Patents by Inventor Dong Hoon Seo
Dong Hoon Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152154Abstract: Disclosed is a method of controlling a server for managing movement schedules of a plurality of robots. The control method includes receiving an occupancy request for at least one node matching a scheduled moving route from at least one of the plurality of robots; setting actually occupied nodes and provisionally occupied nodes of each of the plurality of robots based on the occupancy request; and transmitting occupancy permission information including the set actually occupied node and provisionally occupied node to each of the plurality of robots. In the setting of the actually occupied node and the provisionally occupied node, the actually occupied nodes and the provisionally occupied nodes of each of the plurality of robots are selected so that an actually occupied node of one robot does not overlap an actually occupied node or a provisionally occupied node of another robot.Type: ApplicationFiled: December 19, 2022Publication date: May 9, 2024Applicant: Twinny Co., Ltd.Inventors: Young Jin BYEON, Sang Su LEE, Jae Yeong AN, Dong Woo SEO, Chang Hoon LEE
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Patent number: 11966768Abstract: Disclosed herein are an apparatus and method for a multi-cloud service platform. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program may receive a service request from a user client device, generate a multi-cloud infrastructure service using multiple clouds in response to the service request, make the multiple clouds interoperate with mufti-cloud infrastructure in order to provide the multi-cloud infrastructure service, and generate a multi-cloud application runtime environment corresponding to the multi-cloud infrastructure service.Type: GrantFiled: February 3, 2021Date of Patent: April 23, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seok-Ho Son, Dong-Jae Kang, Byoung-Seob Kim, Seung-Jo Bae, Ji-Hoon Seo, Byeong-Thaek Oh, Kure-Chel Lee, Young-Woo Jung
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Patent number: 11936372Abstract: A slew rate adjusting circuit includes an adjustment transistor configured to provide an adjustment current into an output port of an arithmetic amplifier, a first transistor connected between a power line of the arithmetic amplifier and the adjustment transistor, and a second transistor connected between the first transistor and an output node of the output port, wherein the adjustment transistor is turned on by the second transistor in response to a difference between an input voltage and an output voltage being equal to or greater than a reference voltage, and the adjustment current is provided to the output port in response to the adjustment transistor being turned on.Type: GrantFiled: March 22, 2023Date of Patent: March 19, 2024Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jung Hoon Sul, Dong Il Seo
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Publication number: 20240079748Abstract: In some implementations, is provided a battery cell, and battery module and battery pack including the same including: an electrode assembly in which a plurality of polar plates are stacked; a case having an internal space in which the electrode assembly is accommodated; a cap assembly coupled to the case and having a terminal disposed therein; and a connection pin configured to electrically connect the electrode assembly and the terminal, wherein the terminal includes: a rivet having an insertion hole into which the connection pin is inserted; and a terminal portion coupled to the rivet.Type: ApplicationFiled: August 22, 2023Publication date: March 7, 2024Inventors: Jae Sik SHIN, Seung Hoon JU, Jae Gyu BYUN, Gi Jeong SEO, Dong Ha HWANG
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Publication number: 20240075853Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.Type: ApplicationFiled: April 13, 2023Publication date: March 7, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
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Patent number: 11921273Abstract: Provided are a pulse compressor and a two-photon excited fluorescence microscope. The microscope includes a light source which generates a laser beam having a pulse, a pulse compressor which compresses the pulse of the laser beam, an objective lens which provides the laser beam to a specimen, and image sensors which receive the laser beam and obtain images of the specimen. The pulse compressor may include a grating plate, a corner cube provided on one side of the grating plate, and a retroreflector provided on the other side of the grating plate.Type: GrantFiled: August 30, 2021Date of Patent: March 5, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kyun Lee, Dong Hoon Song, Hong-Seok Seo, Chul Huh
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Patent number: 11545451Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.Type: GrantFiled: February 19, 2021Date of Patent: January 3, 2023Assignee: NEPES CO., LTD.Inventors: Hyun Sik Kim, Seung Hwan Shin, Yong Tae Kwon, Dong Hoon Seo, Hee Cheol Kim, Dong Soo Lee
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Patent number: 11461066Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.Type: GrantFiled: November 13, 2019Date of Patent: October 4, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Woo Sik Yun, Dong Hoon Seo, Sung-Jae Lee, Min Chul Jung
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Publication number: 20220075586Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.Type: ApplicationFiled: November 13, 2019Publication date: March 10, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Woo Sik YUN, Dong Hoon SEO, Sung-Jae LEE, Min Chul JUNG
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Publication number: 20210288005Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.Type: ApplicationFiled: February 19, 2021Publication date: September 16, 2021Applicant: Nepes CO., LTD.Inventors: Hyun Sik KIM, Seung Hwan SHIN, Yong Tae KWON, Dong Hoon SEO, Hee Cheol KIM, Dong Soo LEE
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Patent number: 11065343Abstract: The present invention relates to a compound bearing a self-immolative linker having ?-galactoside-introduced thereto. In a compound bearing a ?-galactoside-introduced self-immolative linker according to the present invention, particularly, the self-immolative linker may form a glycosidic bond with a protein (e.g., an oligopeptide, polypeptide, an antibody, etc.) or ligand which has specific affinity for a desired target or with an active agent (e.g., a drug, a toxin, a ligand, a detection probe, etc.), which has a specific function or activity so as to allow the selective release of the active agent within a target cell.Type: GrantFiled: December 28, 2017Date of Patent: July 20, 2021Assignee: IntoCell Inc.Inventors: Tae Kyo Park, Sung Ho Woo, Sun Young Kim, Doo Hwan Jung, Sang Kwang Lee, Jong Un Cho, Jae Ho Lee, Su Ho Park, Dong Hoon Seo, Hyang Sook Lee, Beom Seok Seo, Ji Yeon Lim
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Publication number: 20190328902Abstract: The present invention relates to a compound bearing a self-immolative linker having ?-galactoside-introduced thereto. In a compound bearing a ?-galactoside-introduced self-immolative linker according to the present invention, particularly, the self-immolative linker may form a glycosidic bond with a protein (e.g., an oligopeptide, polypeptide, an antibody, etc.) or ligand which has specific affinity for a desired target or with an active agent (e.g., a drug, a toxin, a ligand, a detection probe, etc.), which has a specific function or activity so as to allow the selective release of the active agent within a target cell.Type: ApplicationFiled: December 28, 2017Publication date: October 31, 2019Inventors: Tae Kyo Park, Sung Ho Woo, Sun Young Kim, Doo Hwan Jung, Sang Kwang Lee, Jong Un Cho, Jae Ho Lee, Su Ho Park, Dong Hoon Seo, Hyang Sook Lee, Beom Seok Seo, Ji Yeon Lim