Patents by Inventor Dongshun Bai
Dongshun Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10968348Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.Type: GrantFiled: December 21, 2018Date of Patent: April 6, 2021Assignee: Brewer Science, Inc.Inventors: Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai, Baron Huang
-
Publication number: 20190194453Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.Type: ApplicationFiled: December 21, 2018Publication date: June 27, 2019Inventors: Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai, Baron Huang
-
Patent number: 9865490Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.Type: GrantFiled: October 24, 2016Date of Patent: January 9, 2018Assignee: Brewer Science Inc.Inventors: Dongshun Bai, Gu Xu, Debbie Blumenshine, Baron Huang, Andrew Wong
-
Patent number: 9827740Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.Type: GrantFiled: July 22, 2015Date of Patent: November 28, 2017Assignee: Brewer Science Inc.Inventors: Xiao Liu, Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu
-
Publication number: 20170040200Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.Type: ApplicationFiled: October 24, 2016Publication date: February 9, 2017Inventors: Dongshun Bai, Gu Xu, Debbie Blumenshine, Baron Huang, Andy Wong
-
Patent number: 9496164Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.Type: GrantFiled: January 6, 2015Date of Patent: November 15, 2016Assignee: Brewer Science Inc.Inventors: Dongshun Bai, Gu Xu, Debbie Blumenshine
-
Publication number: 20160023436Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.Type: ApplicationFiled: July 22, 2015Publication date: January 28, 2016Inventors: Xiao Liu, Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu
-
Publication number: 20150194331Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.Type: ApplicationFiled: January 6, 2015Publication date: July 9, 2015Inventors: Dongshun Bai, Gu Xu, Debbie Blumenshine
-
Patent number: 8865599Abstract: Planarization methods and microelectronic structures formed therefrom are disclosed. The methods and structures use planarization materials comprising fluorinated compounds or acetoacetylated compounds. The materials are self-leveling and achieve planarization over topography without the use of etching, contact planarization, chemical mechanical polishing, or other conventional planarization techniques.Type: GrantFiled: November 8, 2012Date of Patent: October 21, 2014Assignee: Brewer Science Inc.Inventors: Dongshun Bai, Xie Shao, Michelle Fowler, Tingji Tang
-
Patent number: 8771442Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: GrantFiled: July 13, 2012Date of Patent: July 8, 2014Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
-
Publication number: 20120291938Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: ApplicationFiled: July 13, 2012Publication date: November 22, 2012Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
-
Patent number: 8221571Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: GrantFiled: December 15, 2010Date of Patent: July 17, 2012Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
-
Patent number: 8092628Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: GrantFiled: October 31, 2008Date of Patent: January 10, 2012Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
-
Publication number: 20110086955Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: ApplicationFiled: December 15, 2010Publication date: April 14, 2011Applicant: BREWER SCIENCE INC.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
-
Publication number: 20100112305Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: ApplicationFiled: October 31, 2008Publication date: May 6, 2010Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda