Abstract: Disclosed is a single process for producing hydrogen, carbon monoxide, and carbon from methane by forming gas products comprising hydrogen and carbon monoxide, and solid products comprising carbon and an iron-based catalyst from methane in a methane-containing feedstock through pyrolysis route involving auto-thermal reduction in a rotary kiln-type reactor in the presence of an iron-based catalyst and separating and recovering respective products.

Abstract: A fluid level measurement system using a buoyant body includes a guide part installed in a direction perpendicular to the bottom surface of a fluid storage tank, and provided with a space in which a fluid can move therein; a buoyant body inserted into the guide part, and configured to float along the surface of the fluid inside the guide part; and a measurement part coupled to the top end of the guide part, and configured to measure the level of the surface of the fluid inside the fluid storage tank by transmitting a signal toward the buoyant body in the inner space of the guide part and then receiving a signal reflected from the buoyant body.

Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.

Abstract: An apparatus for providing brain lesion information based on an image includes a magnetic resonance angiography (MRA) provider configured to provide an environment capable of displaying 3D time-of-flight magnetic resonance angiography (3D TOF MRA) using user input, a brain lesion input unit configured to generate and manage a brain lesion image, a maximum intensity projection (MIP) converter configured to configure MIP image data including at least one image frame corresponding to a projection position of the brain lesion image, a noise remover configured to remove noise of brain lesion information and to configure corrected MIP image data, from which the noise is removed, and an MRA reconfiguration unit configured to reconfigure a corrected brain lesion image by back-projecting the corrected MIP image data.

Abstract: A memory controller includes a plurality of processors, a memory device and a memory manager. The memory device includes a plurality of segments, which are divided into a plurality of segment groups, to which group identifiers are respectively assigned. The memory manager is configured to map a first buffer identifier to a first group identifier from among the group identifiers, select one or more segments only from a first segment group, to which the first group identifier is assigned among the plurality of segment groups, map the first buffer identifier to the one or more segments, and allocate, to a first processor from among the plurality of processors, the first buffer identifier and the one or more segments.

Abstract: Disclosed is a light emitting display device which may prevent or at least reduce lateral leakage current. The light emitting display device includes a substrate comprising a plurality of first to third subpixels arranged to neighbor one another, each of the first to third subpixels comprising an emission part and a non-emission part to surround the emission part; a bank at the non-emission parts; first electrodes covered with the bank and respectively at the first to third subpixels to expose the respective emission parts; a first spacer structure having an inversed tapered shape configured to surround at least one side of each of the emission parts of the first to third subpixels on the bank; a common layer structure located on the first electrodes and the first spacer structure and disconnected at an edge of the first spacer structure; and a second electrode on the common layer structure.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A semiconductor module socket includes an internal body including a slot therein, a lower end portion of a semiconductor module being inserted in the slot, and the semiconductor module including a printed circuit board with a semiconductor device thereon, an external body coupled to an outside of the internal body, and a plurality of socket pins on opposite surfaces of the slot, the plurality of socket pins facing each other, and top portions of the plurality of socket pins being arranged at different levels.

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.