Patents by Inventor Dong Hak JANG

Dong Hak JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11591691
    Abstract: Disclosed is a method of forming a thin film using a surface protection material, the method comprising supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate, discharging the unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber, supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate, discharging the unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber, and supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: February 28, 2023
    Assignees: EGTM CO., LTD., SK HYNIX INC.
    Inventors: Geun Su Lee, Jae Min Kim, Ha Na Kim, Woong Jin Choi, Eun Ae Jung, Dong Hyun Lee, Myung Soo Lee, Ji Won Moon, Dong Hak Jang, Hyun Sik Noh
  • Publication number: 20210130954
    Abstract: Disclosed is a method of forming a thin film using a surface protection material, the method comprising supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate, discharging the unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber, supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate, discharging the unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber, and supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film.
    Type: Application
    Filed: July 24, 2020
    Publication date: May 6, 2021
    Applicant: EUGENETECH MATERIALS CO., LTD.
    Inventors: Geun Su LEE, Jae Min KIM, Ha Na KIM, Woong Jin CHOI, Eun Ae JUNG, Dong Hyun LEE, Myung Soo LEE, Ji Won MOON, Dong Hak JANG, Hyun Sik NOH