Abstract: A method of measuring a friction coefficient of a surface of a specimen includes: obtaining surface information of the specimen by using an atomic force microscope (AFM); calculating data of a friction coefficient of the surface of the specimen by using the surface information of the specimen; and mapping the data of the friction coefficient of the specimen to an image. The method of measuring a friction coefficient of a surface of a specimen may prevent a probe part of an atomic force microscope from being worn out and secure high reliability of the friction coefficient value by correcting the atomic force microscope using a specimen to be actually measured and measuring a fiction coefficient at the same time.

Abstract: A method of measuring a friction coefficient of a surface of a specimen includes: obtaining surface information of the specimen by using an atomic force microscope (AFM); calculating data of a friction coefficient of the surface of the specimen by using the surface information of the specimen; and mapping the data of the friction coefficient of the specimen to an image. The method of measuring a friction coefficient of a surface of a specimen may prevent a probe part of an atomic force microscope from being worn out and secure high reliability of the friction coefficient value by correcting the atomic force microscope using a specimen to be actually measured and measuring a fiction coefficient at the same time.

Abstract: The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics.

Abstract: A device and method for etching a wire to manufacture it into a tip for a scanning probe microscope or the like. The wire etching device generates a voltage signal for determining the level of a wire etching voltage, and applies the etching voltage of the level determined depending on the generated voltage signal to the wire to primarily etch it. The wire etching device measures the amount of etching current generated during the primary etching process and controls the level of the voltage signal according to the measured etching current amount so as to control the level of the etching voltage. Then, the device secondarily etches the wire with the level-controlled voltage signal. Therefore, the wire etching device can manufacture the tip while controlling its curvature radius and aspect ratio and reducing the amount of oxide on its surface.