Patents by Inventor Dong Jin SON
Dong Jin SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240143120Abstract: The present invention relates to a touch screen panel and a manufacturing method therefor, wherein a black matrix pattern is formed after a black matrix layer is formed on an electrode layer, and the electrode layer is etched using the black matrix pattern to form an electrode pattern. Thus, the touch screen panel includes a structure in which a black matrix having a pattern corresponding to the electrode pattern is disposed on an electrode.Type: ApplicationFiled: April 13, 2022Publication date: May 2, 2024Inventors: Sang-Jin PARK, Dong-Jin SON, Jin-Ho BAE
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Publication number: 20240129725Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.Type: ApplicationFiled: December 23, 2021Publication date: April 18, 2024Applicant: ESTORM CO., LTD.Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
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Publication number: 20240117084Abstract: A curable composition is provided. The curable composition can eliminate or minimize the generation of bubbles inside the cured product after the initiation reaction of the curable monomer, prevent expansion of a material when used to encapsulate a device, and provide a uniform cured product to solve the problem of separation between the upper and lower substrates bonded together, thereby improving device encapsulation performance.Type: ApplicationFiled: September 11, 2023Publication date: April 11, 2024Inventors: Young Jin KWON, Seong Chan SON, Jin Wuk KIM, Dong Min KIM, Ja Hun BYEON
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Publication number: 20240117930Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.Type: ApplicationFiled: March 10, 2023Publication date: April 11, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
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Publication number: 20240117941Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.Type: ApplicationFiled: March 10, 2023Publication date: April 11, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
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Publication number: 20240117466Abstract: Proposed is a method of selectively leaching lithium (Li) and aluminum (Al) from a mixed carbonate precipitate (MCP) and, more specifically, a method of selectively leaching Li and Al from an MCP, by which a high-purity MCP can be prepared through selective leaching of Li and Al contained in an MCP used as a raw material for recovering valuable metals including nickel (Ni), cobalt (Co), and manganese (Mn).Type: ApplicationFiled: January 26, 2022Publication date: April 11, 2024Inventors: Dong Hee KIM, Woo Jin KIM, Se Il SON
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Patent number: 11948808Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: December 6, 2021Date of Patent: April 2, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Publication number: 20240072330Abstract: An eco-friendly power source, such as a battery module for a transportation vehicle includes a first sub-module and a second sub-module each including a plurality of battery cells; a lower cover supporting the first sub-module and the second sub-module; a connection member coupled to the first sub-module and the second sub-module, respectively; and a cooling plate coupled to the lower cover and forming a flow path through which a refrigerant can flow, wherein at least a portion of the flow path is disposed to oppose the connection member with the lower cover interposed therebetween.Type: ApplicationFiled: March 15, 2023Publication date: February 29, 2024Inventors: Ho Yeon KIM, Myeong Jin SON, Sang Tae AN, Hwa Kyoo YOON, Gang U LEE, Dong Ha HWANG
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Publication number: 20240014431Abstract: A fuel cell of the present disclosure includes a cell stack including a plurality of unit cells stacked in a first direction, an end plate disposed on each of two ends of the cell stack and including a metal portion subjected to molecular adhesion surface treatment and a resin portion disposed on at least a portion of the surface of the metal portion, an enclosure coupled to the end plate to envelop the cell stack, and an outer gasket disposed between the enclosure and the end plate and being in contact with the metal portion of the end plate.Type: ApplicationFiled: March 30, 2023Publication date: January 11, 2024Inventors: Jae Min Ahn, Yong Suk Heo, Dong Jin Son, Yong Woo Choi
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Patent number: 11714512Abstract: A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including a visual area, a bending area and a pad area, a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer, supporting structure covering the touch sensor layer on the bending area, and an optical layer disposed on the visual area of the touch sensor layer. The optical layer partially covers the supporting structure on a portion of the bending area adjacent to the visual area.Type: GrantFiled: July 27, 2020Date of Patent: August 1, 2023Assignee: DONGWOO FINE-CHEM CO., LTD.Inventors: Dong Jin Son, Beom Cheol Kim
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Publication number: 20230221632Abstract: The present disclosure relates to an exposure pattern, an exposure mask, and a method for forming an exposure pattern by the same, and the exposure pattern is an exposure pattern formed by a division exposure, and is characterized by that, in an area where a first exposure area formed by the first exposure and a second exposure area formed by the second exposure overlap each other, an area of a first unit pattern area constituting the first exposure area and an area of a second unit pattern area constituting the second exposure area are different from each other.Type: ApplicationFiled: April 6, 2021Publication date: July 13, 2023Inventors: Jun-Gu LEE, Jun-Ha KIM, Dong-Jin SON, Min-Seok JANG
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Patent number: 11537243Abstract: A touch sensor module includes a touch sensor layer including a visual area, a bending area and a pad area, a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer, a supporting structure partially covering the flexible circuit board and the touch sensor layer, an optical layer disposed on the visual area of the touch sensor layer, the optical layer being spaced apart from the supporting structure in a horizontal direction such that a gap is formed between the optical layer and the supporting structure, a filling layer at least partially filling the gap, and an adhesive layer formed on a bottom surface of a portion of the touch sensor layer in the visual area.Type: GrantFiled: July 31, 2020Date of Patent: December 27, 2022Assignee: DONGWOO FINE-CHEM CO., LTD.Inventors: Dong Jin Son, Duck Kyeom Kim
