Patents by Inventor Doo-jin Kim
Doo-jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147845Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.Type: ApplicationFiled: December 6, 2023Publication date: May 2, 2024Inventors: Kyoung-Jin PARK, Tae-Jin LEE, Jae-Hoon SHIM, Yoo Jin DOH, Hee-Choon AHN, Young-Kwang KIM, Doo-Hyeon MOON, Jeong-Eun YANG, Su-Hyun LEE, Chi-Sik KIM, Ji-Song JUN
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Publication number: 20240136187Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.Type: ApplicationFiled: October 19, 2023Publication date: April 25, 2024Applicant: Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Geun Young YEOM, Ki Hyun KIM, Ji Eun KANG, Seong Jae YU, You Jin JI, Doo San KIM, Hyun Woo TAK, Yun Jong JANG, Hee Ju KIM, Ki Seok KIM
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Publication number: 20240068727Abstract: An auger-type ice maker includes an ice generator including an ice making tube, an auger installed coaxially within the ice making tube, and a refrigerant pipe wound spirally around and fixed to an outer surface of the ice making tube to be in close contact therewith, an ice compressor connected to an upper portion of the ice generator, the ice compressor configured to compress ice generated by the ice generator, and a fluid reservoir connected to a lower portion of the ice generator, the fluid reservoir configured to retain a fluid to be supplied to the ice generator. A portion of the fluid reservoir is disposed in a position the same as or higher than that of the ice compressor.Type: ApplicationFiled: December 10, 2022Publication date: February 29, 2024Inventors: Doo Ha KIM, Seung Jin SHIN
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Patent number: 11917907Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.Type: GrantFiled: November 22, 2021Date of Patent: February 27, 2024Assignee: Rohm and Haas Electronic Materials Korea Ltd.Inventors: Kyoung-Jin Park, Tae-Jin Lee, Jae-Hoon Shim, Yoo Jin Doh, Hee-Choon Ahn, Young-Kwang Kim, Doo-Hyeon Moon, Jeong-Eun Yang, Su-Hyun Lee, Chi-Sik Kim, Ji-Song Jun
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Patent number: 11127609Abstract: A collet apparatus is provided including a body. A first adsorption unit is connected to the body. A second adsorption unit is connected to the first adsorption unit. The second adsorption unit adsorbs a semiconductor chip. An illumination unit is disposed inside the body, and provides a light to the semiconductor chip adsorbed onto the second adsorption unit to examine the semiconductor chip.Type: GrantFiled: February 14, 2020Date of Patent: September 21, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Jin Kim, Young Sik Kim
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Publication number: 20200402824Abstract: A collet apparatus is provided including a body. A first adsorption unit is connected to the body. A second adsorption unit is connected to the first adsorption unit. The second adsorption unit adsorbs a semiconductor chip. An illumination unit is disposed inside the body, and provides a light to the semiconductor chip adsorbed onto the second adsorption unit to examine the semiconductor chip.Type: ApplicationFiled: February 14, 2020Publication date: December 24, 2020Inventors: Doo Jin KIM, Young Sik KIM
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Patent number: 10714453Abstract: A semiconductor package includes a first semiconductor chip disposed on a substrate. A first upward pad is disposed on an upper surface of the first semiconductor chip. A second semiconductor chip is arranged with an offset above the first semiconductor chip. A first downward pad is disposed on a lower surface of the second semiconductor chip. A first bonding wire connects the first upward pad and the substrate. A first inter-chip connector is interposed between the first upward pad and the first downward pad. A side surface of the second semiconductor chip is arranged above the first upward pad.Type: GrantFiled: June 1, 2018Date of Patent: July 14, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Doo Jin Kim, Young Sik Kim
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Publication number: 20190244932Abstract: A semiconductor package includes a first semiconductor chip disposed on a substrate. A first upward pad is disposed on an upper surface of the first semiconductor chip. A second semiconductor chip is arranged with an offset above the first semiconductor chip. A first downward pad is disposed on a lower surface of the second semiconductor chip. A first bonding wire connects the first upward pad and the substrate. A first inter-chip connector is interposed between the first upward pad and the first downward pad. A side surface of the second semiconductor chip is arranged above the first upward pad.Type: ApplicationFiled: June 1, 2018Publication date: August 8, 2019Inventors: Doo Jin Kim, Young Sik Kim
