Patents by Inventor Dong-Ya Wang

Dong-Ya Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package box
    Patent number: 10252846
    Abstract: A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: April 9, 2019
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Ching Liu, Xi-Hang Li, Er-Wei Chen, Bing Liu, Dong-Ya Wang, Cui-Ling Li
  • PACKING MATERIAL AND PACKAGE BOX
    Publication number: 20170144815
    Abstract: A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.
    Type: Application
    Filed: December 18, 2015
    Publication date: May 25, 2017
    Inventors: YU-CHING LIU, XI-HANG LI, ER-WEI CHEN, BING LIU, DONG-YA WANG, CUI-LING LI
  • Package case
    Patent number: D779340
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: February 21, 2017
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Ching Liu, Xi-Hang Li, Er-Wei Chen, Bing Liu, Dong-Ya Wang, Cui-Ling Li