Patents by Inventor Dongkun LIU

Dongkun LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289677
    Abstract: The present disclosure relates to display panels and display devices. A display panel has a display area and a package area surrounding the display area. The display panel includes a substrate and a package cover plate bonded to the substrate in the package area via a package material melted by laser irradiation. The display area is provided with at least one mounting hole having a hole wall, and at least a portion of the hole wall of the mounting hole is coated with the package material. A protective pattern layer disposed between at least a portion of a boundary of the package area and the mounting hole is further included for blocking at least a portion of a laser beam during a movement of the laser beam from the package area to the mounting hole.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: March 29, 2022
    Assignee: YUNGU (GU'AN) TECHNOLOGY CO., LTD.
    Inventors: Zhenhua Xing, Jinqiang Liu, Jiamei Du, Yaoyan Wu, Yawei Liu, Dongkun Liu
  • Patent number: 11256380
    Abstract: The present application provides a touch panel, a method for manufacturing the same and a display device. The touch panel includes a substrate and a metal nanowire conductive layer and an adhesion enhancement layer stacked on the substrate, the adhesion enhancement layer increases the adhesiveness between the substrate and the metal nanowire conductive layer; the adhesion enhancement layer has a stereo three-dimensional network structure capable of preventing agglomeration of the adhesion enhancement layer and formation of dead volume that leads to reduction in the conductivity of the metal nanowire conductive layer.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: February 22, 2022
    Assignee: YUNGU (GU'AN) TECHNOLOGY CO., LTD.
    Inventors: Jiamei Du, Dongkun Liu, Jinqiang Liu, Yawei Liu, Yaoyan Wu
  • Publication number: 20210367201
    Abstract: Disclosed is a thin film packaging structure, a thin film packaging method, and a display panel. The thin film packaging structure (100) includes at least two laminated inorganic packaging layers (110, 130), an organic packaging layer (120) and an enhancing sealing structure (140). The organic packaging layer is disposed between two adjacent inorganic packaging layers (110, 130). The enhancing sealing structure (140) is disposed surrounding the organic packaging layer (120).
    Type: Application
    Filed: November 19, 2018
    Publication date: November 25, 2021
    Inventors: Yaoyan WU, Yawei LIU, Jinqiang LIU, Jiamei DU, Dongkun LIU
  • Publication number: 20210367200
    Abstract: The present disclosure relates to display panels and display devices. A display panel has a display area and a package area surrounding the display area. The display panel includes a substrate and a package cover plate bonded to the substrate in the package area via a package material melted by laser irradiation. The display area is provided with at least one mounting hole having a hole wall, and at least a portion of the hole wall of the mounting hole is coated with the package material. A protective pattern layer disposed between at least a portion of a boundary of the package area and the mounting hole is further included for blocking at least a portion of a laser beam during a movement of the laser beam from the package area to the mounting hole.
    Type: Application
    Filed: January 11, 2019
    Publication date: November 25, 2021
    Inventors: Zhenhua XING, Jinqiang LIU, Jiamei DU, Yaoyan WU, Yawei LIU, Dongkun LIU
  • Publication number: 20200125198
    Abstract: The present application provides a touch panel, a method for manufacturing the same and a display device. The touch panel includes a substrate and a metal nanowire conductive layer and an adhesion enhancement layer stacked on the substrate, the adhesion enhancement layer increases the adhesiveness between the substrate and the metal nanowire conductive layer; the adhesion enhancement layer has a stereo three-dimensional network structure capable of preventing agglomeration of the adhesion enhancement layer and formation of dead volume that leads to reduction in the conductivity of the metal nanowire conductive layer.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Inventors: Jiamei DU, Dongkun LIU, Jinqiang LIU, Yawei LIU, Yaoyan WU