with a metal in a compound represented by the following Formula 1.Type: ApplicationFiled: August 20, 2024Publication date: June 26, 2025Inventors: HAKCHOONG LEE, PILGU KANG, Dong Chan KIM, Ji Young MOON, JONGWON LEE, Chang-Min LEE, Jung Ho CHOI, Jae Hoon HWANG
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Publication number: 20250206105Abstract: An air vent for a vehicle includes a housing provided with an air outlet, a front wing module mounted within the housing and configured to adjust air discharged through the air outlet in left and right directions, a rear wing module mounted within the housing by being spaced apart from the front wing module and configured to adjust air discharged through the air outlet in up and down directions, and a manipulation module connected to the front wing module and to the rear wing module from outside the housing by being spaced apart from the air outlet, and configured to adjust air discharged through the air outlet in left and right or up and down directions.Type: ApplicationFiled: March 22, 2024Publication date: June 26, 2025Inventors: Seong Min An, Dong Chan Kim, Kwang Woon Cho, Yong Seok Park, Byung Jo Kim, Chun Ha Kim
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Publication number: 20250205020Abstract: A dental implant forming an artificial dental root by being implanted into an alveolar bone according to rotation about an axis includes an internal groove formed inside a top portion to enable coupling of an abutment for prosthesis supporting, and an external screw part having threads formed from a top of an outer peripheral surface to a bottom thereof to enable implantation into the alveolar bone.Type: ApplicationFiled: October 6, 2024Publication date: June 26, 2025Inventors: Hyun Soo PARK, Dong Chan KIM
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Patent number: 12328817Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the chType: GrantFiled: June 28, 2023Date of Patent: June 10, 2025Assignee: LG INNOTEK CO., LTD.Inventors: Eon Jong Lee, Dong Chan Kim, Ki Tae Park
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Patent number: 12289077Abstract: There is provided a water solar power generation system including: a solar cell plate; a frame supporting the solar cell frame; and a float installed in the frame and positioning the solar cell plate on the surface of the water while floating on the surface of the water. The frame becomes a negative electrode and an optical electrode which becomes a positive electrode, and is electrically connected to the frame, and causes water decomposition while contacting water in the water to generate oxygen in the water.Type: GrantFiled: June 18, 2020Date of Patent: April 29, 2025Assignee: SCOTRA CORPORATIONInventors: Jong-Mok Lee, Chang-Sub Won, Dong-Chan Kim, Myeng-Gil Gang, Sang-Gu Kim
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Patent number: 12156416Abstract: According to an embodiment of the present disclosure, an organic light emitting diode includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; an electron injection layer positioned between the emission layer and the second electrode; and an electron injection delay layer positioned between the emission layer and the electron injection layer, wherein the electron injection layer includes a first material made of a metal and a second material made of a metal halide, and the electron injection delay layer has a thickness of about 20 ? to about 140 ?.Type: GrantFiled: August 11, 2023Date of Patent: November 26, 2024Assignee: Samsung Display Co., Ltd.Inventors: Dong Chan Kim, Won Jong Kim, Dong Kyu Seo, Ji Hye Lee, Sang Hoon Yim, Won Suk Han
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Publication number: 20240121975Abstract: A light emitting device may include a first electrode, a first light emitting stack disposed on the first electrode, a charge generation layer disposed on the first light emitting stack, a second light emitting stack disposed on the charge generation layer, and a second electrode disposed on the second light emitting stack. Each of the first light emitting stack and the second light emitting stack includes a hole transport layer. A hole mobility of the charge generation layer is lower than a hole mobility of the hole transport layer.Type: ApplicationFiled: June 22, 2023Publication date: April 11, 2024Applicant: Samsung Display Co., Ltd.Inventors: JUNGHO CHOI, PILGU KANG, DONG CHAN KIM, JIYOUNG MOON, HAKCHOONG LEE
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Publication number: 20230420633Abstract: The present disclosure relates to an electrode rolling apparatus including a non-coating portion pressing unit that rolls a non-coating portion of an electrode substrate and an electrode rolling method using the same, and can prevent a swell from occurring in the non-coating portion region during the process of rolling the electrode substrate and increase the efficiency of the manufacturing process.Type: ApplicationFiled: May 12, 2022Publication date: December 28, 2023Applicant: LG Energy Solution, Ltd.Inventors: Jung Eun Lee, Hwan Han Kim, Jaehyuk Choi, Sang Hoon Choy, Jeong Soo Seol, Dong Chan Kim, Su Ho Jeon
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Publication number: 20230389350Abstract: According to an embodiment of the present disclosure, an organic light emitting diode includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; an electron injection layer positioned between the emission layer and the second electrode; and an electron injection delay layer positioned between the emission layer and the electron injection layer, wherein the electron injection layer includes a first material made of a metal and a second material made of a metal halide, and the electron injection delay layer has a thickness of about 20 ? to about 140 ?.Type: ApplicationFiled: August 11, 2023Publication date: November 30, 2023Inventors: Dong Chan Kim, Won Jong Kim, Dong Kyu Seo, Ji Hye Lee, Sang Hoon Yim, Won Suk Han
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Publication number: 20230345635Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the chType: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Inventors: Eon Jong Lee, Dong Chan Kim, Ki Tae Park
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Patent number: 11793012Abstract: An organic light emitting diode, including a first electrode; a second electrode facing the first electrode, the second electrode including magnesium; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, the electron injection layer including a dipole material including a first component and a second component having different polarities, the dipole material including halide, and a content of the magnesium included in the second electrode being in a range of from 10 to 40 volume %.Type: GrantFiled: November 17, 2021Date of Patent: October 17, 2023Assignee: Samsung Display Co., Ltd.Inventors: Dong Chan Kim, Won Jong Kim, Eung Do Kim, Dong Kyu Seo, Da Hea Im, Sang Hoon Yim, Chang Woong Chu
