Abstract: A sensor cleaning apparatus for a vehicle includes: a sensor housing in which a driver and a sensor are mounted, a cover part configured to rotate and exposed to the outside of the sensor housing through an open region formed on a front surface of the sensor housing, and a blade part connected to the cover part. The blade is rotated as the driver is driven and provided to allow air generated by its rotation to flow toward a front surface and a rear surface of the cover.

Abstract: The present invention relates to a three-dimensional reconstructing method of a 2D medical image. A three-dimensional reconstructing device includes: a communicator for receiving sequential 2D images with an arbitrary slice gap; a sliced image generator for generating at least one sliced image positioned between the 2D images based on a feature point of the adjacent 2D images; and a controller for reconstructing the 2D image into a 3D image by use of the generated sliced image and providing the 3D image.

Abstract: A semiconductor package including a semiconductor chip on a package substrate, a transparent substrate on the semiconductor chip, an attachment dam between the semiconductor chip and the transparent substrate, the attachment dam extending along an edge of the semiconductor chip, a first molding layer on the package substrate and surrounding a side surface of the semiconductor chip and including a first epoxy resin, and a second molding layer on the package substrate and filling a space between the semiconductor chip and the first molding layer and including a second epoxy resin. The first epoxy resin includes a first filler containing at least one of silica or alumina. The second epoxy resin includes a second filler containing at least one of silica or alumina. The content of the second filler in the second epoxy resin is greater than a content of the first filler in the first epoxy resin.

Abstract: There is provided a multi-scale object detection device. The device includes an image frame acquisition unit for acquiring a plurality of consecutive image frames, a critical region extractor for extracting at least one second critical region from a current image frame based on at least one first critical region extracted from a previous image frame among the consecutive image frames, a multi-scale object detector whose operation involves a first object detection process for the current image frame and a second object detection process for the at least one second critical region, and an object detection integration unit for integrating the results of the first and second object detection processes.

Abstract: The present invention relates to a method for manufacturing a core plug of a gas turbine vane, and more particularly to plan and design a core plug formation using brazing comprising: a first step of designing and planning a formation of a core plug; a second step of cutting a Hastelloy X plate according to the design of the core plug; a third step of fabricating a preform of the core plug; a fourth step of spot-welding a trailing edge; a fifth step of pasting a brazing filler; a sixth step of performing brazing heat treatment; a seventh step of performing grinding a brazed portion; an eighth step of performing a grit blasting. According to the method for manufacturing a core plug of a gas turbine vane using brazing of the present invention above-mentioned, there is a significant effect of reducing manufacturing cost by in which the process is simple, and there is no deformation, shrinkages, cracks, and the like, in contrast with a conventional welding method.

Abstract: The present invention relates to a fundus imaging device having an automatic focusing function, by which even a user, who is not a skilled expert, may easily photograph a fundus image, and interpret and analyze the photographed image to predict a degree of risk, the fundus imaging device controlling a focusing unit to adjust a focus of a pupil image received from a pupil imaging unit, and controlling a fundus imaging unit to photograph a fundus image when the pupil image is in focus.

Abstract: A semiconductor package comprises a package substrate, a semiconductor chip mounted on the package substrate, a transparent substrate disposed on the semiconductor chip, an attachment dam between the semiconductor chip and the transparent substrate, the attachment dam extending along an edge of the semiconductor chip to define a gap between the semiconductor chip and the transparent substrate, a first molding layer on the package substrate, the first molding layer surrounding a side surface of the semiconductor chip and including a first epoxy resin composition, and a second molding layer on the package substrate, the second molding layer filling a space between the semiconductor chip and the first molding layer and including a second epoxy resin composition, wherein the first epoxy resin composition includes a first filler containing at least one of silica or alumina, the second epoxy resin composition includes a second filler containing at least one of silica or alumina, and a content of the second filler w

Abstract: A method of manufacturing a semiconductor package includes forming a first redistribution structure, forming a plurality of conductive pillars on the first redistribution structure, mounting the first semiconductor chip on the first redistribution structure, forming an encapsulant configured to cover an upper surface of the first redistribution structure, the plurality of conductive pillars, and the first semiconductor chip, planarizing the encapsulant, exposing the plurality of conductive pillars by forming an opening in the planarized encapsulant, and forming a second redistribution structure connected to the plurality of conductive pillars on the first semiconductor chip and the encapsulant. Upper surfaces of the plurality of conductive pillars are located at a lower level than the upper surface of the first semiconductor chip, and an upper surface of a connection via included in the second redistribution structure has a width greater than a width of a lower surface of the connection via.

Abstract: A method of manufacturing a semiconductor package includes forming a first redistribution structure, forming a plurality of conductive pillars on the first redistribution structure, mounting the first semiconductor chip on the first redistribution structure, forming an encapsulant configured to cover an upper surface of the first redistribution structure, the plurality of conductive pillars, and the first semiconductor chip, planarizing the encapsulant, exposing the plurality of conductive pillars by forming an opening in the planarized encapsulant, and forming a second redistribution structure connected to the plurality of conductive pillars on the first semiconductor chip and the encapsulant. Upper surfaces of the plurality of conductive pillars are located at a lower level than the upper surface of the first semiconductor chip, and an upper surface of a connection via included in the second redistribution structure has a width greater than a width of a lower surface of the connection via.

Abstract: A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

Abstract: A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.

Abstract: A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.

Abstract: A method of manufacturing a semiconductor package includes forming a first redistribution structure, forming a plurality of conductive pillars on the first redistribution structure, mounting the first semiconductor chip on the first redistribution structure, forming an encapsulant configured to cover an upper surface of the first redistribution structure, the plurality of conductive pillars, and the first semiconductor chip, planarizing the encapsulant, exposing the plurality of conductive pillars by forming an opening in the planarized encapsulant, and forming a second redistribution structure connected to the plurality of conductive pillars on the first semiconductor chip and the encapsulant. Upper surfaces of the plurality of conductive pillars are located at a lower level than the upper surface of the first semiconductor chip, and an upper surface of a connection via included in the second redistribution structure has a width greater than a width of a lower surface of the connection via.

Abstract: A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.

Abstract: Provided are a curable compound, a photoinitiator, and a curable resin composition comprising at least two types of thermal initiators, each having different initiation reaction temperature. Since the curable resin composition can improve a curing rate while having a high conversion rate, the curable resin composition is suitable for manufacturing thick films.

Abstract: A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

Abstract: A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.

Abstract: Provided is a network self-healing method in which, when a link between a parent device and a child device breaks down in a wireless communication network of a cluster-tree structure in which a main communication device (referred to an access point (AP)) manages network operation, routers that are devices capable of having their child devices, and end devices that are devices incapable of having their child devices are associated with each other in a parent-child device relationship, the link is restored. When a router becomes an orphan device, the router makes network re-association in a cluster unit while maintaining synchronized operation with its child devices, and thus time, energy and signaling burden for network self-healing is largely reduced.

Abstract: The present invention relates to an adaptor for a slit lamp microscope. According to one embodiment of the present invention, the invention provides the advantages of: facilitating the maintenance/repair of a slit lamp microscope since a camera member used for the slit lamp microscope is simply attached or detached; simply and easily inspecting and photographing a subject's eye; and obtaining a high-resolution video or image for the subject's eye at low costs.

Abstract: Provided is a manufacturing method of uniformly spherical gold nanoparticles using a synthesis method for controlling a size and a shape by repeating an etching and growing.