Patents by Inventor Doohan Lee

Doohan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTIMEDIA FILE PLAYING METHOD AND MULTIMEDIA PLAYER
    Publication number: 20120060093
    Abstract: The present invention relates to a multimedia file playing back method for playing audio and video contents for more effective language learning, and to a multimedia player.
    Type: Application
    Filed: May 13, 2010
    Publication date: March 8, 2012
    Inventor: Doohan Lee
  • Methods for reducing delamination during chemical mechanical polishing
    Patent number: 7244168
    Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 17, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Yufei Chen, Lizhong Sun, Doohan Lee, Wei-Yung Hsu
  • Methods for reducing delamination during chemical mechanical polishing
    Publication number: 20060172664
    Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.
    Type: Application
    Filed: March 30, 2006
    Publication date: August 3, 2006
    Inventors: Yufei Chen, Lizhong Sun, Doohan Lee, Wei-Yung Hsu
  • Methods for reducing delamination during chemical mechanical polishing
    Patent number: 7037174
    Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: May 2, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Yufei Chen, Lizhong Sun, Doohan Lee, Wei-Yung Hsu
  • Methods for reducing delamination during chemical mechanical polishing
    Publication number: 20040116052
    Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.
    Type: Application
    Filed: October 3, 2003
    Publication date: June 17, 2004
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Yufei Chen, Lizhong Sun, Doohan Lee, Wei-Yung Hsu