Abstract: Provided herein are compounds of the Formula (I): (I) and tautomers, stereoisomers and pharmaceutically acceptable salts and solvates thereof, wherein Rx, Ry, W, X, Y, Z, Ring A and (AA) have the meanings given in the specification, which are inhibitors of RET kinase and are useful in the treatment and prevention of diseases which can be treated with a RET kinase inhibitor, including RET-associated diseases and disorders.

Abstract: A display substrate includes a display region, and the display region includes an open pore region, a first pixel region and an isolation region; the isolation region is located between the first pixel region and the open pore region, the isolation region surrounds the open pore region, and a boundary line between the open pore region and the isolation region is a cutting line; the display substrate further includes: a fracture barrier structure, a peel-off barrier structure and an encapsulation structure, the fracture barrier structure being located in an isolation region, the isolation region including a reserved cutting transition region located between the fracture barrier structure and the open pore region; a peel-off barrier structure being located in the reserved cutting transition region; the distance L between the side of the peel-off barrier structure closest to the open pore region and the cutting line being such that: 0 ?m?L?30 ?m; a first portion of the encapsulation structure being located on a

Abstract: The present disclosure discloses a Streptomyces antioxidans strain Sa-21, namely, strain Sa-21 with an accession number of CCTCC NO: M 2020423. The present disclosure also discloses the use of the aforementioned Strepiomyces antioxidans strain Sa-21 in inhibition of Alternaria solani (A. solani). The Streptomyces antioxidans strain also has an inhibiting effect on both plant pathogenic fungi and plant pathogenic bacteria.

Abstract: The display substrate includes a display area, a barrier wall disposing area, and a hole area, the display area surrounds the barrier wall disposing area, the barrier wall disposing area surrounds the hole area, and the method for manufacturing the display substrate includes: after a first electrode of a light emitting device of the display substrate is formed, removing a protective layer of the barrier wall disposing area, and exposing at least one circle of an initial barrier wall covered by the protective layer, the initial barrier wall is disposed around the hole area; and etching the at least one circle of the initial barrier wall, to form at least one circle of a barrier wall, a notch is formed on at least one side surface of the barrier wall.

Abstract: The present disclosure relates to a display substrate and a display device thereof. The display substrate comprises: a substrate; a first wiring extending in a first direction on the substrate; a first dielectric layer on the substrate and the first wiring; a second wiring extending in the first direction on the first dielectric layer, wherein an orthographic projection of the second wiring on the substrate at least partially overlaps with an orthographic projection of the first wiring on the substrate; a conformal dielectric layer on the first dielectric layer and the second wiring; a third wiring and a fourth wiring disposed at spacings in the first direction on the conformal dielectric layer, wherein orthographic projections of the third wiring and the fourth wiring on the substrate at least partially overlap with the orthographic projections of the first wiring and the second wiring on the substrate.

Abstract: The application belongs to the field of biotechnology and microbiology, in particular to a strain of Streptomyces roseoverticillatus (Sr-63) which antagonizes the Rice Bacterial Blight and its application in the prevention and treatment of plant diseases. The application discloses a strain of S. roseoverticillatus (Sr-63) with the accession number CCTCC No.: M 2019261. It is also disclosed the application of the S. roseoverticillatus (Sr-63): used for controlling Rice Bacterial Blight.

Abstract: The present disclosure discloses a Streptomyces antioxidans strain Sa-21, namely, strain Sa-21 with an accession number of CCTCC NO: M 2020423. The present disclosure also discloses the use of the aforementioned Strepiomyces antioxidans strain Sa-21 in inhibition of Alternaria solani (A. solani). The Streptomyces antioxidans strain also has an inhibiting effect on both plant pathogenic fungi and plant pathogenic bacteria.

