Patents by Inventor Dong Hoon SON

Dong Hoon SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240404298
    Abstract: An apparatus for determining a position of an object outside a vehicle includes: a camera that obtains an external image of the vehicle, and a processor that may detect a target region corresponding to a target object in the external image. In particular, the processor detects a predetermined horizontal reference line in the target region, calculates a gradient of the horizontal reference line perpendicular to a front direction of the vehicle on a horizontal plane parallel to a road surface, and calculates a heading angle difference between the vehicle and the target object based on the gradient of the horizontal reference line.
    Type: Application
    Filed: December 13, 2023
    Publication date: December 5, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Seul Gi Kim, Min Sung Son, Ra Hoon Kang, Ha Yong Woo, Dong Yeoup Jeon
  • Publication number: 20240391539
    Abstract: A moving spoiler that prevents a constituent element configured to move the spoiler from being exposed to the outside and matches the spoiler with an external appearance of an outer panel of a vehicle, and the moving spoiler includes a spoiler cover having an operating space formed at a rear side of a roof part, the operating space having a shape opened at a rear side thereof, a moving plate configured to move into the operating space or move to the outside of the operating space through the opening portion of the operating space, a guide mechanism between an inner surface of the operating space and the moving plate and configured to guide a movement of the moving plate, and a drive part configured to provide driving power for moving the moving plate.
    Type: Application
    Filed: September 26, 2023
    Publication date: November 28, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Hong Heui LEE, Jin Young YOON, Chan Joo MOON, Dong Eun CHA, Dong Ju KIM, Sung Hoon SON, Jeong Bok LEE, Bo Hwan CHA
  • Publication number: 20240386593
    Abstract: An apparatus for determining a height of an abject includes a camera to acquire a two-dimensional (2D) image and a processor. The processor detects a target object corresponding to an obstacle from the 2D image. The processor also determines a reference lower point from among pixels positioned at a lower portion of the target object. The processor further projects a preset reference line to the 2D image such that a reference point of the preset reference line is matched with the reference lower point. The processor additionally determines a height of the target object based on at least one threshold value for marking a preset distance, from the reference point, on the reference line.
    Type: Application
    Filed: November 9, 2023
    Publication date: November 21, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Ra Hoon Kang, Min Sung Son, Dong Yeoup Jeon, Ha Yong Woo, Seul Gi Kim
  • Patent number: 12131920
    Abstract: A laser light source is provided including an airtight container. A first resonance mirror and a second resonance mirror are disposed outside the airtight container. The first resonance mirror includes a lens unit and a reflection coating layer. The lens unit includes a first surface and a second surface, and the first surface is inclined with respect to the second surface.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: October 29, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kyong Sik Choi, Dong Hoon Shin, Hoon Chul Ryoo, Kyeong Mok Kim, Jae-Woong Moon, Kyong Ho Park, Ki Hwan Seok, Myoung Seok Son, Hong Ro Lee
  • Publication number: 20240332032
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Application
    Filed: April 1, 2024
    Publication date: October 3, 2024
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Publication number: 20240330598
    Abstract: Provided is an AI-based disaster safety knowledge integration management system enabling AI-driven question-and-answer services for specialized knowledge in the field of disaster safety and supports automatic reporting services for policy planning and report generation on specific topics by utilizing intelligent analysis services for sharing disaster safety data, and which consists of a disaster safety knowledge base integrated with a data network and an artificial intelligence section designed for high-dimensional information processing; the disaster safety knowledge base consisting of a data collection section for gathering and aggregating various information from external agencies; and a data transmission section for transmitting the aggregated information to the server; and big data for analyzing and accumulating the transmitted data, and in the AI section, the accumulated and analyzed data from the big data section being utilized to enable machine intelligence through rapid learning based on human cog
    Type: Application
    Filed: March 9, 2023
    Publication date: October 3, 2024
    Inventors: Dong Man LEE, Seon Hwa CHOI, Sang Hoon YOON, Jong Yeong SON, Mi Song KIM, Hee Won YOON, Shin Hye RYU
  • Publication number: 20240300432
    Abstract: An airbag chute-integrated crash pad assembly includes: a main core that includes a door portion expanding when an airbag expands, and a cover portion mounted on a dash board. In particular, the main core is formed with a reinforcement portion extending downward from a lower surface of the cover portion, and the door portion and the cover portion are separated by a hinge groove that is formed in a lower surface of the main core and forms an expansion line. The reinforcement portion is combined with an airbag accommodation body that accommodates a passenger airbag (PAB). Thus, process optimization can be realized by omitting a process of machining a score and fusing a PAB chute, and also a problem of damage to the PAB chute can be solved.
