Abstract: A method includes the following steps: obtaining a first status of an object, where the first status includes a first position and a first pose; obtaining a second status of the object through inertial navigation by using the first status as a start point, where the second status includes a second position and a second pose; obtaining a third pose of the object through initial alignment; and providing inertial navigation for the object by using the third pose and the second position as a start point. A positioning and orientation apparatus and a positioning and orientation device are further provided. The second pose is replaced with the third pose obtained through initial alignment.

Abstract: A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system.

Abstract: An end effector for a substrate handling device suitable for a semiconductor fabrication tool. The end effector is adapted to support the substrate and is connectable to a robotic arm. The end effector includes: (a) a body having a top surface and a bottom surface; and (b) at least one supporting projection protruding from the top surface of the body for contacting and supporting the substrate. The supporting projection is provided with a diamond-like carbon coating.

Abstract: A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system.

Abstract: A technique facilitates actuation of flow control valves or other types of downhole devices. According to an embodiment, the downhole devices are coupled with corresponding first hydraulic control lines for hydraulically actuating each downhole device to a first operational position. The downhole devices also are coupled to a common second hydraulic control line which may be used in cooperation with selective hydraulic circuits to actuate individual downhole devices to a second operational position. For example, an individual selective hydraulic circuit may be coupled between each first hydraulic control line and the common second hydraulic control line at each downhole device. The selective hydraulic circuit is configured to enable actuation of the corresponding downhole device to the second operational position.

Abstract: A motor arrangement includes a stator body, a rotor body, a permanent magnet and a fluid conduit. The stator body defines a rotary axis and has a bore. The rotor body is supported for rotary movement about the rotary axis in the bore and is separated from the stator body by a gap. The permanent magnet is arranged within the gap and is fixed to one of the stator body and the rotor body. The fluid conduit is supported above the gap and has an outlet in fluid communication with the gap to separate the permanent magnet from an infiltrant fluid resident within an atmosphere above of the gap by issuing a barrier fluid into the atmosphere above the gap and gravimetrically flowing the barrier fluid into the gap. Semiconductor processing systems, barrier fluid kits, and methods of purging motor arrangements are also described.

Abstract: The disclosure relates to the technical field of supercapacitors, in particular to a method for preparation of an MOF-derived high-porosity carbon aerogel as an electrode material of a supercapacitor. An MOFs-derived high-porosity carbon aerogel is obtained by performing calcination pyrolysis to an MOF-ZX-5 material, where the MOF-ZX-5 material is [Zn(tppa)2Cl2]. According to the disclosure, a new MOF-ZX-5 is used as a precursor, and a new carbon aerogel material (MOFs-derived high-porosity carbon aerogel) is designed and synthesized as an electrode material of a supercapacitor.

Abstract: A method includes the following steps: obtaining a first status of an object, where the first status includes a first position and a first pose; obtaining a second status of the object through inertial navigation by using the first status as a start point, where the second status includes a second position and a second pose; obtaining a third pose of the object through initial alignment; and providing inertial navigation for the object by using the third pose and the second position as a start point. A positioning and orientation apparatus and a positioning and orientation device are further provided. The second pose is replaced with the third pose obtained through initial alignment.

Abstract: A method of replacing an end effector for wafer handling in a semiconductor processing system includes fixing a first end effector jig to a first stage and a second end effector jig to a second stage of the load lock module; positioning a first end effector at the first end effector jig and a second end effector at the second end effector jig, the second end effector fixed relative to the first end effector; and fixing the second end effector to the second end effector jig. The first end effector is replaced with a replacement end effector and the semiconductor processing system returned to production without re-teaching placement of the replacement end effector in a processing module connected to a wafer handling module mounting the end effectors. Semiconductor processing systems and end effector jigs for replacing end effectors in semiconductor processing systems are also described.

Abstract: A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system. Semiconductor processing systems and methods of teaching substrate handling are also described.

Abstract: A jig for teaching substrate handling in a semiconductor processing system includes a verification pin with a pin width and a disc body. The disc body has a first surface, a second surface opposite the first surface, and a thickness separating the second surface from the first surface of the disc body. The first and second surfaces define a verification aperture coupling the first surface to the second surface of the disc body. The verification aperture has an aperture width equivalent to the pin width of the verification pin to teach a transfer position by slidably receiving the verification pin in the verification aperture and a verification pin seat defined in a load lock of the semiconductor processing system while supported by a substrate transfer robot within the semiconductor processing system. Semiconductor processing systems and methods of teaching substrate handling in semiconductor processing systems are also described.

Abstract: A method of replacing an end effector for wafer handling in a semiconductor processing system includes fixing a first end effector jig to a first stage and a second end effector jig to a second stage of the load lock module; positioning a first end effector at the first end effector jig and a second end effector at the second end effector jig, the second end effector fixed relative to the first end effector; and fixing the second end effector to the second end effector jig. The first end effector is replaced with a replacement end effector and the semiconductor processing system returned to production without re-teaching placement of the replacement end effector in a processing module connected to a wafer handling module mounting the end effectors. Semiconductor processing systems and end effector jigs for replacing end effectors in semiconductor processing systems are also described.

Abstract: An organic thermally activated delayed fluorescence (TADF) compound selected from the group consisting of compounds according to formula (Ia) and formula (Ib): wherein: Het is a heteroaryl group containing at least one heteroatom; n(D) denotes n donor groups D bonding to the heteroaryl group Het; n is at least 1; and -a and -b denotes bonding to another group.

Abstract: An organic thermally activated delayed fluorescence (TADF) compound selected from the group consisting of compounds according to formula (Ia) and formula (Ib): wherein: Het is a heteroaryl group containing at least one heteroatom; n(D) denotes n donor groups D bonding to the heteroaryl group Het; n is at least 1; and -a and -b denotes bonding to another group.

Abstract: Provided herein are systems and devices comprising rigid macrocyclic and nanoporous compositions of electronically coupled naphthalenediimide redox-active units and methods of preparation and use thereof, for example, in the field of energy generation and storage.

Abstract: A technique facilitates actuation of flow control valves or other types of downhole devices. According to an embodiment, the downhole devices are coupled with corresponding first hydraulic control lines for hydraulically actuating each downhole device to a first operational position. The downhole devices also are coupled to a common second hydraulic control line which may be used in cooperation with selective hydraulic circuits to actuate individual downhole devices to a second operational position. For example, an individual selective hydraulic circuit may be coupled between each first hydraulic control line and the common second hydraulic control line at each downhole device. The selective hydraulic circuit is configured to enable actuation of the corresponding downhole device to the second operational position.

Abstract: Provided herein are systems and devices comprising rigid macrocyclic and nanoporous compositions of electronically coupled naphthalenediimide redox-active units and methods of preparation and use thereof, for example, in the field of energy generation and storage.