Abstract: A trap for controlling termites includes a main body and an insecticide portion disposed in the main body. The main body of the trap has a hollow triangular structure and includes a first outer wall configured to contact a first installment surface, a second outer wall configured to contact a second installment surface and connected to the first outer wall so as to form an angle between the first outer wall and the second outer wall, and at least one termite entrance hole formed on the first outer wall or the second outer wall.

Abstract: The present invention relates to a trap for controlling termites. More specifically, the present invention relates to a trap for controlling termites which has an excellent control effect by being installed easily on movement routes of termites, such as edge parts or narrow corridors, can be easily treated and installed due to a simple structure, and also can reduce manufacturing or controlling costs. The trap for controlling termites according to the present invention comprises a main body of the trap; and an insecticide portion disposed in the main body; wherein the main body is formed in shape of hollow column, and the main body comprises a first outer wall which touches a first installment surface, a second outer wall which touches a second installment surface and is connected to the first outer wall so as to have a tilt angle against the first outer wall, and at least one termite entrance hole formed on the first outer wall or the second outer wall.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.