Abstract: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

Abstract: A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: There is provided a driving circuit of a light emitting device. The driving circuit of a light emitting may include: a DC/DC converter converting an input DC voltage into an output DC voltage; a light emitting device block including a plurality of LED groups connected to an output terminal of the DC/DC converter; a current source circuit unit including a plurality of current sources; a voltage detection unit detecting the output DC voltage of the DC/DC converter; a minimum voltage detection unit detecting a minimum voltage among a plurality of voltages between the plurality of LED groups and the plurality of current sources, respectively; and a single comparator including a first non-inverting input terminal receiving the voltage detected by the voltage detection unit, a second non-inverting input terminal receiving the minimum voltage detected by the minimum voltage detection unit, and an inverting input terminal receiving a predetermined reference voltage.

Abstract: A driver for light emitting diodes can reduce heat generation in a switching device by dividing surplus voltage from a plurality of LED arrays, caused by a voltage difference between LEDs, and providing the divided voltage to a plurality of switching devices. The LED driver includes a power part supplying a preset driving voltage to a plurality of LED arrays, and a plurality of driving parts switching a driving voltage flowing to the plurality of LED arrays, respectively. The plurality of driving parts each include a plurality of switches each receiving a divided surplus voltage remaining after the driving voltage is applied to the plurality of LED arrays.

Abstract: A light source driver supplies a driving voltage, obtained by the multiplication of an input voltage, to a light source, especially to an LED array. The light source driver includes a power converting part switching an input power to be converted into a first power having a predetermined voltage level; and a multiplying part including at least one multiplying cell having at least one capacitor charging and discharging the first power according to the switching of the power converting part and at least one diode providing a path for transmitting the first power according to the switching of the power converting part, multiplying the first power to thereby transmit a driving power to at least one light source, and being configured as a closed loop in which the capacitor and the diode are connected to an input terminal of the power converting part through which the input power is inputted.

Abstract: There is provided a driving circuit of a light emitting device. The driving circuit of a light emitting may include: a DC/DC converter converting an input DC voltage into an output DC voltage; a light emitting device block including a plurality of LED groups connected to an output terminal of the DC/DC converter; a current source circuit unit including a plurality of current sources; a voltage detection unit detecting the output DC voltage of the DC/DC converter; a minimum voltage detection unit detecting a minimum voltage among a plurality of voltages between the plurality of LED groups and the plurality of current sources, respectively; and a single comparator including a first non-inverting input terminal receiving the voltage detected by the voltage detection unit, a second non-inverting input terminal receiving the minimum voltage detected by the minimum voltage detection unit, and an inverting input terminal receiving a predetermined reference voltage.