Abstract: The present invention relates to a composition for an organic optoelectronic device, the composition comprising: a first host compound represented by Chemical Formula 1 below; and a second host compound represented by Chemical Formula 2 below, to an organic optoelectronic device using the composition and a display device. The details of Chemical Formulas 1 and 2 above are as defined in the specification.

Abstract: The present invention relates to a composition for an organic optoelectronic device, the composition comprising: a first host compound represented by Chemical Formula 1 below; and a second host compound represented by Chemical Formula 2 below, to an organic optoelectronic device using the composition and a display device. The details of Chemical Formulas 1 and 2 above are as defined in the specification.

Abstract: An evaluation method capable of evaluating whether or not waste plastic-derived porous carbon can be applied on an industrial scale, according to the present disclosure, may include the steps of evaluating CO2 capture performance using a 5-step temperature vacuum swing adsorption (TVSA) process, assessing economic feasibility in an industry using a techno-economic assessment (TEA) method, and quantifying environmental impacts of the porous carbon production pathway and global warming potential (GWP) using cradle-to-gate life-cycle assessment (LCA). A method for manufacturing porous carbon, according to the present disclosure, may include the steps of carbonizing a polyethylene terephthalate plastic, activating the carbonized plastic with CO2, and performing cooling.

Abstract: A distance measuring camera apparatus according to an embodiment of the present invention comprises: a light-emitting unit; and a light-receiving unit including an image sensor. The light-emitting unit comprises: a light source including a light-emitting device; and a diffusion member arranged on the light source and including a plurality of micro-lenses. The diffusion member includes a first region and a second region, wherein the first region surrounds the second region and the second region is arranged such that the center thereof overlaps the light-emitting unit in an optical axis direction. In addition, the diameter of the micro-lens in the second region is smaller than the diameter of the micro-lens in the first region.

Abstract: A light-emitting device package includes a first lead frame; a second lead frame separated from the first lead frame in a first direction; a package body having a cavity exposing a portion of the second lead frame. Further, the cavity includes an inclined inner surface inclining with respect to an upper surface of the second lead frame; a light-emitting diode disposed on the exposed portion of the second lead frame; a hole in the inclined inner surface of the cavity and exposing a portion of the first lead frame; a protection device disposed in the hole and on the exposed portion of the first lead frame; a first wire having a first end connected to the light-emitting diode, and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the protection device, and a second end connected to the exposed portion of the second lead frame.

Abstract: A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.

Abstract: A light emitting device package of an embodiment including a first lead frame; a light emitting device mounted on the first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a protective device mounted on the second lead frame; and a body coupled to the first and second lead frames, wherein the first lead frame includes a first stepped portion disposed along an edge of a lower surface thereof, and the second lead frame includes a third stepped portion disposed along an edge of a lower surface thereof, a mounting region of the protective device which is not overlapped in a vertical direction and spaced apart from the third stepped portion, and a second wire recess portion which is partially overlapped with the third stepped portion in the vertical direction.

Abstract: A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.

Abstract: A light-emitting device package includes a first lead frame; a second lead frame separated from the first lead frame in a first direction; a package body having a cavity exposing a portion of the second lead frame. Further, the cavity includes an inclined inner surface inclining with respect to an upper surface of the second lead frame; a light-emitting diode disposed on the exposed portion of the second lead frame; a hole in the inclined inner surface of the cavity and exposing a portion of the first lead frame; a protection device disposed in the hole and on the exposed portion of the first lead frame; a first wire having a first end connected to the light-emitting diode, and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the protection device, and a second end connected to the exposed portion of the second lead frame.

Abstract: Embodiments relate to a light emitting device package and a lighting device.

Abstract: A light emitting package includes a first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a body coupled to the first lead frame and the second lead frame; and a light emitting element on the first lead frame. The first lead frame includes first to fourth side parts, the first side part includes a first protrusion that protrudes outwards from one side surface of the body, and a first contact part disposed at the end of the first protrusion. The second lead frame includes fifth to eighth side parts, the fifth side part includes a second protrusion that protrudes outwards from a side surface of the body, which is symmetrical to the one side surface of the body, and a second contact part disposed at the end of the second protrusion. Each of the first contact part and the second contact part includes a second layer and first layer covers the second layer.

Abstract: A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.

Abstract: A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.

Abstract: A display device includes a substrate including a first region and a second region, a gate line and a data line on the substrate, a thin film transistor on the substrate, being connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor, wherein the second region has a second contact hole of which an area is larger than that of a first contact hole of the first region.

Abstract: A light emitting package includes a first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a body coupled to the first lead frame and the second lead frame; and a light emitting element on the first lead frame. The first lead frame includes first to fourth side parts, the first side part includes a first protrusion that protrudes outwards from one side surface of the body, and a first contact part disposed at the end of the first protrusion. The second lead frame includes fifth to eighth side parts, the fifth side part includes a second protrusion that protrudes outwards from a side surface of the body, which is symmetrical to the one side surface of the body, and a second contact part disposed at the end of the second protrusion. Each of the first contact part and the second contact part includes a second layer and first layer covers the second layer.

Abstract: A display device includes a substrate including a first region and a second region, a gate line and a data line on the substrate, a thin film transistor on the substrate, being connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor, wherein the second region has a second contact hole of which an area is larger than that of a first contact hole of the first region.

Abstract: A display device is provided. The display device includes a substrate including a pixel region, a thin film transistor formed on the substrate, a light blocking member formed at a boundary of the pixel region, and a pixel electrode formed in the pixel region, the pixel electrode connected to the thin film transistor. The display device also includes a common electrode formed on the light blocking member, the common electrode spaced apart from the pixel electrode with a microcavity interposed between the common electrode and the pixel electrode, and a roof layer comprising a color filter formed on the common electrode. The display device further includes an opening formed in the common electrode and the roof layer to expose a portion of the microcavity, a liquid crystal filling the microcavity, and an overcoat formed on the roof layer to cover the opening and seal the microcavity for each pixel region.

Abstract: A display device includes a substrate including a first region and a second region, a gate line and a data line on the substrate, a thin film transistor on the substrate, being connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor, wherein the second region has a second contact hole of which an area is larger than that of a first contact hole of the first region.

Abstract: A method to manufacture a display device, includes: forming, on a substrate of the display device, a sacrificial layer including a material, the material including at least one of amorphous carbon, a metal, and an inorganic material; forming a layer covering the sacrificial layer; forming an injection hole exposing the sacrificial layer; removing, via the injection hole, the sacrificial layer to form a microcavity; and disposing liquid crystal in the microcavity.

Abstract: A display device includes a substrate including a first region and a second region, a gate line and a data line on the substrate, a thin film transistor on the substrate, being connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor, wherein the second region has a second contact hole of which an area is larger than that of a first contact hole of the first region.