Patents by Inventor Dongzi Chen

Dongzi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12092926
    Abstract: The present invention discloses a backlight module and a display device adopting the backlight module. The backlight module is composed of a plurality of backlight panels spliced with each other; wherein the backlight panel includes: a plurality of first light-emitting unit arranged in the body area; and a plurality of second light-emitting units arranged in the splicing area, wherein the plurality of first light-emitting units and the plurality of second light-emitting units are arranged in a matrix, and under a same area, a brightness of the body area is lower than a brightness of the splicing area.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: September 17, 2024
    Assignee: HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
    Inventors: Dongzi Chen, Jiao Wang
  • Publication number: 20240027833
    Abstract: The present invention discloses a backlight module and a display device adopting the backlight module. The backlight module is composed of a plurality of backlight panels spliced with each other; wherein the backlight panel includes: a plurality of first light-emitting unit arranged in the body area; and a plurality of second light-emitting units arranged in the splicing area, wherein the plurality of first light-emitting units and the plurality of second light-emitting units are arranged in a matrix, and under a same area, a brightness of the body area is lower than a brightness of the splicing area.
    Type: Application
    Filed: December 13, 2021
    Publication date: January 25, 2024
    Applicant: HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
    Inventors: Dongzi Chen, Jiao Wang
  • Patent number: 11380827
    Abstract: Provided are a Light Emitting Diode (LED) device and a backlight module. The LED device includes a substrate, a chip, an encapsulation structure and a top reflective shielding layer; the chip is disposed on the substrate; the encapsulation structure covers the substrate and covers the chip; and the top reflective shielding layer is disposed on the encapsulation structure and located at a central position of an upper surface of the encapsulation structure, and covers a part of the upper surface of the encapsulation structure.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 5, 2022
    Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
    Inventors: Fuhai Li, Penghui Dong, Dongzi Chen, Zhiguo Xie, Quan Xie
  • Patent number: 11107957
    Abstract: Provided is a LED device and a backlight module. The LED device comprises a bracket, a LED chip and an encapsulation layer. A reflective cup is arranged on the bracket, and the LED chip is arranged in the reflective cup. The encapsulation layer encases and encapsulates the LED chip in the reflective cup, the encapsulation layer has a top surface of the encapsulation layer. The top surface of the encapsulation layer is located above a top surface of the reflective cup, and is a lens curved surface. In an on-state, the LED device has virtual cross sections passing through a geometrical center of the LED chip and perpendicular to a top surface of the bracket, in at least one of the virtual cross sections of the LED device, the LED device has luminous efficiency greater than or equal to 95% within a beam angle of at least 60°.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: August 31, 2021
    Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Zhiguo Xie, Fuhai Li, Dongzi Chen, Qinxiu Liu
  • Publication number: 20210043815
    Abstract: Provided are a Light Emitting Diode (LED) device and a backlight module. The LED device includes a substrate, a chip, an encapsulation structure and a top reflective shielding layer; the chip is disposed on the substrate; the encapsulation structure covers the substrate and covers the chip; and the top reflective shielding layer is disposed on the encapsulation structure and located at a central position of an upper surface of the encapsulation structure, and covers a part of the upper surface of the encapsulation structure.
    Type: Application
    Filed: June 23, 2020
    Publication date: February 11, 2021
    Inventors: Fuhai LI, Penghui DONG, Dongzi CHEN, Zhiguo XIE, Quan XIE
  • Publication number: 20200287106
    Abstract: Provided is a LED device and a backlight module. The LED device comprises a bracket, a LED chip and an encapsulation layer. A reflective cup is arranged on the bracket, and the LED chip is arranged in the reflective cup. The encapsulation layer encases and encapsulates the LED chip in the reflective cup, the encapsulation layer has a top surface of the encapsulation layer. The top surface of the encapsulation layer is located above a top surface of the reflective cup, and is a lens curved surface. In an on-state, the LED device has virtual cross sections passing through a geometrical center of the LED chip and perpendicular to a top surface of the bracket, in at least one of the virtual cross sections of the LED device, the LED device has luminous efficiency greater than or equal to 95% within a beam angle of at least 60°.
    Type: Application
    Filed: August 6, 2019
    Publication date: September 10, 2020
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Zhiguo Xie, Fuhai Li, Dongzi Chen, Qinxiu Liu