Patents by Inventor Dong-Jun Jung
Dong-Jun Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240129725Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.Type: ApplicationFiled: December 23, 2021Publication date: April 18, 2024Applicant: ESTORM CO., LTD.Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
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Publication number: 20240128136Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.Type: ApplicationFiled: February 16, 2023Publication date: April 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
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Publication number: 20240114778Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: ApplicationFiled: August 14, 2023Publication date: April 4, 2024Inventors: So-Young JUNG, Hyo-Nim SHIN, Seung-Hyun YOON, Hyun-Ju KANG, Ye-Jin JEON, Tae-Jun HAN, Mi-Ja LEE, Dong-Gil KIM, Sang-Hee CHO
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Patent number: 11929206Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.Type: GrantFiled: September 16, 2021Date of Patent: March 12, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jun Jung, Yun Kim, Hyun Kim, Sim Chung Kang, Eun Jung Lee
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Publication number: 20240075853Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.Type: ApplicationFiled: April 13, 2023Publication date: March 7, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
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Patent number: 11923144Abstract: A multilayer ceramic electronic component includes: a body including dielectric layers as well as a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween and including a first metal; and external electrodes disposed on external surfaces of the body including a second metal, wherein at least some of the plurality of internal electrodes include a core-shell region including the first and second metals, and average contents of the second metal in a core portion and a shell portion of the core-shell region are different from each other.Type: GrantFiled: April 6, 2022Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Kim, Dong Jun Jung, Dae Hee Lee, Soo Jeong Jo
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Publication number: 20230411080Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.Type: ApplicationFiled: August 30, 2023Publication date: December 21, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jun JUNG, Dae Hee LEE, Hyun KIM, Yun KIM
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Publication number: 20230360855Abstract: A multilayer electronic component including a dielectric layer is provided. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-interface shell-shell structure. The dielectric grain having the core-interface shell-shell structure includes a perovskite (BaTiO3) -based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn). An average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.Type: ApplicationFiled: April 17, 2023Publication date: November 9, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Geon YOO, Su Been KIM, Dong Jun JUNG
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Patent number: 11784004Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.Type: GrantFiled: August 19, 2021Date of Patent: October 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jun Jung, Dae Hee Lee, Hyun Kim, Yun Kim
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Publication number: 20230215631Abstract: A multilayer ceramic electronic component includes: a body including dielectric layers as well as a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween and including a first metal; and external electrodes disposed on external surfaces of the body including a second metal, wherein at least some of the plurality of internal electrodes include a core-shell region including the first and second metals, and average contents of the second metal in a core portion and a shell portion of the core-shell region are different from each other.Type: ApplicationFiled: April 6, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Kim, Dong Jun Jung, Dae Hee Lee, Soo Jeong Jo
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Patent number: 11618716Abstract: A manufacturing method of a dielectric ceramic composition includes attaching a reactive functional group to a surface of a base material powder particle of a perovskite structure.Type: GrantFiled: March 31, 2020Date of Patent: April 4, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Geon Lee, Hae Suk Chung, Yoon Soo Park, Dong Jun Jung, Yun Jung Park
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Publication number: 20230093711Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABO3 as a main phase, and includes a region in which Dy is dissolved. In the region in which Dy is dissolved, an atomic ratio of a content of Dy dissolved in an A-site of the perovskite structure to a content of Dy dissolved in a B-site is 1.6 or more and 2.0 or less.Type: ApplicationFiled: April 6, 2022Publication date: March 23, 2023Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Dong Jun JUNG, Hye Jin JEONG, Zhipeng WANG, Jin Wan PARK, Min Hoe KIM, Jong Ho LEE, Sang Ho OH
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Publication number: 20230088775Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABO3 as a main phase, and includes a region in which Dy is solid solubilized. In the region in which the Dy is solid solubilized, an X-ray count of Dy solid-solubilized in an A-site of the perovskite structure measured by using Scanning Transmission Electron Microscopy-Energy Dispersive X-ray Spectroscopy (STEM-EDS) is AD, an X-ray count of Dy solid-solubilized in a B-site of the perovskite structure is BD, and an average value of AD/BD is 1.6 or more and 2.0 or less.Type: ApplicationFiled: September 15, 2022Publication date: March 23, 2023Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Dong Jun JUNG, Hye Jin JEONG, Zhipeng WANG, Jin Wan PARK, Min Hoe KIM, Sang Ho OH, Jong Ho LEE
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Publication number: 20220223344Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.Type: ApplicationFiled: September 16, 2021Publication date: July 14, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jun Jung, Yun Kim, Hyun Kim, Sim Chung Kang, Eun Jung Lee
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Publication number: 20220130615Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.Type: ApplicationFiled: August 19, 2021Publication date: April 28, 2022Inventors: Dong Jun JUNG, Dae Hee LEE, Hyun KIM, Yun KIM
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Patent number: 11201012Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer disposed between two internal electrodes. The dielectric layer includes a plurality of dielectric grains. A grain boundary between at least two dielectric grains of the plurality of dielectric grains has a ratio Si/Ni of a weight of Si to a weight of Ni in the grain boundary that is at least 1 and 6 or less.Type: GrantFiled: December 19, 2019Date of Patent: December 14, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Myoung Yun, Jae Sung Park, Dong Jun Jung
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Publication number: 20210188713Abstract: A manufacturing method of a dielectric ceramic composition includes attaching a reactive functional group to a surface of a base material powder particle of a perovskite structure.Type: ApplicationFiled: March 31, 2020Publication date: June 24, 2021Inventors: Chang Geon LEE, Hae Suk CHUNG, Yoon Soo PARK, Dong Jun JUNG, Yun Jung PARK
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Publication number: 20200258684Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer disposed between two internal electrodes. The dielectric layer includes a plurality of dielectric grains. A grain boundary between at least two dielectric grains of the plurality of dielectric grains has a ratio Si/Ni of a weight of Si to a weight of Ni in the grain boundary that is at least 1 and 6 or less.Type: ApplicationFiled: December 19, 2019Publication date: August 13, 2020Inventors: Ki Myoung Yun, Jae Sung Park, Dong Jun Jung
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Patent number: 10358388Abstract: A multilayer electronic component includes: a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein each of the dielectric layers includes BamTiO3 and includes a plurality of grains and grain boundaries formed between adjacent grains, and a sum of contents of Si and Dy in the grain boundary is 10 to 15 parts by weight.Type: GrantFiled: February 6, 2018Date of Patent: July 23, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Myoung Yun, Dong Jun Jung, Jae Sung Park, Tae Young Ham, Hyung Soon Kwon, Jong Han Kim, Hyoung Uk Kim
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Publication number: 20190135701Abstract: A multilayer electronic component includes: a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein each of the dielectric layers includes BamTiO3 and includes a plurality of grains and grain boundaries formed between adjacent grains, and a sum of contents of Si and Dy in the grain boundary is 10 to 15 parts by weight.Type: ApplicationFiled: February 6, 2018Publication date: May 9, 2019Inventors: Ki Myoung YUN, Dong Jun JUNG, Jae Sung PARK, Tae Young HAM, Hyung Soon KWON, Jong Han KIM, Hyoung Uk KIM