Abstract: A metal oxide varistor (MOV) includes an MOV body, a first electrode, a second electrode, and a thermal cut-off insulation shell. The MOV body is a crystalline microstructure with zinc oxide mixed with one or more other metal oxides. The first electrode is adjacent one side of the MOV body and is connected to a first radial lead. The second electrode is adjacent a second side of the MOV body and is connected to a second radial lead having a curved portion. The thermal cut-off insulation shell is adjacent the second electrode and has a protrusion, with the curved portion of the second radial lead being adjacent the protrusion.

Abstract: A metal oxide varistor (MOV) includes an MOV body, a first electrode, a second electrode, and a thermal cut-off (TCO). The MOV body is a crystalline microstructure with zinc oxide mixed with one or more metal oxides. The first electrode is adjacent a first side of the MOV body and is connected to a first radial lead. The second electrode is adjacent a second side of the MOV body and is connected to a second radial lead. The TCO is adjacent the second electrode and consists of solder paste with at least one core. The at least one core is a solid at a first temperature and a liquid at a second temperature.

Abstract: A surge protection device includes a metal terminal and a spring. The metal terminal is located between two metal oxide varistors, where the metal terminal extends beyond the metal oxide varistors. The spring has a flat surface that is connected to the metal terminal using a soldering paste. The flat surface has a bend on one end which forms a gap between the flat surface and the metal terminal.

Abstract: A flat spring (100) is disclosed, for use in a surge protection device (SPD) such as a fast activation thermal fuse, to be integrated with a thermal metal oxide varistor (TMOV). The flat spring (100) has a V-shaped protrusion (110) to enable ultra-high short circuit current protection under overvoltage condition.

Abstract: Disclosed are various pallet assemblies for arc spray applications. In some embodiments, an assembly may include a top frame comprising a plurality of recesses each operable to receive an electronic device, and a bottom frame coupled to the top frame, wherein the bottom frame comprises a plurality of support structures, and wherein each support structure of the plurality of support structures is aligned with a corresponding recess of the plurality of recesses. The assembly may further include a mechanical device coupled to the top frame and the bottom frame, wherein the mechanical device is operable to bias the top frame and the bottom frame relative to one another.

Abstract: A spray coating protection method for electronic devices during metallic particle deposition via spraying is disclosed. The spray coating protection method enables selectivity over the size and location of particle deposition. The spray coating protection method is easy for an automation application, in which multiple electronic devices are processed simultaneously, and is suitable for electronic devices of different shapes and sizes. The spray coating protection method provides resistance to high temperature and high pressure during the spraying operation. The spray coating protection method utilizes masking paper, but additional film materials may be used, both to increase the protective strength of the mask and to enable easy placement and subsequent peel off of the masking paper following the spraying process. The masking paper may be made using a die cutting process and is easily placed onto the electronic device surface to ensure zero contamination from hot and high pressure spray particles.

Abstract: Provided herein are thermally protected varistor (TPV) devices including a varistor body and a terminal assembly directly coupled together. The terminal assembly may include a housing, wherein an opening is provided in a base of the housing. A lead is coupleable with the varistor body via a thermal linking material positioned within the opening of the base, the thermal linking material operable to maintain direct physical contact with the lead when the thermal linking material is below a melting point. The terminal assembly may further include a shield slidable within the housing between a first position and a second position, wherein in the first position the shield is positioned adjacent the thermal linking material, and in the second position the shield is positioned between the lead and the second side of the varistor body. The shield includes a tab for releasably coupling the shield to the housing.

Abstract: A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

Abstract: Provided herein are thermally protected varistor (TPV) devices including a varistor body and a terminal assembly directly coupled together. The terminal assembly may include a housing, wherein an opening is provided in a base of the housing. A lead is coupleable with the varistor body via a thermal linking material positioned within the opening of the base, the thermal linking material operable to maintain direct physical contact with the lead when the thermal linking material is below a melting point. The terminal assembly may further include a shield slidable within the housing between a first position and a second position, wherein in the first position the shield is positioned adjacent the thermal linking material, and in the second position the shield is positioned between the lead and the second side of the varistor body. The shield includes a tab for releasably coupling the shield to the housing.

Abstract: An overheat protection device and a varistor are provided. The overheat protection device comprises: a first electrode and a second electrode disposed to be spaced apart; a hot-melt wire located between the first electrode and the second electrode, the hot-melt wire being in electrical contact with the first electrode and the second electrode; and an insulator supporting the first electrode and the second electrode, wherein the hot-melt wire is melted into a liquid hot-melt material when the ambient temperature reaches a predetermined temperature, the liquid hot-melt material wets the first electrode and the second electrode, and the liquid hot-melt material does not wet the insulator at least at a portion located between the first electrode and the second electrode.

Abstract: An overheat protection device and a varistor are provided. The overheat protection device comprises: a first electrode and a second electrode disposed to be spaced apart; a hot-melt wire located between the first electrode and the second electrode, the hot-melt wire being in electrical contact with the first electrode and the second electrode; and an insulator supporting the first electrode and the second electrode, wherein the hot-melt wire is melted into a liquid hot-melt material when the ambient temperature reaches a predetermined temperature, the liquid hot-melt material wets the first electrode and the second electrode, and the liquid hot-melt material does not wet the insulator at least at a portion located between the first electrode and the second electrode.

Abstract: An electric device is disclosed. In an embodiment, the device includes an electric element having an element terminal and a conductive spring being deflected, the spring being electrically coupled to the element terminal by a fusible joint. The device further includes a switch including a first monitor terminal and a second monitor terminal, the switch having a state that is changeable between a first connection state, where the first monitor terminal and the second monitor terminal are electrically coupled, and a second connection state, where the first monitor terminal and the second monitor terminal are electrically decoupled, and wherein the electrical device is configured such that when the joint fuses, the spring relaxes, thereby decoupling the spring and the element terminal and changing the state of the switch.

Abstract: An electric device includes an electric element having an element terminal and a conductive spring being deflected. The spring is electrically coupled to the element terminal by a fusible joint. A switch includes a first monitor terminal and a second monitor terminal. The state of the switch is changeable between a first connection state, where the first monitor terminal and the second monitor terminal are electrically coupled, and a second connection state, where the first monitor terminal and the second monitor terminal are electrically decoupled. When the joint fuses, the spring relaxes, thereby decoupling the spring and the element terminal and changing the state of the switch.

Abstract: A resistor includes a ceramic body, metal electrodes on sides of the ceramic body, each of which is connected to an electrode lead, and an insulating layer contacting a metal electrode among the metal electrodes. The insulating layer is meltable in response to heat. A conductive connector contacts the insulating layer above the metal electrode and is configured to short the metal electrodes when the insulating layer melts.

Abstract: A new voltage dependent resistor with overheated protection structure. The said voltage dependent resistor includes a ceramic body. Metal electrodes are set at the two opposite sides of the ceramic body, and each of the metal electrodes is connected to one electrode lead. The said voltage dependent resistor further includes a conductive connector structure which can connect the two metal electrodes when a heat-fusing insulating layer that is set between the conductive IN connector structure and the metal electrodes is melt down.