Abstract: A display substrate and a manufacturing method therefor, and a display device. In the display substrate at least one of a plurality of sub-functional film layers in a light-emitting functional layer is disconnected at the positions where the pixel partition structures are located. Each pixel partition structure includes a first subpixel partition part, a second subpixel partition part, and a third subpixel partition part that are stacked in a direction perpendicular to the base substrate. The second subpixel partition part includes a plurality of sub-partition layers stacked in the direction perpendicular to the base substrate. The first subpixel partition part is provided, in an arrangement direction of two adjacent subpixels, with a first protrusion going beyond at least one sub-partition layer. The third subpixel partition part is provided, in the arrangement direction of two adjacent subpixels, with a second protrusion going beyond at least one sub-partition layer.

Abstract: Provided is an order processing including pre-checking a first product order on an online shopping platform to obtain a second product order; determining a target production factory from a plurality of production factories based on product parameters of a target product or an estimated cost; generating a production scheduling order of the target product and sending the production scheduling order to the target production factory; updating the second product order on the online shopping platform based on latest progress information of the production scheduling order obtained from the target production factory; generating a delivery order based on inventory information of the target product after completion of the production scheduling order and sending the delivery order to a logistics platform; and updating the second product order on the online shopping platform based on latest progress information of the delivery order obtained from the logistics platform.

Abstract: The present disclosure provides a semiconductor process device and a wafer transfer system. The wafer transfer system includes a wafer tray and a wafer separation assembly. The wafer tray includes a tray body and a center tray, a tray hole is formed at a center of the tray body penetrating the tray body in a thickness direction, and the center tray is disposed in the tray hole and is detachably placed at the tray body. The wafer separation assembly includes a tray support mechanism and a lifting mechanism, the tray support mechanism is used to support the tray body, the lifting mechanism is used to lift the center tray in the tray hole and to return the center tray back into the tray hole. In the present disclosure, the lifting mechanism of the wafer separation assembly drives the center tray to rise and fall, such that the center tray lifts the wafer on the wafer tray or replaces the wafer.

Abstract: The present disclosure provides a reaction chamber and semiconductor processing equipment. The reaction chamber includes an insulating chamber, a first heating body, a second heating body, and an isolation protection structure. The first heating body and the second heating body are arranged at an interval within the insulating chamber. The second heating body is provided with a carrier device for carrying a wafer. The isolation protection structure is arranged within the insulating chamber, located between the first heating body and the second heating body, forms a reaction space, and isolates the first heating body and the second heating body from the reaction space. An opening is arranged on a side of the isolation protection structure close to the second heating body, and the surface of the carrier device is exposed in the reaction space.