Patents by Inventor Dongpeng ZHOU

Dongpeng ZHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11685811
    Abstract: A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive-polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: June 27, 2023
    Inventors: Changwei Liu, Wanbao Xiao, Chunyan Qu, Dezhi Wang, Kai Xu, Bo Wang, Hongfeng Li, Hao Feng, Yueyu Guan, Haidong Yang, Haimin Wang, Yang Zhang, Cheng Du, Dongpeng Zhou
  • Publication number: 20210261735
    Abstract: A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.
    Type: Application
    Filed: April 30, 2021
    Publication date: August 26, 2021
    Inventors: Changwei LIU, Wanbao XIAO, Chunyan QU, Dezhi WANG, Kai XU, Bo WANG, Hongfeng LI, Hao FENG, Yueyu GUAN, Haidong YANG, Haimin WANG, Yang ZHANG, Cheng DU, Dongpeng ZHOU
  • Patent number: 11028226
    Abstract: A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 8, 2021
    Inventors: Changwei Liu, Wanbao Xiao, Chunyan Qu, Dezhi Wang, Kai Xu, Bo Wang, Hongfeng Li, Hao Feng, Yueyu Guan, Haidong Yang, Haimin Wang, Yang Zhang, Cheng Du, Dongpeng Zhou
  • Publication number: 20200172676
    Abstract: A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.
    Type: Application
    Filed: November 2, 2017
    Publication date: June 4, 2020
    Inventors: Changwei LIU, Wanbao XIAO, Chunyan QU, Dezhi WANG, Kai XU, Bo WANG, Hongfeng LI, Hao FENG, Yueyu GUAN, Haidong YANG, Haimin WANG, Yang ZHANG, Cheng DU, Dongpeng ZHOU