Patents by Inventor Dongming Zhao

Dongming Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948909
    Abstract: A package that includes a first integrated device comprising a first plurality of interconnects; a plurality of solder interconnects coupled to the first plurality of interconnects; a second integrated device comprising a second plurality of interconnects, wherein the second integrated device is coupled to the first integrated device through the second plurality of interconnects, the plurality of solder interconnects and the first plurality of interconnects; a polymer layer located between the first integrated device and the second integrated device; and a plurality of spacer balls located between the first integrated device and the second integrated device.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: April 2, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Yangyang Sun, Dongming He, Lily Zhao
  • Publication number: 20240097617
    Abstract: A method for installing a maximum power point tracking (MPPT) controller is provided. The method includes acquiring an occlusion area proportion of a photovoltaic string in a photovoltaic system, optimizing the occlusion area proportion to generate a target occlusion area proportion, determining a target position from the photovoltaic string according to the target occlusion area proportion, and installing the MPPT controller at the target position.
    Type: Application
    Filed: June 23, 2022
    Publication date: March 21, 2024
    Inventors: Lizhen Luo, Wenbo Peng, Ping Xiao, Dongming Zhao, Xiaolei Li, Xiangrui Yu, Wenzhe Zhu, Hu Gao
  • Publication number: 20240079352
    Abstract: Aspects disclosed herein include integrated circuit (IC) packages employing a capacitor interposer substrate with aligned external interconnects, and related fabrication methods. The IC package includes one or more semiconductor dies (“dies”) electrically coupled to a package substrate that supports electrical signal routing to and from the die(s). The capacitor interposer substrate is disposed between the die(s) and the package substrate. The die(s) is coupled to embedded capacitor(s) in the capacitor interposer substrate through die interconnects coupled to external interconnects of the capacitor interposer substrate. In exemplary aspects, the external interconnects on the outer surfaces of the capacitor interposer substrate are aligned.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Inventors: Jihong Choi, Giridhar Nallapati, Lily Zhao, Dongming He
  • Publication number: 20240066883
    Abstract: A remanufactured ink cartridge includes a case, an ink discharge opening, and an external body. The case is configured to store ink. The ink discharge opening is arranged at the case and configured to supply the ink to outside. The external body fluid-communicates with the case.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 29, 2024
    Inventors: Shengkui ZHAO, Dongming LIN
  • Publication number: 20230387342
    Abstract: The disclosure provides a method for preparing an electrode film layer on a surface of a solar cell substrate. The method includes: a) obtaining a metal electrode material melt by heating and melting a metal electrode material under a vacuum condition; b) bombarding the metal electrode material melt with an ion source at low energy, so that it is sputtered and deposited on the surface of the solar cell substrate to form the electrode film layer; in which the energy of low energy bombarding is 30 eV to 80 eV.
    Type: Application
    Filed: August 14, 2023
    Publication date: November 30, 2023
    Inventors: Ping Xiao, Jiguang Xiong, Zhiguo Zhao, Jialiang Liu, Mengjie Li, Dongming Zhao, Xiaojun Qin, Yun Zhang, Chao Dong, Xueling Wang, Shisen Xu, Ruwei Liu, Sichao Liang
  • Publication number: 20230371356
    Abstract: An in-situ flash evaporation film forming apparatus for a perovskite solar cell includes a platform; a substrate disposed on the platform and configured to form a film layer; and a cavity cover movably disposed up and down on the platform, and being able to enclose the substrate into a closed cavity surrounded by the cavity cover and the platform, a vacuum pipe being disposed on the cavity cover and being able to communicate the closed cavity with a vacuum pump.
    Type: Application
    Filed: December 10, 2021
    Publication date: November 16, 2023
    Inventors: Xinlian LI, Weidong LI, Zhiguo ZHAO, Xiaojun QIN, Dongming ZHAO, Yun ZHANG, Yuan XIA, Jiguang XIONG
  • Patent number: 6723228
    Abstract: An additive used in catalytic cracking of hydrocarbons, which is in the form of homogeneous liquid and comprises a composite metal compound, wherein said composite metal compound consists of the oxides, hydroxides, organic acid salts, inorganic acid salts or metal organic complex compounds of at least one of the 1st group metals and at least one of the 2nd group metals, wherein the 1st group metals are selected from the group consisting of the metals of the IIIA, IVA, VA, VIA groups of the Element Period Table, boron, silicon, phosphorous and tellurium; wherein the 2nd group metals are selected from the group consisting of alkali-earth metals, transition metals, and rare earth metals, is disclosed. A process of catalytic cracking of hydrocarbons, utilizing the additive is also disclosed. The additive can passivate metals and promote the oxidation of CO, and is operated easily with production cost decreased.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: April 20, 2004
    Assignees: China Petrochemical Corporation, Luoyang Petrochemical Engineering Corporation
    Inventors: Shuqin Su, Guoliang Wang, Haiqing Guo, Xianliang Deng, Longyan Wang, Wenyi Qi, Shufang Liu, Baojian Shen, Jinlong Liu, Dongming Zhao
  • Publication number: 20030209468
    Abstract: An additive used in catalytic cracking of hydrocarbons, which is in the form of homogeneous liquid and comprises a composite metal compound, wherein said composite metal compound consists of the oxides, hydroxides, organic acid salts, inorganic acid salts or metal organic complex compounds of at least one of the 1st group metals and at least one of the 2nd group metals, wherein the 1st group metals are selected from the group consisting of the metals of the IIIA, IVA, VA, VIA groups of the Element Period Table, boron, silicon, phosphorous and tellurium; wherein the 2nd group metals are selected from the group consisting of alkali-earth metals, transition metals, and rare earth metals, is disclosed. A process of catalytic cracking of hydrocarbons, utilizing the additive is also disclosed. The additive can passivate metals and promote the oxidation of CO, and is operated easily with production cost decreased.
    Type: Application
    Filed: June 11, 2003
    Publication date: November 13, 2003
    Inventors: Shuqin Su, Guoliang Wang, Haiqing Guo, Xianliang Deng, Longyan Wang, Wenyi Qi, Shufang Liu, Baojian Shen, Jinlong Liu, Dongming Zhao