Patents by Inventor Dongik Lee
Dongik Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12191572Abstract: This electronic device comprises: a main frame disposed along a peripheral region of a display and extending along a side region and a rear region of the electronic device; and an antenna module disposed in an inner space of the main frame and configured to radiate a radio signal in a forward direction or a downward direction of the electronic device through the main frame. The antenna module comprises: a first dielectric layer disposed spaced apart from one side of the antenna substrate in a first direction in which antenna elements radiate signals; a second dielectric layer disposed spaced apart from the first dielectric layer in the first direction; and an air gap layer disposed between the first dielectric layer and the second dielectric layer.Type: GrantFiled: August 13, 2021Date of Patent: January 7, 2025Assignee: LG ELECTRONICS INC.Inventors: Seungmin Woo, Yusuhk Suh, Dongik Lee
-
Publication number: 20250007146Abstract: An antenna module implemented in a multi-layered antenna package includes an RFIC; a first dielectric layer; a first coplanar waveguide layer disposed on a top of the first dielectric layer and configured to receive RF signals transmitted by an interface layer of the RFIC; a first antenna portion disposed on the first coplanar waveguide layer and configured to radiate signals transmitted from the first coplanar waveguide layer; a second coplanar waveguide layer disposed on a top of the third dielectric layer and configured to receive RF signals transmitted by the interface layer of the RFIC; and a second antenna portion disposed on the second coplanar waveguide layer to radiate signals transmitted from the second coplanar waveguide layer.Type: ApplicationFiled: June 5, 2024Publication date: January 2, 2025Applicant: LG ELECTRONICS INC.Inventors: Yusuhk SUH, Dongik LEE, Seungmin WOO
-
Publication number: 20240429622Abstract: An antenna module includes a substrate having a first surface, a second surface, and a periphery between the first and second surfaces, a first array antenna disposed on the first surface of the substrate and forming a beam pattern toward a front area, a second array antenna disposed on a first part of the periphery of the substrate and forming a beam pattern toward a bottom area, and third and fourth array antennas disposed on second and third parts of the periphery of the substrate and forming beam patterns toward side areas.Type: ApplicationFiled: May 10, 2024Publication date: December 26, 2024Applicant: LG ELECTRONICS INC.Inventors: Yusuhk SUH, Dongik LEE, Seungmin WOO
-
Publication number: 20240429623Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; and an array antenna portion having a plurality of antenna elements disposed on the PCB. Each of the plurality of antenna elements is configured in a two-patch antenna structure, and a plurality of first patch antennas disposed on a first surface of the PCB are disposed to be spaced apart by a third gap. An area between the plurality of second patch antennas disposed inside the PCB includes a first region in which a plurality of second patch antennas are disposed to be spaced apart by a first gap, and a second region in which the plurality of second patch antennas are disposed to be spaced apart by a second gap.Type: ApplicationFiled: June 5, 2024Publication date: December 26, 2024Applicant: LG ELECTRONICS INC.Inventors: Yusuhk SUH, Dongik LEE, Seungmin WOO
-
Publication number: 20240429621Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion including a plurality of antenna elements disposed on the PCB; a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB, the second surface being another outermost surface of the PCB; and a plurality of signal connection lines connected from the RFIC chip to the array antenna portion. A length of each of the plurality of signal connection lines may be a length of a connection line connected between the RFIC chip and the array antenna portion, and the plurality of signal connection lines may have the same length.Type: ApplicationFiled: April 24, 2024Publication date: December 26, 2024Applicant: LG ELECTRONICS INC.Inventors: Yusuhk SUH, Dongik LEE, Seungmin WOO
-
Patent number: 12173445Abstract: A washing machine which includes a tub, a drum rotatably inside the tub, a pulsator rotatable inside the drum at a bottom of the drum, and an agitator to be connected to an upper portion of the pulsator, where the agitator includes an agitator body, a rinse case to be installed in the agitator body, and to accommodate a rinse, the rinse case being detachable from the agitator body, and a plate spaced from the rinse case along a downward direction of the rinse case, and located lower than a maximum water level of water to be supplied to the tub.Type: GrantFiled: April 4, 2022Date of Patent: December 24, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dongik Lee, Dongwoon Lim, Jeomgap Kim, Sungjong Kim, Jeonggi Hong
-
Publication number: 20240421496Abstract: An electronic device may include a display; and first and second antenna structures disposed around the display. The first antenna structure may include a first PCB, first and second array antennas, and a first wireless communication circuit. The second antenna structure may include a second PCB, third and fourth array antennas, and a second wireless communication circuit. The second and fourth array antennas may form a beam pattern in a first direction, which is a bottom direction. The first and third array antennas may form a beam pattern in a third direction, which is a front direction.Type: ApplicationFiled: April 11, 2024Publication date: December 19, 2024Applicant: LG ELECTRONICS INC.Inventors: Yusuhk SUH, Dongik LEE, Seungmin WOO
-
