Abstract: A wafer, having alignment marks formed thereon, is aligned by radiating a first light beam onto the alignment marks so as to generate a first diffracted light beam. The first diffracted light beam is sensed at a first position. A second light beam is radiated onto the alignment marks so as to generate a second diffracted light beam. The second diffracted light beam is sensed at a second position. A correction value is calculated based on a first difference between the first position and a first predetermined position and a second difference is calculated based on a second difference between the second position and a second predetermined position. The wafer is aligned based on the correction value.

Abstract: Methods and apparatus for varying the number and intensity of beams of a photo-lithographic light source for exposing photoresist material include beam dividers and beam focusing means. Methods include producing an incident light beam having uniform intensity distribution, refracting the incident light beam into a plurality of divergent beams, refracting the plurality of divergent beams into a plurality of parallel beams, and exposing an object with light of the plurality of parallel beams. Apparatus includes source of light beam having uniform intensity distribution, first refracting element for refracting the light beam into a plurality of divergent beams, second refracting element for refracting the plurality of divergent beams into a plurality of parallel beams, and means for exposing the object with light of the plurality of parallel beams. Variations in the separations of the refractive elements allows for the control of the size, shape, and dispersion patterns of resultant beams.

Abstract: This invention relates to an apparatus and method for forming a high temperature superconducting film on a tape substrate. In this invention, the superconducting film is deposited on the tape substrate wound around a cylindrical substrate holder inserted in an auxiliary chamber. The holder rotates during the whole deposition process. Vapors of film materials are supplied from a main chamber through an opening between the two chambers. According to the present invention, it is possible to form a highly uniform high temperature superconducting film on a tape substrate at high speeds suitable for large scale production. The manufacturing speed can easily be controlled by the size of the substrate holder.