    Type: Application
    Filed: September 18, 2023
    Publication date: September 12, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KBI DONGKOOK IND. CO., LTD., HYUNDAI MOBIS CO., LTD.
    Inventors: Jae-Hyun An, Min-Ha Lee, Chang-Hoon Yang, Young-Chan Cho, Neung-Han Kim, Dong-Hyuk Choi, Dong-Il Son, Chang-Woo Kang, In-Han Jeong
  • Publication number: 20240270979
    Abstract: Provided is a surface-treated steel sheet including: a steel sheet; and a corrosion-resistant film layer formed on at least one surface of the steel sheet. The corrosion-resistant film layer includes a product formed by a hydrolysis reaction of silica and an alkoxy silane and an acrylate-based polymer, comprises 25 to 65 wt % of carbon (C), 20 to 70 wt % of silicon (Si), and 1 to 40 wt % of oxygen (O), and in the corrosion-resistant film layer, a ratio of silicon (Si) to oxygen (O) (Si—O bonding) and silicon (Si) to carbon (C) (Si—C bonding) is 80 to 95 wt %:5 to 20 wt %.
    Type: Application
    Filed: March 22, 2024
    Publication date: August 15, 2024
    Inventors: Chang-Hoon CHOI, Dong-Yun KIM, Min-Ho JO, Jae-Duck KO, Won-Ho SON, Jong-Hwa KIM
  • Patent number: 12054643
    Abstract: Provided is a composition for steel sheet surface coating, the composition comprising colloidal silica, a silane, a monomer, an organic resin, an acidity adjuster, a long-term corrosion-resistance improver, and a solvent; and a steel sheet coated with the composition. The steel sheet has excellent acid resistance, and maintains thickness uniformity thereof even when exposed to an acid for an extended period of time.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 6, 2024
    Assignees: POSCO CO., LTD, NOROO COIL COATINGS CO., LTD.
    Inventors: Chang-Hoon Choi, Dong-Yun Kim, Won-Ho Son, Hee-Jea Eun, Jae-Duck Ko
  • Publication number: 20240256469
    Abstract: Disclosed herein is a method for key-value caching. The method may include initializing a key-value cache and processing data in the order of a key-value store, a service, and the key-value cache.
    Type: Application
    Filed: November 13, 2023
    Publication date: August 1, 2024
    Inventors: Yun-Kon KIM, Dong-Jae KANG, Byoung-Seob KIM, Soo-Young KIM, Seung-Jo BAE, Ji-Hoon SEO, Seok-Ho SON, Byeong-Thaek OH, Young-Woo JUNG
  • Patent number: 11454770
    Abstract: Provided are an apparatus and method for adjusting an optical axis. In the apparatus, an iris diaphragm and a quadrant photodiode (QPD) are used to align optical axes of an optical system of the apparatus so that optical transmission efficiency between an optical transmitter and an optical receiver can be increased. Since a hole of the iris diaphragm can be adjusted to be small, a beam larger than a light-receiving area of the QPD can be included in the light-receiving area, and optical axis alignment is facilitated accordingly. When the QPD and the iris diaphragm are applied to the apparatus, it is possible to simultaneously perform data transmission, tracking, and optical axis alignment. An optical fiber end surface and optical axes of lenses arranged in parallel are aligned in the apparatus so that alignment between two terminals can be easy and reception efficiency can be increased.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: September 27, 2022
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Soon Heo, Sung Chang Kim, Hyun Seo Kang, Chan Il Yeo, Ji Hyoung Ryu, Si Woong Park, Kye Eun Kim, Keo Sik Kim, Jeong Eun Kim, Gi Hyeon Min, Hyoung Jun Park, Dong Hoon Son, Mun Seob Lee
  • Publication number: 20210208535
    Abstract: Provided are a system and method for digital holographic imaging which are not affected by external vibrations. The system for digital holographic imaging includes a light source and optical system section configured to split generated beams and including a sample through which the beams pass, a lens, and a grating disposed behind the lens; an object signal acquisition section configured to receive the split beams and acquire an interference signal; and an image processor configured to acquire a three-dimensional (3D) image of an object by using the acquired interference signal.