Publication number: 20240387996Abstract: Provided is an antenna module produced into a multi-layer substrate. The antenna module comprises: a first radiator disposed on an inner area or an upper area of the multi-layer substrate and formed into a first conductive layer to radiate a radio signal; a second radiator disposed in a lower area of the first radiator to be offset from the center of the first radiator, and formed into a second conductive layer to radiate a radio signal; and a feed line connected to the second radiator by means of a signal via, wherein the first radiator and the second radiator overlap on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis may differ from each other.Type: ApplicationFiled: July 29, 2024Publication date: November 21, 2024Applicant: LG ELECTRONICS INC.Inventors: Seungmin WOO, Yusuhk SUH, Dongik LEE
-
Publication number: 20240357028Abstract: An electronic device includes a first housing; a second housing that can be drawn into and out of the first housing; a guide rail connected; and a display module supported by at least one of the first housing or the second housing and having a display region that varies according to the movement of the second housing relative to the first housing. The display module includes a display panel, a support plate positioned on the rear surface of the display panel, and support structures positioned on the rear surface of the support plate. The support structures include a support bar and a guide head positioned at one end of the support bar. The guide head includes a guide portion, which can slide along the guide rail, and an extension portion, which extends from the guide portion and is positioned between one end of the support bar and the support plate.Type: ApplicationFiled: July 2, 2024Publication date: October 24, 2024Inventors: Jinju LEE, Hwamok PAK, Jongkeun KIM, Jinwook BAIK, Minyee AN, Dongik LEE, Sunggun CHO, Wonhee CHOI
-
Patent number: 12119564Abstract: Provided is an antenna module produced into a multi-layer substrate. The antenna module comprises: a first radiator disposed on an inner area or an upper area of the multi-layer substrate and formed into a first conductive layer to radiate a radio signal; a second radiator disposed in a lower area of the first radiator to be offset from the center of the first radiator, and formed into a second conductive layer to radiate a radio signal; and a feed line connected to the second radiator by means of a signal via, wherein the first radiator and the second radiator overlap on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis may differ from each other.Type: GrantFiled: July 29, 2021Date of Patent: October 15, 2024Assignee: LG ELECTRONICS INC.Inventors: Seungmin Woo, Yusuhk Suh, Dongik Lee
-
Publication number: 20240332821Abstract: The antenna module implemented using a multi-layer substrate comprises: a radiator which is arranged in the inner region or the upper region of the multi-layer substrate, and which has at least one conductive layer to radiate a wireless signal; a feeding structure connected to the radiator through a signal via arranged in the lower region of the radiator; a lower ground layer which is arranged in the lower region of the conductive layer constituting the radiator and which operates as a ground for the radiator; and a multi-layer ground structure which is connected to the lower ground layer, and which has end portion positions that differ for each layer of the multi-layer substrate so as to be spaced different distances apart from the radiator for each layer of the multi-layer substrate.Type: ApplicationFiled: November 10, 2021Publication date: October 3, 2024Applicant: LG ELECTRONICS INC.Inventors: Seungmin WOO, Yusuhk SUH, Dongik LEE
-
Patent number: 12079361Abstract: An electronic apparatus is provided. The electronic apparatus according to the disclosure includes: a display, a communication interface comprising communication circuitry, a memory, and a processor. The processor may be configured to: based on acquiring a user command for executing an application stored in the memory, execute the application, based on acquiring a request for access for information stored in the memory through the communication interface while executing the application, acquire access control information of another electronic apparatus related to the electronic apparatus for the application and a relevance between the user and the user of the another electronic apparatus, acquire guide information for guiding a response to the request for access based on the access control information and the relevance, and control the display to display a message including the guide information.Type: GrantFiled: September 20, 2022Date of Patent: September 3, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dongik Lee, Eungjun Kim, Jihoon Park, Junbum Shin, Chungyong Eom, Youngman Jung, Jongmin Choi
-
Publication number: 20240291149Abstract: Provided is an electronic device having an antenna. The electronic device comprises: a radiator configured by stacking metal patterns on different layers of a multi-layer structure; and an antenna module including a feeding unit disposed on a specific layer of the radiator and having a feeding line configured to be connected to the radiator, wherein the radiator includes a first pad connected to the feeding line and a second pad disposed on the first pad, and the first pad and the second pad are connected to each other by a first connection line and a second connection line.Type: ApplicationFiled: May 31, 2021Publication date: August 29, 2024Applicant: LG ELECTRONICS INC.Inventors: Seungmin WOO, Yusuhk SUH, Dongik LEE
-
