Abstract: Electrodes and configurations for electrochemical bioreactor systems that can use electrical energy as a source of reducing power in fermentation or enzymatic reactions and that can use electron mediators and a biocatalyst, such as cells or enzymes, to produce electricity are disclosed. Example electrodes in the system may comprise: (1) neutral red covalently bound to graphite felt; (2) a carboxylated cellulose bound to the graphite felt, neutral red bound to the carboxylated cellulose, NAD+ bound to the graphite felt, and an oxidoreductase (e.g., fumarate reductase) bound to the graphite felt; or (3) a metal ion electron mediator bound to graphite. Various biocatalysts, such as an oxidoreductase, cells of Actinobacillus succinogenes, cells of Escherichia coli, and sewage sludge, are suitable for use in the electrochemical bioreactor system.

Abstract: Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

Abstract: The present invention provides a SAW device package used in filters, duplexers, etc., in particular, which simplifies sealing process for protecting the active area of a SAW device. The SAW device package comprises a wiring substrate, as a package base having connection patterns, having bare chip attaching means. A bare chip is flip-bonded and attached to the attaching means on the wiring substrate while maintaining the airtight condition. A resin molding part covers the top of the bare chip to seal the device. The invention facilitates maintaining an airtight condition of the active area which affects the operational characteristics of the device, and simplifies the manufacturing processes. Furthermore, the improved structure of the wiring substrate blocks the external moisture permeation, thereby enabling the device to better withstand the external changes.

Abstract: The present invention relates to a RF module and a fabrication method thereof, wherein the packaging steps of a SAW component and a module is carried out simultaneously, thereby simplifying the fabrication process and reducing the size of the module. In the invention, a chip component is mounted on a substrate having component-connecting patterns thereon, and a SAW component in a bare chip is flip-bonded to the substrate. Thereafter, the SAW component is selectively laminated with a film and then molded; or the SAW component and the chip component are laminated as a whole and metal-plated, without any molding; or a metal wall is disposed between the substrate and the SAW component and then molded. As a result, this reduces the size of the RF modules, and simplifies the fabrication process, thereby benefiting from a cost-saving effect.

Abstract: A plasma display panel (PDP) driver and PDP gray scale representation method for applying a sustain pulse based subfield arrangement and address light for representation of gray scales and improving representation performance of gray scales. Inverse gamma correction is performed on input image signals so as to represent inverse gamma correction gray scales corresponding to a number of sustain pulses and address light. The inverse gamma correction gray scale is inverted into a subfield based on the number of sustain pulses so as to represent the gray scale through address light and light caused by the number of sustain pulses.

Abstract: Disclosed is a substrate for semiconductor package and a wire bonding method using thereof. The substrate is provided with at least one reference mark on its surface to check a loading position and a shift state of a solder mask. The reference mark is composed of a combination of a reference pattern and a solder mask opening and is positioned in any location on an outer peripheral edge of a die attachment region. The reference mark may take various shapes. A method for checking a solder mask shift using the reference mark includes comparing a design value of the reference pattern and the solder mask opening with the reference pattern and the solder mask opening, which are formed in an actual material. After the solder mask shift is calculated, a wire bonding coordinate is newly constructed in consideration of the solder mask shift. This minimizes the wire bonding error.

Abstract: Disclosed are methods using neutral red to mediate the interconversion of chemical and electrical energy. Electrically reduced neutral red has been found to promote cell growth and formation of reduced products by reversibly increasing the ratio of the reduced:oxidized forms of NAD(H) or NADP(H). Electrically reduced neutral red is able to serve as the sole source of reducing power for microbial cell growth. Neutral red is also able to promote conversion of chemical energy to electrical energy by facilitating the transfer of electrons from microbial reducing power to a fuel cell cathode.