    Type: Application
    Filed: March 20, 2020
    Publication date: July 8, 2021
    Inventors: Gi Hyeon MIN, Keo Sik KIM, Hyun Seo KANG, Kye Eun KIM, Sung Chang KIM, Ji Hyoung RYU, Si Woong PARK, Hyoung Jun PARK, Dong Hoon SON, Chan Il YEO, Dong Soo LEE, Byung Tak LEE, Young Soon HEO
  • Publication number: 20210063656
    Abstract: Provided are an apparatus and method for adjusting an optical axis. In the apparatus, an iris diaphragm and a quadrant photodiode (QPD) are used to align optical axes of an optical system of the apparatus so that optical transmission efficiency between an optical transmitter and an optical receiver can be increased. Since a hole of the iris diaphragm can be adjusted to be small, a beam larger than a light-receiving area of the QPD can be included in the light-receiving area, and optical axis alignment is facilitated accordingly. When the QPD and the iris diaphragm are applied to the apparatus, it is possible to simultaneously perform data transmission, tracking, and optical axis alignment. An optical fiber end surface and optical axes of lenses arranged in parallel are aligned in the apparatus so that alignment between two terminals can be easy and reception efficiency can be increased.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Inventors: Young Soon HEO, Sung Chang KIM, Hyun Seo KANG, Chan Il YEO, Ji Hyoung RYU, Si Woong PARK, Kye Eun KIM, Keo Sik KIM, Jeong Eun KIM, Gi Hyeon MIN, Hyoung Jun PARK, Dong Hoon SON, Mun Seob LEE
  • Patent number: 10884186
    Abstract: A multi-channel receiver optical sub assembly module for a fiber Bragg grating sensor according to an embodiment of the present invention includes a housing, a connection socket, an optical bench, a thermoelectric cooler, an arrayed waveguide grating chip, a photodiode array disposed on the optical bench and including a plurality of photodiode chips connected to the optical channels of the arrayed waveguide grating chip, and a printed circuit board which is connected to the other side of the housing while passing through the other side of the housing, of which a portion of a body is disposed on the optical bench, and which is connected to the photodiode array.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: January 5, 2021
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun Jin Kim, Hyoung Jun Park, Sung Chang Kim, Kye Eun Kim, Ji Hyoung Ryu, Gi Hyeon Min, Si Woong Park, Dong Hoon Son, Chan Il Yeo
  • Patent number: 10833763
    Abstract: A wireless optical communication apparatus for performing bi-directional optical transmission in a free space includes a first optical system configured to transmit data through a downlink scheme and a second optical system configured to receive the data from the first optical system and transmit a control signal to the first optical system through an uplink scheme, wherein each of the first optical system and the second optical system transmits and receives the data and the control signal through a single port.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: November 10, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun Seo Kang, Chan Il Yeo, Young Soon Heo, Kye Eun Kim, Sung Chang Kim, Ji Hyoung Ryu, Si Woong Park, Keo Sik Kim, Gi Hyeon Min, Hyoung Jun Park, Dong Hoon Son, Mun Seob Lee
  • Publication number: 20200310029
    Abstract: A multi-channel receiver optical sub assembly module for a fiber Bragg grating sensor according to an embodiment of the present invention includes a housing, a connection socket, an optical bench, a thermoelectric cooler, an arrayed waveguide grating chip, a photodiode array disposed on the optical bench and including a plurality of photodiode chips connected to the optical channels of the arrayed waveguide grating chip, and a printed circuit board which is connected to the other side of the housing while passing through the other side of the housing, of which a portion of a body is disposed on the optical bench, and which is connected to the photodiode array.