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Patent number: 11770943Abstract: According to an embodiment of the present disclosure, an organic light emitting diode includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; an electron injection layer positioned between the emission layer and the second electrode; and an electron injection delay layer positioned between the emission layer and the electron injection layer, wherein the electron injection layer includes a first material made of a metal and a second material made of a metal halide, and the electron injection delay layer has a thickness of about 20 ? to about 140 ?.Type: GrantFiled: July 2, 2021Date of Patent: September 26, 2023Assignee: Samsung Display Co., Ltd.Inventors: Dong Chan Kim, Won Jong Kim, Dong Kyu Seo, Ji Hye Lee, Sang Hoon Yim, Won Suk Han
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Patent number: 11758659Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the chType: GrantFiled: October 19, 2021Date of Patent: September 12, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Eon Jong Lee, Dong Chan Kim, Ki Tae Park
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Publication number: 20230180503Abstract: An embodiment provides a light emitting device including: a first electrode; a second electrode overlapping the first electrode in a plan view; and a light emitting part disposed between the first electrode and the second electrode. The second electrode includes a first layer disposed on the light emitting part and including a first organic material, and a metal thin film layer disposed on the first layer and including a first metal. The light emitting part includes an emission layer, a hole transport region disposed between the first electrode and the emission layer, and an electron transport region disposed between the emission layer and the second electrode. The first layer is disposed on the electron transport region.Type: ApplicationFiled: August 31, 2022Publication date: June 8, 2023Applicant: Samsung Display Co., LTD.Inventors: Yoonseok KA, Ji Young MOON, Hakchoong LEE, Pilgu KANG, Dong Chan KIM, Ha Jin SONG, Jung Ho CHOI, Jae Hoon HWANG
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Publication number: 20230179139Abstract: There is provided a water solar power generation system including: a solar cell plate; a frame supporting the solar cell frame; and a float installed in the frame and positioning the solar cell plate on the surface of the water while floating on the surface of the water. The frame becomes a negative electrode and an optical electrode which becomes a positive electrode, and is electrically connected to the frame, and causes water decomposition while contacting water in the water to generate oxygen in the water.Type: ApplicationFiled: June 18, 2020Publication date: June 8, 2023Applicant: SCOTRA CORPORATIONInventors: Jong-Mok LEE, Chang-Sub WON, Dong-Chan KIM, Myeng-Gil GANG, Sang-Gu KIM
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Publication number: 20230137462Abstract: A light emitting element includes a first electrode, a hole transport region disposed on the first electrode, an emission layer disposed on the hole transport region, an electron transport region which is disposed on the emission layer and includes an electron transport layer and an electron injection layer disposed on the electron transport layer, and a second electrode disposed on the electron transport region, wherein the electron injection layer includes a host represented by Formula A or Formula B, and a metal dopant, and the metal dopant includes Ag, Bi, Mg, Li, Yb, Cu, La, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, or Lu, thereby improving electron injection characteristics and having excellent or suitable luminous efficiency.Type: ApplicationFiled: July 8, 2022Publication date: May 4, 2023Inventors: YOONSEOK KA, DONG CHAN KIM, JIYOUNG MOON, HAKCHOONG LEE, HAJIN SONG, JIHWAN YOON, JAEHOON HWANG
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Patent number: 11626246Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.Type: GrantFiled: August 11, 2021Date of Patent: April 11, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Hong Seok Kim, Dong Chan Kim, Eun Jeong Cho, Chung Eun Lee, Hye Bin Kim, Eun Joo Choi, Sun Ju Hwang
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Patent number: 11361995Abstract: A method of manufacturing a semiconductor device includes forming a via including a first conductive material on an inner wall of a trench on a substrate. The method further includes forming a first insulating interlayer on the substrate. The first insulating interlayer covers the via and partially fills the trench, and the first insulating interlayer has a non-flat upper surface. The method further includes forming a polishing stop layer on the first insulating interlayer, forming a second insulating interlayer on the polishing stop layer, in which the second insulating interlayer fills a remaining portion of the trench, planarizing the second insulating interlayer until the polishing stop layer is exposed, and etching the polishing stop layer and the first and second insulating interlayers using a dry etching process until remaining portions of the polishing stop layer except for a portion of the polishing stop layer in the trench are removed.Type: GrantFiled: January 12, 2021Date of Patent: June 14, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung-Hoon Choi, Ja-Eung Koo, Kwan-Sik Kim, Dong-Chan Kim, Il-Young Yoon, Man-Geun Cho
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Patent number: 11349094Abstract: An organic light emitting element includes a first electrode a second electrode that faces the first electrode, an emission layer between the first electrode and the second electrode, the emission layer including quantum dots, and a hole transport layer between the first electrode and the emission layer. The quantum dots include at least one of a Group I-VI compound, a Group II-VI compound, and a Group III-VI compound. The hole transport layer includes at least one of a p-doped Group I-VI compound, a p-doped Group II-VI compound, and a p-doped Group III-VI compound.Type: GrantFiled: December 1, 2016Date of Patent: May 31, 2022Assignee: Samsung Display Co., Ltd.Inventors: Dong Chan Kim, Yi Su Kim, Byoung Duk Lee, Yoon Hyeung Cho