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Patent number: 11445615Abstract: The present invention relates to a touch sensor module and an image display device including the same. The touch sensor module includes a touch sensor including pad portions, a flexible printed circuit board (FPCB) including terminal portions, and a solder joint interposed between the touch sensor and the flexible printed circuit board, in which the solder joint includes a solder paste including solder balls and a flux, the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing, the flux is used in an amount of 5 to 40 wt % based on the total weight of the solder paste, and the ratio of the diameter of the solder balls included in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit board is 1:0.2-0.6.Type: GrantFiled: February 24, 2021Date of Patent: September 13, 2022Assignee: Dongwoo Fine-Chem Co., Ltd.Inventors: Jun-Ha Kim, Dong-Jin Son
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Patent number: 11402934Abstract: A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of a top surface of the touch sensor layer, a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer, and an adhesive layer formed on at least one surface of the touch sensor layer. The adhesive layer has a flexural rigidity in a range from 0.01 to 5 N·nm. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer are prevented by the supporting structure.Type: GrantFiled: December 10, 2020Date of Patent: August 2, 2022Assignee: DONGWOO FINE-CHEM CO., LTD.Inventors: Hye Rim Kwon, Tae Bong Kim, Dong Jin Son, Sung Woo Yu, Min Ho Lim
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Patent number: 11314352Abstract: A flexible display module according to an embodiment of the present invention includes a display panel, a touch sensor layer disposed on the display panel, the touch sensor layer including sensing electrodes and traces that extend from the sensing electrodes, a combining layer by which the display panel and the touch sensor layer are combined with each other, the combining layer having an elastic modulus in a range from 0.1 to 5 MPa and a moisture permeability in a range from 500 g/m2·24 hr or less, a flexible circuit board electrically connected to the traces at an end portion of the touch sensor layer, and an upper supporting structure that commonly and partially covers the flexible circuit board and the touch sensor layer. End portions of the display panel and the touch sensor layer are bent together with the upper supporting structure.Type: GrantFiled: January 11, 2021Date of Patent: April 26, 2022Assignee: DONGWOO FINE-CHEM CO., LTD.Inventors: Hye Rim Kwon, Dong Jin Son, Jin Woo Lee
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Patent number: 11182032Abstract: A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of the touch sensor layer, and a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer is prevented by the supporting structure.Type: GrantFiled: December 7, 2020Date of Patent: November 23, 2021Assignee: DONGWOO FINE-CHEM CO., LTD.Inventors: Hye Rim Kwon, Sung Woo Yu, Dong Jin Son, Jin Woo Lee
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Publication number: 20210289635Abstract: The present invention relates to a touch sensor module and an image display device including the same. The touch sensor module includes a touch sensor including pad portions, a flexible printed circuit board (FPCB) including terminal portions, and a solder joint interposed between the touch sensor and the flexible printed circuit board, in which the solder joint includes a solder paste including solder balls and a flux, the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing, the flux is used in an amount of 5 to 40 wt % based on the total weight of the solder paste, and the ratio of the diameter of the solder balls included in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit board is 1:0.2-0.6.Type: ApplicationFiled: February 24, 2021Publication date: September 16, 2021Applicant: Dongwoo Fine-Chem Co., Ltd.Inventors: Jun-Ha Kim, Dong-Jin Son
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Publication number: 20210132724Abstract: A flexible display module according to an embodiment of the present invention includes a display panel, a touch sensor layer disposed on the display panel, the touch sensor layer including sensing electrodes and traces that extend from the sensing electrodes, a combining layer by which the display panel and the touch sensor layer are combined with each other, the combining layer having an elastic modulus in a range from 0.1 to 5 MPa and a moisture permeability in a range from 500 g/m2·24 hr or less, a flexible circuit board electrically connected to the traces at an end portion of the touch sensor layer, and an upper supporting structure that commonly and partially covers the flexible circuit board and the touch sensor layer. End portions of the display panel and the touch sensor layer are bent together with the upper supporting structure.Type: ApplicationFiled: January 11, 2021Publication date: May 6, 2021Inventors: Hye Rim KWON, Dong Jin SON, Jin Woo LEE
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Patent number: 10976844Abstract: Provided herein is a touch sensor including: a substrate having a transmittance of 5% or less at a wavelength of 380 nm; a touch sensor layer configured to be opposite the substrate and having a thickness of 2 ?m to 10 ?m; and an adhesive layer disposed between the substrate and the touch sensor layer, wherein the adhesive layer includes a cured product of an adhesive composition including at least one selected from the group consisting of an initiator and a sensitizer having an absorption wavelength in the range of 380 nm to 450 nm and has an adhesion strength of 5 N/25 trim or more. There is an advantageous effect in that the provided film-type touch sensor represents excellent adhesion and folding characteristics even when the substrate has a relative low transmittance.Type: GrantFiled: September 20, 2018Date of Patent: April 13, 2021Assignee: DONGWOO FINE-CHEM. CO, LTD.Inventors: Myung Young An, Dong Jin Son
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Publication number: 20210096668Abstract: A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of a top surface of the touch sensor layer, a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer, and an adhesive layer formed on at least one surface of the touch sensor layer. The adhesive layer has a flexural rigidity in a range from 0.01 to 5 N·nm. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer are prevented by the supporting structure.Type: ApplicationFiled: December 10, 2020Publication date: April 1, 2021Inventors: Hye Rim KWON, Tae Bong KIM, Dong Jin SON, Sung Woo YU, Min Ho LIM