Abstract: In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit.

Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.

Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.

Abstract: In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit.

Abstract: An interface circuit for a sensor array is provided. The interface circuit may be made up of an integrated circuit package that provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package may provide a plurality of interfaces for interconnecting to an integrated circuit in the package a plurality of signals from the sensor array and having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.

Abstract: An interface circuit for a sensor array is provided. The interface circuit may be made up of an integrated circuit package that provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package may provide a plurality of interfaces for interconnecting to an integrated circuit in the package a plurality of signals from the sensor array and having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.

Abstract: Active optical alignment of plastic chip-scale-package (450) laser and photo detecting diode devices (420) is provided by use of an active probe (120) to make alignment structures (300), such as précising holes, that are used to align the optical device (420) into a transmit/receive module. An optical connector (140), such as an optical fiber, transmits light to, or receives light from, the optical device (420). Using an electrical contact (115, 120), laser diode devices are lighted or photo detecting diode devices are electrically interfaced. The optical connector (140) steps to, locates and contacts each optical device on a fabricated frame of multiple devices. The optical connector (140) is manipulated to an optimal coupling position where the best signal, either optical or electrical, is obtained. An optimal position for making the précising holes, e.g., using a machining laser, is determined as an offset from the optimal position of the optical connector.

Abstract: A detector array kit that includes at least one sensor array. The sensor array has an active side at least one sensor on the flat active side configured to detect a particular form of energy. The sensor array active side has a positioning structure on the active side that is essentially transparent to the particular form of energy. The positioning structure includes a plurality of spaced compressible posts or tubes configured to compressively and frictionally engage with a complementary mounting structure. The detector kit further includes a complementary mounting structure essentially transparent to the particular form of energy.

Abstract: A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.

Abstract: Active optical alignment of plastic chip-scale-package (450) laser and photo detecting diode devices (420) is provided by use of an active probe (120) to make alignment structures (300), such as précising holes, that are used to align the optical device (420) into a transmit/receive module. An optical connector (140), such as an optical fiber, transmits light to, or receives light from, the optical device (420). Using an electrical contact (115, 120), laser diode devices are lighted or photo detecting diode devices are electrically interfaced. The optical connector (140) steps to, locates and contacts each optical device on a fabricated frame of multiple devices. The optical connector (140) is manipulated to an optimal coupling position where the best signal, either optical or electrical, is obtained. An optimal position for making the précising holes, e.g., using a machining laser, is determined as an offset from the optimal position of the optical connector.

Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation.