Patents by Inventor Doo San PARK

Doo San PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING APPARATUS AND BONDING METHOD
    Publication number: 20230133340
    Abstract: A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 4, 2023
    Inventors: Myong Soo OH, Doo San PARK, Hyun Chul JIN, Hee Jong SHIN
  • DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220107525
    Abstract: A display device includes: a display panel including a display area and a non-display area; a flexible printed circuit board overlapping and attached to the display panel; a pair of first alignment indicia disposed in the non-display area; a pair of second alignment indicia adjacent to the first alignment indicia; a pair of third alignment indicia disposed on the flexible printed circuit board.
    Type: Application
    Filed: September 2, 2021
    Publication date: April 7, 2022
    Inventors: Myong-Soo OH, Doo San Park, Hyun Chul Jin, Seong Ho Choi
  • BONDING APPARATUS AND BONDING METHOD
    Publication number: 20200144221
    Abstract: A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.
    Type: Application
    Filed: September 17, 2019
    Publication date: May 7, 2020
    Inventors: Myong Soo OH, Doo San PARK, Hyun Chul JIN, Hee Jong SHIN