Patents by Inventor DONGHOON GANG

DONGHOON GANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE
    Publication number: 20230187460
    Abstract: A semiconductor package includes a first semiconductor chip having a first surface and a second surface opposite to each other, a second semiconductor chip on the second surface of the first semiconductor chip and electrically connected to the first semiconductor chip, and a molding pattern bordering side surfaces of the first semiconductor chip and side surfaces of the second semiconductor chip. At least a portion of the first surface of the first semiconductor chip is free of the molding pattern. A glass pattern is on the first surface of the first semiconductor chip.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 15, 2023
    Inventor: Donghoon Gang
  • Bonding interconnection structure of image sensor semiconductor package
    Patent number: 11605658
    Abstract: A semiconductor package includes a first semiconductor chip having a first surface and a second surface opposite to each other, a second semiconductor chip on the second surface of the first semiconductor chip and electrically connected to the first semiconductor chip, and a molding pattern bordering side surfaces of the first semiconductor chip and side surfaces of the second semiconductor chip. At least a portion of the first surface of the first semiconductor chip is free of the molding pattern. A glass pattern is on the first surface of the first semiconductor chip.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: March 14, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Donghoon Gang
  • Semiconductor Package
    Publication number: 20210066368
    Abstract: A semiconductor package includes a first semiconductor chip having a first surface and a second surface opposite to each other, a second semiconductor chip on the second surface of the first semiconductor chip and electrically connected to the first semiconductor chip, and a molding pattern bordering side surfaces of the first semiconductor chip and side surfaces of the second semiconductor chip. At least a portion of the first surface of the first semiconductor chip is free of the molding pattern. A glass pattern is on the first surface of the first semiconductor chip.
    Type: Application
    Filed: May 18, 2020
    Publication date: March 4, 2021
    Inventor: DONGHOON GANG