Patents by Inventor Dong Hoon Seo

Dong Hoon Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152154
    Abstract: Disclosed is a method of controlling a server for managing movement schedules of a plurality of robots. The control method includes receiving an occupancy request for at least one node matching a scheduled moving route from at least one of the plurality of robots; setting actually occupied nodes and provisionally occupied nodes of each of the plurality of robots based on the occupancy request; and transmitting occupancy permission information including the set actually occupied node and provisionally occupied node to each of the plurality of robots. In the setting of the actually occupied node and the provisionally occupied node, the actually occupied nodes and the provisionally occupied nodes of each of the plurality of robots are selected so that an actually occupied node of one robot does not overlap an actually occupied node or a provisionally occupied node of another robot.
    Type: Application
    Filed: December 19, 2022
    Publication date: May 9, 2024
    Applicant: Twinny Co., Ltd.
    Inventors: Young Jin BYEON, Sang Su LEE, Jae Yeong AN, Dong Woo SEO, Chang Hoon LEE
  • Patent number: 11966768
    Abstract: Disclosed herein are an apparatus and method for a multi-cloud service platform. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program may receive a service request from a user client device, generate a multi-cloud infrastructure service using multiple clouds in response to the service request, make the multiple clouds interoperate with mufti-cloud infrastructure in order to provide the multi-cloud infrastructure service, and generate a multi-cloud application runtime environment corresponding to the multi-cloud infrastructure service.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: April 23, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seok-Ho Son, Dong-Jae Kang, Byoung-Seob Kim, Seung-Jo Bae, Ji-Hoon Seo, Byeong-Thaek Oh, Kure-Chel Lee, Young-Woo Jung
  • Patent number: 11936372
    Abstract: A slew rate adjusting circuit includes an adjustment transistor configured to provide an adjustment current into an output port of an arithmetic amplifier, a first transistor connected between a power line of the arithmetic amplifier and the adjustment transistor, and a second transistor connected between the first transistor and an output node of the output port, wherein the adjustment transistor is turned on by the second transistor in response to a difference between an input voltage and an output voltage being equal to or greater than a reference voltage, and the adjustment current is provided to the output port in response to the adjustment transistor being turned on.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: March 19, 2024
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Jung Hoon Sul, Dong Il Seo
  • Publication number: 20240079748
    Abstract: In some implementations, is provided a battery cell, and battery module and battery pack including the same including: an electrode assembly in which a plurality of polar plates are stacked; a case having an internal space in which the electrode assembly is accommodated; a cap assembly coupled to the case and having a terminal disposed therein; and a connection pin configured to electrically connect the electrode assembly and the terminal, wherein the terminal includes: a rivet having an insertion hole into which the connection pin is inserted; and a terminal portion coupled to the rivet.
    Type: Application
    Filed: August 22, 2023
    Publication date: March 7, 2024
    Inventors: Jae Sik SHIN, Seung Hoon JU, Jae Gyu BYUN, Gi Jeong SEO, Dong Ha HWANG
  • Publication number: 20240075853
    Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.
    Type: Application
    Filed: April 13, 2023
    Publication date: March 7, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
  • Patent number: 11921273
    Abstract: Provided are a pulse compressor and a two-photon excited fluorescence microscope. The microscope includes a light source which generates a laser beam having a pulse, a pulse compressor which compresses the pulse of the laser beam, an objective lens which provides the laser beam to a specimen, and image sensors which receive the laser beam and obtain images of the specimen. The pulse compressor may include a grating plate, a corner cube provided on one side of the grating plate, and a retroreflector provided on the other side of the grating plate.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 5, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kyun Lee, Dong Hoon Song, Hong-Seok Seo, Chul Huh
  • Patent number: 11545451
    Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: January 3, 2023
    Assignee: NEPES CO., LTD.
    Inventors: Hyun Sik Kim, Seung Hwan Shin, Yong Tae Kwon, Dong Hoon Seo, Hee Cheol Kim, Dong Soo Lee
  • Patent number: 11461066
    Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: October 4, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo Sik Yun, Dong Hoon Seo, Sung-Jae Lee, Min Chul Jung
  • Publication number: 20220075586
    Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 10, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo Sik YUN, Dong Hoon SEO, Sung-Jae LEE, Min Chul JUNG
  • Publication number: 20210288005
    Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.
    Type: Application
    Filed: February 19, 2021
    Publication date: September 16, 2021
    Applicant: Nepes CO., LTD.
    Inventors: Hyun Sik KIM, Seung Hwan SHIN, Yong Tae KWON, Dong Hoon SEO, Hee Cheol KIM, Dong Soo LEE
  • Patent number: 11065343
    Abstract: The present invention relates to a compound bearing a self-immolative linker having ?-galactoside-introduced thereto. In a compound bearing a ?-galactoside-introduced self-immolative linker according to the present invention, particularly, the self-immolative linker may form a glycosidic bond with a protein (e.g., an oligopeptide, polypeptide, an antibody, etc.) or ligand which has specific affinity for a desired target or with an active agent (e.g., a drug, a toxin, a ligand, a detection probe, etc.), which has a specific function or activity so as to allow the selective release of the active agent within a target cell.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: July 20, 2021
    Assignee: IntoCell Inc.
    Inventors: Tae Kyo Park, Sung Ho Woo, Sun Young Kim, Doo Hwan Jung, Sang Kwang Lee, Jong Un Cho, Jae Ho Lee, Su Ho Park, Dong Hoon Seo, Hyang Sook Lee, Beom Seok Seo, Ji Yeon Lim
  • Publication number: 20190328902
    Abstract: The present invention relates to a compound bearing a self-immolative linker having ?-galactoside-introduced thereto. In a compound bearing a ?-galactoside-introduced self-immolative linker according to the present invention, particularly, the self-immolative linker may form a glycosidic bond with a protein (e.g., an oligopeptide, polypeptide, an antibody, etc.) or ligand which has specific affinity for a desired target or with an active agent (e.g., a drug, a toxin, a ligand, a detection probe, etc.), which has a specific function or activity so as to allow the selective release of the active agent within a target cell.
    Type: Application
    Filed: December 28, 2017
    Publication date: October 31, 2019
    Inventors: Tae Kyo Park, Sung Ho Woo, Sun Young Kim, Doo Hwan Jung, Sang Kwang Lee, Jong Un Cho, Jae Ho Lee, Su Ho Park, Dong Hoon Seo, Hyang Sook Lee, Beom Seok Seo, Ji Yeon Lim