Patents by Inventor Donghai CHENG

Donghai CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Base plate for heat sink as well as heat sink and IGBT module having the same
    Patent number: 10297525
    Abstract: A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180?S1/S2?800, and 300?N<650.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: May 21, 2019
    Assignee: BYD COMPANY LIMITED
    Inventors: Qing Gong, Yaxuan Sun, Xinping Lin, Shuming Zhao, Bo Wu, Jingjing Luo, Donghai Cheng
  • BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME
    Publication number: 20180317342
    Abstract: A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180?S1/S2?800, and 300?N<650.
    Type: Application
    Filed: October 28, 2016
    Publication date: November 1, 2018
    Applicant: BYD COMPANY LIMITED
    Inventors: Qing GONG, Yaxuan SUN, Xinping LIN, Shuming ZHAO, Bo WU, Jingjing LUO, Donghai CHENG