Patents by Inventor Doo-hwan Kim

Doo-hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10892227
    Abstract: A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor chip. An external connection terminal having excellent reliability is formed on the encapsulant.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyoung Joon Kim, Doo Hwan Lee
  • Patent number: 10884620
    Abstract: A method of controlling a display device including a touch screen is provided. The method includes setting an application execution space having one or more sub spaces in which windows executing applications are arranged, arranging windows corresponding to one or more applications which are being executed in the sub spaces of the set application execution space, displaying a first sub space corresponding to one of the one or more sub spaces on the touch screen, receiving a data sharing command for sharing data included in a first window arranged in the first sub space, and sharing the data to be shared by a second window arranged in a second sub space corresponding to one of the one or more sub spaces based on the data sharing command.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: January 5, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Soo Kim, Kang-Tae Kim, Doo-Hwan Kim, Chul-Joo Kim, Seong Choi
  • Patent number: 10886230
    Abstract: A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor chip. An external connection terminal having excellent reliability is formed on the encapsulant.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: January 5, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyoung Joon Kim, Doo Hwan Lee
  • Publication number: 20200410192
    Abstract: An ultrasonic sensing device includes: a sensing layer between a driving electrode and a sensing electrode, wherein the sensing layer is configured to generate an electrical signal according to an ultrasound; and a first transistor comprising a first gate electrode connected to a selection line and a second gate electrode connected to the sensing electrode.
    Type: Application
    Filed: March 19, 2020
    Publication date: December 31, 2020
    Inventors: Keun Woo KIM, Doo Na KIM, Ji Yeong SHIN, Yong Su LEE, Jae Hwan CHU, Ki Seok CHOI
  • Patent number: 10876487
    Abstract: A system and a method for injector injection error diagnosis include a controller which performs the method having a diagnostic inrush condition control by satisfying air tank pressure of an air tank as an injector injection error diagnosis entry condition while presence or absence of the application of an air compressor is divided between injector injection error diagnosis entry and injector injection error diagnosis execution according to detection of operations of an engine system and an air pressure brake system.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 29, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Su-Young Park, Tae-Young Kim, Doo-Hwan Kim
  • Patent number: 10872863
    Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRONICS CO.. LTD.
    Inventors: Joo Young Choi, Doo Hwan Lee, Da Hee Kim, Jae Hoon Choi, Byung Ho Kim
  • Patent number: 10854912
    Abstract: The present invention relates to a solid electrolyte comprising a sulfide-based compound and an all-solid-state battery applied therewith and, more particularly, to a solid electrolyte comprising a sulfide-based compound that is free of phosphorus (P) element but exhibits high ionic conductivity, and an all-solid-state battery applied therewith. The sulfide-based solid electrolyte and the all-solid-state battery applied therewith according to the present invention exhibit improved reactivity to moisture to prevent the generation of toxic gas, resulting in an improvement in safety and stability and do not reduce in ion conductivity even after being left in air, and the solid electrolyte is easy to handle and store thanks to the improved shelf stability thereof.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: December 1, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Da Young Sung, Chan Yeup Chung, Su Hwan Kim, Jong Hyun Chae, Doo Kyung Yang
  • Publication number: 20200363950
    Abstract: A method of controlling a display device including a touch screen is provided. The method includes setting an application execution space having one or more sub spaces in which windows executing applications are arranged, arranging windows corresponding to one or more applications which are being executed in the sub spaces of the set application execution space, displaying a first sub space corresponding to one of the one or more sub spaces on the touch screen, receiving a data sharing command for sharing data included in a first window arranged in the first sub space, and sharing the data to be shared by a second window arranged in a second sub space corresponding to one of the one or more sub spaces based on the data sharing command.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Tae-Soo KIM, Kang-Tae KIM, Doo-Hwan KIM, Chul-Joo KIM, Seong CHOI
  • Publication number: 20200338614
    Abstract: A bent rotor straightening method using low-frequency induction heating and a bent rotor straightening apparatus using the method are proposed. The bent rotor straightening method using low-frequency induction heating according to an embodiment of the present invention includes: calculating a heating speed when a first target temperature for correcting bending of a rotor using low-frequency induction heating is set; maintaining the first target temperature for a heating time determined on the basis of a diameter of the rotor when the first target temperature is reached, when performing primary thermal correction at the heating speed; checking whether a bending amount of the rotor reaches a predetermined critical value in accordance the result of performing the primary thermal correction; and finishing correction of bending of the rotor in accordance with the result of checking the bending amount of the rotor.