Abstract: This disclosure provides a deaeration apparatus comprising: a closable deaeration cavity configured to accommodate a liquid to be deaerated; a heating member configured to heat the deaeration cavity; a temperature detection member configured to detect a temperature inside the deaeration cavity; and a controller configured to receive the temperature detected by the temperature detection member and control the heating member based on the temperature. When using in deaeration of a liquid, the deaeration apparatus of the disclosure can shorten the deaeration time and improve the deaeration efficiency of the liquid.

Abstract: The application belongs to the field of biotechnology and microbiology, in particular to a strain of Streptomyces roseoverticillatus (Sr-63) which antagonizes the Rice Bacterial Blight and its application in the prevention and treatment of plant diseases. The application discloses a strain of S. roseoverticillatus (Sr-63) with the accession number CCTCC No.: M 2019261. It is also disclosed the application of the S. roseoverticillatus (Sr-63): used for controlling Rice Bacterial Blight.

Abstract: A bearing device and an ion implantation device are provided. The bearing device includes a bearing table configured to bear a substrate, and a plurality of supporting components configured to support the substrate, each supporting component is movably arranged on the bearing table, to support the substrate at an adjustable position.

Abstract: A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.

Abstract: This disclosure provides a deaeration apparatus comprising: a closable deaeration cavity configured to accommodate a liquid to be deaerated; a heating member configured to heat the deaeration cavity; a temperature detection member configured to detect a temperature inside the deaeration cavity; and a controller configured to receive the temperature detected by the temperature detection member and control the heating member based on the temperature. When using in deaeration of a liquid, the deaeration apparatus of the disclosure can shorten the deaeration time and improve the deaeration efficiency of the liquid.

Abstract: A bearing device and an ion implantation device are provided. The bearing device includes a bearing table configured to bear a substrate, and a plurality of supporting components configured to support the substrate, each supporting component is movably arranged on the bearing table, to support the substrate at an adjustable position.

Abstract: A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.

Abstract: The present invention discloses a via-hole etching method related to semiconductor manufacturing field, and the method overcomes the defects of an uncontrollable end point of a via-hole and an unfavorable profile-angle in a conventional via-hole etching method. The via-hole etching method includes: forming a structure for via-hole etching, includes: a low-temperature poly-silicon layer, a gate insulating layer, a gate metal layer and an interlayer insulating layer, which are sequentially formed on a substrate; forming a mask layer comprising a via-hole masking pattern on the structure for via-hole etching; by using a first etching process, etching the structure for via-hole etching to a first thickness of the gate insulating layer; by using a second etching process, etching the structure for via-hole etching to etch away the remaining thickness of the gate insulating layer, and uncovering the low-temperature poly-silicon layer; removing the mask layer to form a via-hole structure.

Abstract: The present invention discloses a via-hole etching method related to semiconductor manufacturing field, and the method overcomes the defects of an uncontrollable end point of a via-hole and an unfavorable profile-angle in a conventional via-hole etching method. The via-hole etching method includes: forming a structure for via-hole etching, includes: a low-temperature poly-silicon layer, a gate insulating layer, a gate metal layer and an interlayer insulating layer, which are sequentially formed on a substrate; forming a mask layer comprising a via-hole masking pattern on the structure for via-hole etching; by using a first etching process, etching the structure for via-hole etching to a first thickness of the gate insulating layer; by using a second etching process, etching the structure for via-hole etching to etch away the remaining thickness of the gate insulating layer, and uncovering the low-temperature poly-silicon layer; removing the mask layer to form a via-hole structure.

Abstract: A method of selecting at least one trip from a plurality of possible trips, each of the plurality of possible trips being for travel from an origin location and comprising stops at a plurality of destinations. The method is performed in computer apparatus configured to execute the method. The method comprises: determining a fare for each of a plurality of different leg options for each leg, each leg being between one of: the origin location and a destination; and two destinations; selecting a plurality of candidate leg options for each leg based on comparative amounts of the determined fares, the plurality of candidate leg options being fewer in number than the plurality of different leg options; and determining at least one trip based on the plurality of candidate leg options for each leg.