Patents by Inventor Dongho CHAE

Dongho CHAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY SAME
    Publication number: 20230309222
    Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.
    Type: Application
    Filed: October 18, 2021
    Publication date: September 28, 2023
    Applicant: DOOSAN CORPORATION
    Inventors: Euidock RYU, Sungmoon KIM, Jinwoo KIM, Subyung PARK, Dongho CHAE
  • ADHESIVE COMPOSITION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE THE SAME
    Publication number: 20230135423
    Abstract: An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.
    Type: Application
    Filed: March 12, 2021
    Publication date: May 4, 2023
    Applicant: DOOSAN CORPORATION
    Inventors: Kwangseok PARK, Euidock RYU, Inki JEONG, Subyung PARK, Dongho CHAE