Patents by Inventor Dongok AHN

Dongok AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151767
    Abstract: Provided are a wafer-type measuring apparatus capable of accurately measuring the magnetic flux density in a process chamber without opening the process chamber, and a magnetic flux density measuring method using the wafer-type measuring apparatus. The wafer-type measuring apparatus includes a wafer-type substrate, magnetic flux density sensors disposed on the wafer-type substrate and configured to measure a magnetic flux density, a power supply disposed on the substrate and configured to supply power to the magnetic flux density sensors, a microcontroller unit (MCU) disposed on the substrate and configured to signal process the measured magnetic flux density, and a wireless communication module disposed on the substrate and configured to transmit a signal from the MCU to the outside, and measure the magnetic flux density in a process chamber using a magnetic field.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Inventors: Yongjun SEO, Sujin CHAE, Sanghyun SON, Sangmin HA, Youngsik BANG, Jeongmo HWANG, Dongok AHN
  • Publication number: 20230044888
    Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 9, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Yong-Jun SEO, Hyun YOON, Jungsuk GOH, Byeong Geun KIM, Yoonki SA, Doyeon KIM, Yerim YEON, Choonghyun LEE, Pil Kyun HEO, Youngje UM, Jaeseong LEE, Dongok AHN
  • Patent number: 11338578
    Abstract: An inspection module is disclosed for inspecting a droplet from an ink jet head. The inspection module includes a sensor located under the ink jet head and measuring a distance between the droplet and the sensor in real time; a variable lens changing an operating distance based on the measured distance of the sensor; and a camera for capturing an image of the droplet. The inspection module further includes a droplet inspecting part inspecting the droplet image captured by the camera.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: May 24, 2022
    Assignee: SEMES CO., LTD.
    Inventors: Kwangsup Kim, Dongok Ahn, Junho Oh, Ji Hoon Yoo, Myeong Jun Lim
  • Publication number: 20210122154
    Abstract: An inspection module is disclosed for inspecting a droplet from an ink jet head. The inspection module includes a sensor located under the ink jet head and measuring a distance between the droplet and the sensor in real time; a variable lens changing an operating distance based on the measured distance of the sensor; and a camera for capturing an image of the droplet. The inspection module further includes a droplet inspecting part inspecting the droplet image captured by the camera.
    Type: Application
    Filed: October 23, 2020
    Publication date: April 29, 2021
    Inventors: Kwangsup KIM, Dongok AHN, Junho OH, Ji Hoon YOO, Myeong Jun LIM
  • Publication number: 20210112662
    Abstract: Disclosed is a wafer-type sensor unit. The wafer-type sensor unit according to an embodiment of the inventive concept may include a circuit board and an electronic element including a sensor installed on the circuit board. The electronic element may be disposed on the circuit board such that a center of gravity of the wafer-type sensor unit is provided to a center part of the sensor unit. The electronic element may further include a power supply unit and a signal processing unit processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Yong-Jun SEO, Sanghyun SON, Sangmin HA, Hyeongjun CHO, Dongok AHN
  • Publication number: 20210050210
    Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 18, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Yong-Jun SEO, Hyun YOON, Jungsuk GOH, Byeong Geun KIM, Yoonki SA, Doyeon KIM, Yerim YEON, Choonghyun LEE, Pil Kyun HEO, Youngje UM, Jaeseong LEE, Dongok AHN