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Patent number: 9627236Abstract: A substrate treating apparatus is provided which includes housing and a door assembly. The housing provides a process space for treating a substrate therein and has an opening formed at a sidewall thereof. The door assembly opens and closes the opening. The door assembly includes a shutter, a driving member, and a gap maintaining unit. The driving member transfers the shutter to an open position where the shutter faces to the opening and to a blocking position where the shutter gets out of the open position. The gap maintaining unit maintains a constant gap between the shutter and the sidewall.Type: GrantFiled: April 8, 2015Date of Patent: April 18, 2017Assignee: SEMES CO., LTD.Inventors: Sang Jin Lee, Ji Hoon Choi, Doo Jin Kim
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Patent number: 9366078Abstract: Disclosed is a protection device for a blind string. The protection device includes a bellows tube provided in a tubular structure, allowing the blind string to pass through an inner part thereof, and having a length increased or reduced in a longitudinal direction of the blind string, a first module coupled with a lower end portion of the bellows tube and having an inner part to which an end portion of the blind string is locked, and a second module decoupled from the first module at an upper portion of the first module while the bellows tube is interposed between the first module and the second module, such that the bellows tube is folded. The bellows tube has a difference in the thickness of the skin thereof such that the bellows tube is automatically spread due to elasticity thereof when the second module is moved up from the first module.Type: GrantFiled: April 4, 2014Date of Patent: June 14, 2016Inventors: Yeon Seok Choi, Sung Hee Han, Doo Jin Kim
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Patent number: 9324661Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.Type: GrantFiled: March 30, 2015Date of Patent: April 26, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo-Jin Kim, Young-Sik Kim, Tea-Seog Um, Yong-Dae Ha
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Publication number: 20150290685Abstract: A substrate treating apparatus is provided which includes housing and a door assembly. The housing provides a process space for treating a substrate therein and has an opening formed at a sidewall thereof. The door assembly opens and closes the opening. The door assembly includes a shutter, a driving member, and a gap maintaining unit. The driving member transfers the shutter to an open position where the shutter faces to the opening and to a blocking position where the shutter gets out of the open position. The gap maintaining unit maintains a constant gap between the shutter and the sidewall.Type: ApplicationFiled: April 8, 2015Publication date: October 15, 2015Inventors: Sang Jin Lee, Ji Hoon Choi, Doo Jin Kim
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Publication number: 20150279787Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.Type: ApplicationFiled: March 30, 2015Publication date: October 1, 2015Inventors: Doo-Jin KIM, Young-Sik KIM, Tea-Seog UM, Yong-Dae HA
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Publication number: 20150247361Abstract: Disclosed is a protection device for a blind string. The protection device includes a bellows tube provided in a tubular structure, allowing the blind string to pass through an inner part thereof, and having a length increased or reduced in a longitudinal direction of the blind string, a first module coupled with a lower end portion of the bellows tube and having an inner part to which an end portion of the blind string is locked, and a second module decoupled from the first module at an upper portion of the first module while the bellows tube is interposed between the first module and the second module, such that the bellows tube is folded. The bellows tube has a difference in the thickness of the skin thereof such that the bellows tube is automatically spread due to elasticity thereof when the second module is moved up from the first module.Type: ApplicationFiled: April 4, 2014Publication date: September 3, 2015Inventors: Yeon Seok CHOI, Sung Hee Han, Doo Jin Kim
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Patent number: 8672210Abstract: A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.Type: GrantFiled: December 27, 2012Date of Patent: March 18, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Young Sik Kim, Doo Jin Kim, Sung Bok Hong, Ki Taik Oh
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Publication number: 20130056448Abstract: A wire bonding system of a semiconductor package comprising a wire feeding device for positioning a wire at a ball formation position, a laser beam generation unit for generating a carbon dioxide laser beam, and a laser beam guiding unit for directing the laser beam at the ball formation position to form a ball at the wire. Accordingly, moldability and producibility of the ball formed on the wire may be improved. Also, electrical properties at a section of the wire are modified so as to minimize a loop height of the wire.Type: ApplicationFiled: June 28, 2012Publication date: March 7, 2013Applicant: Samsung Electronics Co., Ltd.Inventors: Doo-jin Kim, Sung-bok Hong, Hyung-jin Lee, Young-sik Kim