Patents by Inventor Dongxing Wang

Dongxing Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11834784
    Abstract: The present disclosure relates to a method for preparing an unbleached biomechanical pulp and fully utilizing by-products by treating wheat straws with heat steam in synergy with biological enzymes, which belongs to the technical field of papermaking technology and waste comprehensive utilization. The present disclosure provides a method for preparing an unbleached biomechanical pulp by treating whole wheat straws with heat steam in synergy with biological enzymes, where the prepared high-strength biomechanical pulp can meet the requirements of producing unbleached packaging paper and paper-based materials. At the same time, the by-products are recycled to prepare a biomass compound fertilizer, which turns solid waste into treasure and realizes the high-value full utilization of wheat straw. Therefore, the method in the present disclosure is simple, green, clean and efficient, which has good practical application value and broad application prospects.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: December 5, 2023
    Assignee: Qilu University of Technology
    Inventors: Xingxiang Ji, Jiachuan Chen, Zhongjian Tian, Ruiming Wang, Dongxing Wang, Yu Liu
  • Publication number: 20220205178
    Abstract: The present disclosure relates to a method for preparing an unbleached biomechanical pulp and fully utilizing by-products by treating wheat straws with heat steam in synergy with biological enzymes, which belongs to the technical field of papermaking technology and waste comprehensive utilization. The present disclosure provides a method for preparing an unbleached biomechanical pulp by treating whole wheat straws with heat steam in synergy with biological enzymes, where the prepared high-strength biomechanical pulp can meet the requirements of producing unbleached packaging paper and paper-based materials. At the same time, the by-products are recycled to prepare a biomass compound fertilizer, which turns solid waste into treasure and realizes the high-value full utilization of wheat straw. Therefore, the method in the present disclosure is simple, green, clean and efficient, which has good practical application value and broad application prospects.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 30, 2022
    Inventors: Xingxiang JI, Jiachuan CHEN, Zhongjian TIAN, Ruiming WANG, Dongxing WANG, Yu LIU
  • Publication number: 20220205176
    Abstract: The disclosure relates to a method for preparing unbleached biomechanical pulp by hot steam and biological enzyme treatment and full utilization of by-products thereof, and belongs to the technical field of papermaking technology and comprehensive utilization of waste. The present disclosure proposes a method for preparing high-strength unbleached biomechanical pulp, using whole wheat straw as a raw material, by using hot water in coordination with an alkaline biological enzyme to treat whole wheat straw, thereby meeting the requirements for the production of unbleached linerboard and paper-based materials, and recycling by-products thereof to prepare biomass compound fertilizers, which creates wealth from solid waste and realizes the high-value full utilization of wheat straw. The preparation method of the disclosure is simple, green, clean and efficient, and has good practical application value and broad application prospects.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 30, 2022
    Inventors: Zhongjian TIAN, Xingxiang JI, Dongxing WANG, Wenjia HAN, Hao MA, Xuejun SHAO
  • Publication number: 20220201837
    Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 23, 2022
    Inventors: Zhaozheng HOU, Xiaojing LIAO, Chao SHEN, Dongxing WANG
  • Publication number: 20160061974
    Abstract: Method for performing a full wavefield inversion (FWI) without simulating free-surface multiple reflections. The free-surface multiples are removed from the field gathers of seismic data, which are then used to generate a subsurface velocity model by FWI. In the FWI, the field monopole sources and receivers are replaced with dipole (actual and mirror image) sources and receivers (21) when model-simulating (23) synthetic survey data. Also, direct arrivals at the mirror receiver locations are preferably simulated (25) with the dipole sources for each shot location and added (26) to the synthetic survey data (24) for that shot location, resulting in corrected synthetic survey data (27), which is used in the FWI to generate residuals. A model update may be computed by back-propagating the residuals by injecting them at both mirror and actual receiver locations.
    Type: Application
    Filed: July 16, 2015
    Publication date: March 3, 2016
    Inventors: Reeshidev Bansal, Anatoly Baumstein, Tetyana Vdovina, Dongxing Wang, Hongchuan Sun