Abstract: A laser treatment system includes a laser device configured to produce a laser beam at a wavelength in an ultraviolet spectrum to provide for tissue ablation, a lens configured to focus and direct the laser beam to a site to form an opening in a surface of the site, a valve connected to a first channel, and a nozzle that emits the laser beam and controls delivery of at least a first substance and a second substance to the site. A portion of the first channel is disposed within a first sidewall of the nozzle to deliver the first substance, and a second channel unconnected with the valve is disposed within a second sidewall of the nozzle to deliver the second substance.

Abstract: A method for laser assisted delivery of therapeutic agents includes selectively controlling a valve connected to a first channel disposed within a first sidewall of a nozzle, applying, through the first channel, a first substance to penetrate dermis to a predetermined depth, and administering, through a second channel unconnected with the valve and disposed within a second sidewall of the nozzle, a second substance to remove debris.

Abstract: A method for laser assisted delivery of therapeutic agents includes selectively controlling a valve connected to a first channel disposed within a first sidewall of a nozzle, applying, through the first channel, a first substance to penetrate dermis to a predetermined depth, and administering, through a second channel unconnected with the valve and disposed within a second sidewall of the nozzle, a second substance to remove debris.

Abstract: A laser treatment system includes a laser device configured to produce a laser beam at a wavelength in an ultraviolet spectrum to provide for tissue ablation, a lens configured to focus and direct the laser beam to a site to form an opening in a surface of the site, a valve connected to a first channel, and a nozzle that emits the laser beam and controls delivery of at least a first substance and a second substance to the site. A portion of the first channel is disposed within a first sidewall of the nozzle to deliver the first substance, and a second channel unconnected with the valve is disposed within a second sidewall of the nozzle to deliver the second substance.

Abstract: A method for laser assisted delivery of therapeutic agents includes selectively controlling a valve connected to a first channel disposed within a first sidewall of a nozzle, applying, through the first channel, a first substance to penetrate dermis to a predetermined depth, and administering, through a second channel unconnected with the valve and disposed within a second sidewall of the nozzle, a second substance to remove debris.

Abstract: Systems for laser assisted delivery of therapeutic agents include an ultraviolet laser configured to produce a laser beam at a wavelength appropriate for tissue ablation; a lens configured to focus and direct the laser beam to a site, such that an opening is produced in a surface of the site's tissue; a nozzle having an aperture that emits the laser beam and that controls delivery of one or more agents to the site; and an imaging device configured to monitor a depth of penetration of the one or more agents into the site's tissue.

Abstract: Methods and systems for laser assisted delivery of therapeutic agents include preparing a site with an ultraviolet laser beam, at a wavelength appropriate for tissue ablation, such that an opening is produced in a surface of the site's tissue; and applying one or more agents to the prepared site, such that the agents penetrate the tissue through the opening to a predetermined depth.

Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Abstract: Systems for laser assisted delivery of therapeutic agents include an ultraviolet laser configured to produce a laser beam at a wavelength appropriate for tissue ablation; a lens configured to focus and direct the laser beam to a site, such that an opening is produced in a surface of the site's tissue; a nozzle having an aperture that emits the laser beam and that controls delivery of one or more agents to the site; and an imaging device configured to monitor a depth of penetration of the one or more agents into the site's tissue.

Abstract: Methods and systems for laser assisted delivery of therapeutic agents include preparing a site with an ultraviolet laser beam, at a wavelength appropriate for tissue ablation, such that an opening is produced in a surface of the site's tissue; and applying one or more agents to the prepared site, such that the agents penetrate the tissue through the opening to a predetermined depth.

Abstract: The present invention relates to a method for fabricating a thin layer made of a alloy and having photovoltaic properties. The method according to the invention comprises first steps of: a) depositing an adaptation layer (MO) on a substrate (SUB), b) depositing at least one layer (SEED) comprising at least elements I and/or III, on said adaptation layer. The adaptation layer is deposited under near vacuum conditions and step b) comprises a first operation of depositing a first layer of I and/or III elements, under same conditions as the deposition of the adaptation layer, without exposing to air the adaptation layer.

Abstract: Disclosed is an improved system and method for efficiently removing tissue using laser ablation. A first laser emits a first laser beam with a variable first integrated fluence sufficient to ablate tissue. The first laser beam is movably positioned over one or more surfaces of the tissue and the first integrated fluence varies over different levels with position, so different thicknesses of tissue are ablated at different surface positions in order to modify the contour of the surface of the tissue. Modifications include tissue smoothing, removing, feathering, sharpening, and roughening. In one preferred embodiment the tissue is eschar that is removed, unveiling viable tissue. In alternate preferred embodiments, one or more additional lasers beams with different wavelengths, with integrated fluence sufficient to ablate tissue, are moved over the surface of the tissue until a second ablation reaches a second self-termination point, e.g.

Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. With a two-layer ball-limiting composition comprising an adhesion/reaction barrier layer, wherein the adhesion/reaction barrier layer serves both as an adhesion layer and a reaction barrier layer, the adhesion/reaction barrier layer can be comprised of a material selected from the group consisting of Zr and ZrN.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

Abstract: The present invention relates to a method for fabricating a semiconductor device with a last level copper-to-C4 connection that is essentially free of aluminum. Specifically, the last level copper-to-C4 connection comprises an interfacial cap structure containing CoWP, NiMoP, NiMoB, NiReP, NiWP, and combinations thereof. Preferably, the interfacial cap structure comprises at least one CoWP layer. Such a CoWP layer can be readily formed over a last level copper interconnect by a selective electroless plating process.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.