Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.

Abstract: A memory module includes a module board including a first and second data vias configured to transmit first and second data, respectively, through first and second data lines arranged adjacent to each other external to the module board, a plurality of layers including the first and second data vias passing therethrough, and a plurality of semiconductor memory devices arranged on at least one outer surface of the module board. The plurality of layers include first and second layers adjacent to each other. The module board includes a first data via wing extending from the first data via toward the second data via and not connected to the second data via in the first layer, and a seventh data via wing extending from the second data via toward the first data via and not connected to the first data via to overlap the first data via wing in the second layer.

Abstract: A signal channel includes at least one first signal line positioned in a first signal layer and at least one second signal line positioned in a second signal layer. The first signal layer extends in a first horizontal direction. The second signal layer extends along a second horizontal plane parallel to the first horizontal plane and spaced apart from the first horizontal plane along a vertical direction orthogonal to the first and second horizontal planes. The first signal line includes a first coupling segment and the second signal line includes a second coupling segment. The first coupling segment at least partially overlaps the second coupling segment along the vertical direction. The first and second coupling segments are positioned to form a greater degree of capacitive coupling between the first and second coupling segments than a degree of capacitive coupling formed between other segments of the first and second signal lines.

Abstract: A memory module includes a module board including a first and second data vias configured to transmit first and second data, respectively, through first and second data lines arranged adjacent to each other external to the module board, a plurality of layers including the first and second data vias passing therethrough, and a plurality of semiconductor memory devices arranged on at least one outer surface of the module board. The plurality of layers include first and second layers adjacent to each other. The module board includes a first data via wing extending from the first data via toward the second data via and not connected to the second data via in the first layer, and a seventh data via wing extending from the second data via toward the first data via and not connected to the first data via to overlap the first data via wing in the second layer.

Abstract: A memory module may include a first memory group and a second memory group; and a first clock signal line and a second clock signal line via which the first clock signal and the second clock signal propagate from the buffer chip to the first memory group and the second memory group, respectively, wherein distances that the first clock signals propagate from a buffer chip to a plurality of memory chips of the first memory group via the first clock signal line are identical to one another and are referred to as a first distance, and distances that the second clock signals propagate from the buffer chip to a plurality of memory chips of the second memory group via the second clock signal line are identical to one another and are referred to as a second distance.

Abstract: A signal channel includes at least one first signal line positioned in a first signal layer and at least one second signal line positioned in a second signal layer. The first signal layer extends in a first horizontal direction. The second signal layer extends along a second horizontal plane parallel to the first horizontal plane and spaced apart from the first horizontal plane along a vertical direction orthogonal to the first and second horizontal planes. The first signal line includes a first coupling segment and the second signal line includes a second coupling segment. The first coupling segment at least partially overlaps the second coupling segment along the vertical direction. The first and second coupling segments are positioned to form a greater degree of capacitive coupling between the first and second coupling segments than a degree of capacitive coupling formed between other segments of the first and second signal lines.

Abstract: An electronic device includes a display, a local wireless communication circuit, a memory, a payment application, and a processor. The memory is configured to store a financial application. The processor is configured to launch the financial application. The processor is also configured to output account information of a user and a graphic user interface (GUI) object associated with the account information on the display. The processor is also configured to launch the payment application in response to selecting the GUI object. The processor is also configured to transmit data of a card linked to the account information to an external device via the local wireless communication circuit.

Abstract: An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.