Patents by Inventor Dongyang Peng

Dongyang Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240101428
    Abstract: A meshed catalyst based high-yield preparation and regeneration method for carbon nanotubes and hydrogen includes the following steps: step one, adding waste plastic into a low-temperature pyrolysis section, conducting slow heating, and continuously introducing nitrogen; step two, using a multilayer stainless steel mesh obtained through laminated pressing and vacuum sintering as a catalyst, introducing the volatiles into a high-temperature catalytic section, conducting a catalytic reaction under the action of a meshed stainless steel catalyst obtained through acid etching and calcination pretreatment, generating the carbon nanotubes on a surface of the catalyst, and meanwhile generating high-purity hydrogen; and step three, after temperature drop, conducting ultrasonic treatment on a stainless steel mesh after the reaction, achieving physical stripping of the carbon nanotubes from the stainless steel mesh, then placing the stainless steel mesh subjected to secondary calcination in a system for recycling, and
    Type: Application
    Filed: April 27, 2022
    Publication date: March 28, 2024
    Inventors: Huiyan ZHANG, Dongyang JIANG, Qingyu LIU, Ru HONG, Bo PENG, Rui XIAO
  • Publication number: 20190185715
    Abstract: The present invention relates to a polishing liquid for CMP and preparation method thereof. 100 parts by weight of the polishing liquid comprises: 0.1 to 50 parts of abrasive, 0.001 to 0.4 part of surfactant, 0.001 to 0.6 part of film former, and 0.05 to 10 parts of pH regulator, and 0.01 to 4 parts of polishing accelerator, and deionized water in balance; and the pH value of the polishing liquid is 9.5 to 12.5. When a GaAs wafer is polished with the polishing liquid of the present invention, various performance indexes such as polishing removal rate, surface roughness and TTV of the polished wafer are excellent, and the polishing liquid is easy to be washed away, does not corrode equipment, and does not introduce harmful metal ions. The polishing liquid of the present invention can be used continuously and circularly for a long period of 6 to 10 hours, which greatly saves resources and reduces the use cost of the polishing liquid.
    Type: Application
    Filed: August 31, 2018
    Publication date: June 20, 2019
    Inventors: Lejun Wang, Linlin Li, Shijia Song, Guiyong Liu, Dongyang Peng, Hong Jiang