Publication number: 20240267073Abstract: Disclosed is an electronic device includes a flexible circuit board passing via a first through-hole included in a first housing and a second through-hole included in a second housing, a first support bracket disposed to support the flexible circuit board while covering the first through-hole, a second support bracket disposed to support the flexible circuit board while covering the second through-hole, a first waterproof member disposed to face a partial area of the first through-hole from the first support bracket and inserted into the partial area of the first through-hole, a second waterproof member inserted into the remaining areas of the first through-hole, a third waterproof member disposed to face a partial area of the second through-hole from the second support bracket and inserted into the partial area of the second through-hole, a fourth waterproof member inserted into the remaining areas of the second through-hole.Type: ApplicationFiled: March 7, 2024Publication date: August 8, 2024Inventors: Sunggun CHO, Jongkeun KIM, Wonhee CHOI, Jaehee KIM, Hwamok PARK, Minyee AN, Dongik LEE
-
Publication number: 20240266738Abstract: Provided is an antenna module produced into a multi-layer substrate. The antenna module comprises: a first radiator disposed on an inner area or an upper area of the multi-layer substrate and formed into a first conductive layer to radiate a radio signal; a second radiator disposed in a lower area of the first radiator to be offset from the center of the first radiator, and formed into a second conductive layer to radiate a radio signal; and a feed line connected to the second radiator by means of a signal via, wherein the first radiator and the second radiator overlap on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis may differ from each other.Type: ApplicationFiled: July 29, 2021Publication date: August 8, 2024Applicant: LG ELECTRONICS INC.Inventors: Seungmin WOO, Yusuhk SUH, Dongik LEE
-
Patent number: 12040547Abstract: An electronic device having an antenna according to an embodiment is provided. The electronic device may include a radiator configured by stacking metal patterns on different layers of a multi-layer substrate, and a ground layer arranged on the different layers of the multi-layer substrate and operating as ground for the radiator. At least some of the metal patterns may be vertically interconnected, and any one of the metal patterns may be connected to a feeding pattern.Type: GrantFiled: April 10, 2020Date of Patent: July 16, 2024Assignee: LG ELECTRONICS INC.Inventors: Seungmin Woo, Dongik Lee
-
Patent number: 11990686Abstract: Provided is an electronic device having an antenna according to an embodiment. The electronic device may comprise a first and a second ground plane arranged on different layers of a multi-layer substrate and configured to be connected to each other through vias spaced a predetermined distance apart from each other. The electronic device may comprise a signal line arranged on the same plane as the first ground plane which is disposed at the upper side among the first and the second ground plane. The electronic device may comprise a radiator configured to be electrically connected to the signal line and emit a signal. The first ground plane may be disposed at only one region of one side region and the other side region of the signal line in a predetermined section.Type: GrantFiled: May 22, 2020Date of Patent: May 21, 2024Assignee: LG ELECTRONICS INC.Inventors: Seungmin Woo, Dongik Lee
-
Patent number: 11956002Abstract: Disclosed is an electronic device includes a flexible circuit board passing via a first through-hole included in a first housing and a second through-hole included in a second housing, a first support bracket disposed to support the flexible circuit board while covering the first through-hole, a second support bracket disposed to support the flexible circuit board while covering the second through-hole, a first waterproof member disposed to face a partial area of the first through-hole from the first support bracket and inserted into the partial area of the first through-hole, a second waterproof member inserted into the remaining areas of the first through-hole, a third waterproof member disposed to face a partial area of the second through-hole from the second support bracket and inserted into the partial area of the second through-hole, a fourth waterproof member inserted into the remaining areas of the second through-hole.Type: GrantFiled: February 3, 2022Date of Patent: April 9, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Sunggun Cho, Jongkeun Kim, Wonhee Choi, Jaehee Kim, Hwamok Park, Minyee An, Dongik Lee
-
Publication number: 20230371192Abstract: According to an embodiment of the present disclosure, an electronic apparatus comprises: a housing; a first connector positioned on a printed circuit board accommodated in the housing and comprising a first hole configured to receive a first external connector; a second connector comprising a second hole configured to receive a second external connector; a first seal having a ring shape positioned in the first connector around the first hole; and a second seal having a ring shape positioned in the second connector around the second hole, wherein, based on the first seal being compressed in a first direction by the housing, the second seal may be compressed by the housing in a second direction perpendicular to the first direction.Type: ApplicationFiled: July 27, 2023Publication date: November 16, 2023Inventors: Sunggun CHO, Dongik LEE, Minyee AN, Wonhee CHOI, Hyunseung YOON, Heekang YUN, Waneui JUNG
-
Patent number: 11777551Abstract: Provided is an electronic device having an antenna module according to one embodiment. The electronic device comprises: a transceiver circuit disposed in the antenna module composed of a multi-layer substrate; a first transmission line disposed on the first layer of the antenna module and configured to be electrically connected to the transceiver circuit; a second transmission line disposed on the second layer of the antenna module and configured to be electrically connected to the antenna; and a vertical via configured to vertically connect the first transmission line and the second transmission line, wherein at least one of the first and second transmission lines connected to the vertical via has an impedance converter.Type: GrantFiled: July 20, 2021Date of Patent: October 3, 2023Assignee: LG ELECTRONICS INC.Inventors: Seungmin Woo, Yusuhk Suh, Dongik Lee