Abstract: A circuit board includes conductive pads formed in a predetermined arrangement to permit a standardized component package to be properly placed in either of two electrical arrangements, such as an input or output buffer circuit, without separate mounting footprints for each type of electrical component, such as a transistor to be mounted on the footprint. A footprint comprising pads corresponding to the arrangement of terminals on a standardized package is provided with an extension including at least one pad so that a standardized package could be mounted in a rotated position. A circuit board arrangement incorporating the minimum footprint can also include adjacent pairs of pads to be located about the minimum footprint.