    Type: Application
    Filed: January 13, 2020
    Publication date: October 1, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyun Jin KIM, Hyoung Jun PARK, Sung Chang KIM, Kye Eun KIM, Ji Hyoung RYU, Gi Hyeon MIN, Si Woong PARK, Dong Hoon SON, Chan Il YEO
  • Publication number: 20200186247
    Abstract: A wireless optical communication apparatus for performing bi-directional optical transmission in a free space includes a first optical system configured to transmit data through a downlink scheme and a second optical system configured to receive the data from the first optical system and transmit a control signal to the first optical system through an uplink scheme, wherein each of the first optical system and the second optical system transmits and receives the data and the control signal through a single port.
    Type: Application
    Filed: December 2, 2019
    Publication date: June 11, 2020
    Inventors: Hyun Seo KANG, Chan Il YEO, Young Soon HEO, Kye Eun KIM, Sung Chang KIM, Ji Hyoung RYU, Si Woong PARK, Keo Sik KIM, Gi Hyeon MIN, Hyoung Jun PARK, Dong Hoon SON, Mun Seob LEE
  • Patent number: 10648860
    Abstract: Disclosed is a spectroscopic device including a planar lightwave circuit to which light passing through an optical fiber is input, a wavelength divider configured to divide a wavelength of light passing through the planar lightwave circuit, a beam splitter configured to divide a traveling direction of light passing through the wavelength divider into an external sample inlet and an internal sample inlet and adjust power of the divided light, a charge-coupled device (CCD) image sensor configured to covert light transmitted from the internal sample inlet to an electrical signal or convert light reflected by the external sample inlet to an electrical signal, a control and signal processor configured to process the electrical signal to indicate a light intensity based on each wavelength, and an input and output interface configured to perform a spectrum analysis for each wavelength using the processed electrical signal.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 12, 2020
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hyun Seo Kang, Kyeeun Kim, Keo-Sik Kim, Sung Chang Kim, Ji Hyoung Ryu, Gi Hyeon Min, Si Woong Park, Hyoungjun Park, Dong Hoon Son, Chan Il Yeo, Dongsoo Lee, Young Soon Heo
  • Patent number: 10591714
    Abstract: Provided is an endoscopic apparatus for thermal distribution monitoring, and more particularly, an endoscopic apparatus for thermal distribution monitoring that is capable of providing a functional image in which various images such as a real image and a thermal image, are matched to one another. The endoscopic apparatus includes: an image collecting unit including a thermal image collecting unit collecting a thermal image from an image signal of an object and a real image collecting unit collecting a real image from the image signal of the object; a controller transmitting a control signal to the image collecting unit so as to transmit the image signal to one of the thermal image collecting unit and the real image collecting unit according to a preset period; and a display displaying the collected thermal image and real image.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: March 17, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Keo Sik Kim, Hyun Seo Kang, Sung Chang Kim, Young Sun Kim, Jeong Eun Kim, Hee Seung Kim, Ji Hyoung Ryu, Hyoung Jun Park, Dong Hoon Son, Chan Il Yeo, Young Soon Heo
  • Patent number: RE50225
    Abstract: In one embodiment, the semiconductor device includes a stack of alternating interlayer insulating layers and conductive layers on a substrate. Each of the conductive layers extends in a first direction less than a previous one of the conductive layers to define a landing portion of the previous one of the conductive layers. An insulating plug is in one of the conductive layers under one of the landing portions, and a contact plug extends from an upper surface of the one of the landing portions.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: November 26, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Shin-Hwan Kang, Young-Hwan Son, Dong-seog Eun, Chang-sup Lee, Jae-hoon Jang