Abstract: The present disclosure relates to an apparatus for cutting substrate material, the apparatus including: a mounting frame; a base mounted to the mounting frame; an upper cutter device disposed on the mounting frame; and a substrate material clamp disposed on the upper cutter device and used to clamp substrate material, the substrate material clamp including a clamp body and a flattening member connected to the clamp body, and the flattening member being used to flatten the substrate material. In the above technical solution, the flattening member is provided on the lower surface of the substrate material clamp, and during the process that the substrate material clamp approaches the base, the flattening member flattens the curled substrate material, and thus the quality of the substrate material is improved.

Abstract: The present disclosure provides a magnetron sputtering equipment, including: a mesh shielding plate disposed in a vacuum chamber of the magnetron sputtering equipment; the vacuum chamber includes one or more coating chambers, and the mesh shielding plate is disposed on a sidewall within the coating chamber, which facilitates the smooth operation of the magnetron sputtering target, and avoids the gas pollution of the vacuum chamber, and the installation and disassembly are simple and fast. The present disclosure provides an important solution and approach for a production line of the magnetic sputtering equipment.