    Type: Application
    Filed: March 20, 2019
    Publication date: October 29, 2020
    Inventors: Kwang-Ha PARK, Doo-Young KIM, Hyun-Ku PARK, Jung-Hwan KIM, Yong-Hee JANG, Jun-Su PARK
  • Patent number: 10818621
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member; and an under-bump metal layer including an external connection pad formed on the passivation layer and a plurality of vias connecting the external connection pad and the redistribution layer of the second interconnection member to each other, wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chi
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Hwan Lee, Hyoung Joon Kim, Dae Jung Byun
  • Publication number: 20200335460
    Abstract: A semiconductor package includes a semiconductor chip, an encapsulant, and an interconnection member. The semiconductor chip has connection pads. The encapsulant encapsulates a portion of the semiconductor chip. The interconnection member includes a first insulating layer disposed on the encapsulant and a portion of the semiconductor chip, a redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and the redistribution layer. The redistribution layer is electrically connected to the connection pads of the semiconductor chip, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Hwan LEE, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob OH
  • Publication number: 20200321553
    Abstract: A display device includes a substrate having a display area, in which an image is displayed, and a non-display area, in which no image is displayed. The non-display area is disposed on at least one side of the display area. A plurality of pixels is disposed in the display area. An encapsulation layer is disposed on the plurality of pixels. Adam unit is disposed in the non-display area. The dam unit includes a body part and a plurality of protrusions.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: OH JUNE KWON, IL SANG LEE, DOO HWAN KIM, WOO YONG SUNG, MIN SANG KIM, JIN HWAN JEON, SEUNG YONG SONG
  • Publication number: 20200319763
    Abstract: A method and a device for managing a tab window indicating a group including heterogeneous applications are provided. The method includes outputting a display window comprising at least one or more objects for executing one or more applications on a terminal window, receiving a user input that selects the at least one or more objects and moves the selected at least one or more objects to a region excluding the display window, generating an application group comprising at least one or more applications corresponding to the selected at least one or more objects according to the received user input, and outputting a tab window indicating the generated application group to the terminal window.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 8, 2020
    Inventors: Doo-hwan KIM, Kang-tae KIM, Chul-joo KIM, Tae-soo KIM, Young-seok LEE
  • Publication number: 20200305012
    Abstract: A method for operating a terminal in a wireless communication system is provided. The method includes at least one of transmitting data to and receiving data from a primary cell using a first Radio Frequency (RF) path, and, when a secondary cell is deactivated, operating a second RF path to perform searching and measurement with respect to at least one target cell at a frequency different from a frequency of the primary cell.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Inventors: Doo-Hee LEE, Byung-Wook KIM, Seong-Joon KIM, Jae-Ho SONG, Myung-Hoon YEON, Se-Jin KIM, Kyung-Hwan LEE
  • Patent number: 10776005
    Abstract: A method of controlling a display device including a touch screen is provided. The method includes setting an application execution space having one or more sub spaces in which windows executing applications are arranged, arranging windows corresponding to one or more applications which are being executed in the sub spaces of the set application execution space, displaying a first sub space corresponding to one of the one or more sub spaces on the touch screen, receiving a data sharing command for sharing data included in a first window arranged in the first sub space, and sharing the data to be shared by a second window arranged in a second sub space corresponding to one of the one or more sub spaces based on the data sharing command.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: September 15, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Soo Kim, Kang-Tae Kim, Doo-Hwan Kim, Chul-Joo Kim, Seong Choi
  • Patent number: 10777631
    Abstract: A display device includes: a first substrate including a display area and a non-display area bordering at least a portion of the display area; a first transistor disposed in the display area, and includes a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. A driving circuit is disposed in the non-display area, and includes a second transistor including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. An insulating layer disposed between the source and drain electrodes of the second transistor and the source and drain electrodes of the first transistor over the second transistor; a signal transmission line disposed in the non-display area, and transmitting a signal to the driving circuit; a second substrate facing the first substrate; and a sealant disposed in the non-display area between the first substrate and the second substrate, and overlapping the second transistor.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung-Hwan Cho, Jong Hyun Choi, Doo Hwan Kim, Do Keun Song, Joo Sun Yoon, Min Jae Jeong
  • Patent number: 10779400
    Abstract: A display device includes a flexible substrate including a bending area corresponding to an area at which the display device is bent, and a first area and a second area which is spaced apart from the first area by the bending area, a display element unit disposed in the first area of the flexible substrate; and a buffer member disposed in the bending area of the flexible substrate. The buffer member in the bending area includes: a first buffer member having a first maximum thickness, and a second buffer member having a second maximum thickness which is smaller than the first maximum thickness. Among the first buffer member and the second member, the first buffer member disposed closer to the first area and the second member disposed closer to the second area.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Oh June Kwon, Seung Wook Kwon, Hyo Jeong Kwon, Doo Hwan Kim, Min Sang Kim, Chan Ho Moon, Won Je Cho
  • Publication number: 20200253035
    Abstract: A display device includes a flexible substrate including a bending area corresponding to an area at which the display device is bent, and a first area and a second area which is spaced apart from the first area by the bending area, a display element unit disposed in the first area of the flexible substrate; and a buffer member disposed in the bending area of the flexible substrate. The buffer member in the bending area includes: a first buffer member having a first maximum thickness, and a second buffer member having a second maximum thickness which is smaller than the first maximum thickness. Among the first buffer member and the second member, the first buffer member disposed closer to the first area and the second member disposed closer to the second area.
    Type: Application
    Filed: April 20, 2020
    Publication date: August 6, 2020
    Inventors: Oh June KWON, Seung Wook KWON, Hyo Jeong KWON, Doo Hwan KIM, Min Sang KIM, Chan Ho MOON, Won Je CHO
  • Patent number: 10727434
    Abstract: A display device includes a substrate having a display area, in which an image is displayed, and a non-display area, in which no image is displayed. The non-display area is disposed on at least one side of the display area. A plurality of pixels is disposed in the display area. An encapsulation layer is disposed on the plurality of pixels. A dam unit is disposed in the non-display area. The dam unit includes a body part and a plurality of protrusions. Each of the plurality of protrusions protrudes from the body part.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: July 28, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Oh June Kwon, Il Sang Lee, Doo Hwan Kim, Woo Yong Sung, Min Sang Kim, Jin Hwan Jeon, Seung Yong Song
  • Patent number: 10714437
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh